(Known as Hysol ECCOBOND E8502-1 )

LOCTITE ABLESTIK E 8502-1 is a low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding of stress sensitive components.

Applications Electrically Non-Conductive
Non-Shimming Adhesives
Thermally Conductive Paste
Cure Schedule Temperature (°C) (Step 1) 175
Cure Schedule Time (Step 1) 15 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Thermally Conductive, Modulus: Low Modulus, Shimming: Non-Shimming
Technology Epoxy, Modified
Thermal Conductivity (W/mK) 0.6
Viscosity (Brookfield mPa.s (cP)) 45000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 4.07 x 1013