(Known as ECCOBOND 2332 )

LOCTITE ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C.

Applications Electrically Insulating Adhesives
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 20 min.
Cure Type Heat Cure
Key Characteristics General Purpose, Conductivity: Electrically Non-Conductive
Number of Components 1 Part
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 24 hr.
Shelf Life Time 6 mon.
Viscosity (Brookfield mPa.s (cP)) 70000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77