Hysol FP4531

Hysol FP4531 is a snap cure fast flow underfill for CSP applications.


Applications CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Flip-Chip on Flex Capillary
Non-Reworkable CSP Underfill, Capillary Flow
% Filler 62
Applications Capillary Flow Underfill
CTEa1 (Below Tg) (ppm/°C) 28
Cure Schedule Temperature (°C) (Step 1) 160
Cure Schedule Time (Step 1) 7 min.
Cure Type Snap Cure
Key Characteristics Flow: High Flow
Modulus GPa 7.6
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 24 hr.
Storage Temperature (°C) -40
Tg Dry (°C) 161
Viscosity (Brookfield mPa.s (cP)) 10000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77