(Known as Hysol ECCOBOND CA3150 )

Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.

Applications Snap Cure
Cure Schedule Temperature (°C) (Step 1) 130
Cure Schedule Time (Step 1) 10 sec.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive, Isotropic
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 2 days
Shelf Life Time 6 mon.
Viscosity (Brookfield mPa.s (cP)) 13000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) < 0.01