(Known as Hysol QMI536NB )

LOCTITE ABLESTIK QMI536NB has high JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.

Applications Die Attach
Die Attach Adhesives Electrically Non-Conductive
CTEa2 (Above Tg) (ppm/°C) 150
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 30 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Non-Conductive, Conductivity: Thermally Conductive, Shimming
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 12 hr.
Technology Boron Nitride Filled
Viscosity (Brookfield mPa.s (cP)) 10000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77