LOCTITE ECCOBOND CB0260

(Known as Hysol CB0260 )

LOCTITE ECCOBOND CB0260 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.


Applications Fill Materials - Chip-on-Board
% Filler 74
CTEa1 (Below Tg) (ppm/°C) 18
Cure Schedule Temperature (°C) (Step 1) 110
Cure Schedule Temperature (°C) (Step 2) 160
Cure Schedule Temperature (°F) (Step 1) 230
Cure Schedule Temperature (°F) (Step 2) 320
Cure Schedule Time (Step 1) 60 min.
Cure Schedule Time (Step 2) 2 hr.
Gel Time 32 sec.
Key Characteristics Adhesion: High Adhesion, Flow: High Flow
Tg Dry (°C) 145
Viscosity (Brookfield mPa.s (cP)) 40000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77