Hysol ECCOBOND CE3520-3

One component, general conductive, low stress nickel-filled adhesive for mismatched CTE with good shielding properties.


Applications Heat Cure
Other - Flexible
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 30 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive, Isotropic
Physical Form Paste
Viscosity (Brookfield mPa.s (cP)) 73000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 0.02