Hysol FP4583

Hysol FP4583 is a high purity, FC underfill, high lead applications


Applications High Lead Packages DSP, Processor, ASICs Capillary
Over-Molded Flip-Chip Capillary
% Filler 57
Applications Capillary Flow Underfill
CTEa1 (Below Tg) (ppm/°C) 40
Cure Schedule Temperature (°C) (Step 1) 165
Cure Schedule Time (Step 1) 2 hr.
Key Characteristics Flow: High Flow
Modulus GPa 6.9
Tg Dry (°C) 79
Viscosity (Brookfield mPa.s (cP)) 14000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77