Hysol ECCOBOND TE3530

One component, low temperature curing thermally conductive epoxy adhesive.


Applications Non-Shimming Adhesives
Phase Change - Thermal Interface Materials
Thermally Conductive Paste
Cure Schedule Temperature (°C) (Step 1) 100
Cure Schedule Time (Step 1) 30 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Thermally Conductive, Shimming: Non-Shimming, Temperature: Low Temperature
Number of Components 1 Part
Physical Form Paste
Technology Epoxy
Thermal Conductivity (W/mK) 2.3
Viscosity (Brookfield mPa.s (cP)) 60000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 1 x 1015