(Known as Hysol ECCOBOND 104 )

A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.

Applications Epoxy Encapsulants-Potting, Two Component
Two Component
CTEa2 (Above Tg) (ppm/°C) 60
Cure Schedule Temperature (°C) (Step 1) 200
Cure Schedule Time (Step 1) 60 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Non-Conductive
Number of Components 2 Part
Physical Form Paste
Shelf Life Time 6 mon.
Shelf Life °F 77
Shore Hardness Durometer 90
Shore Hardness Scale D
Technology Epoxy
Viscosity (Brookfield mPa.s (cP)) 25000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77