Hysol E1172A

An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.


Applications CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Fill Materials
Non-Reworkable CSP Underfill, Capillary Flow
Applications Capillary Flow Underfill
CTEa1 (Below Tg) (ppm/°C) 27
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 3 min.
Key Characteristics Temperature: Low Temperature, Non-Reworkable
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 48 hr.
Storage Temperature (°C) -40
Tg Dry (°C) 135
Viscosity (Brookfield mPa.s (cP)) 17000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77