LOCTITE ABLESTIK 958-11

(Known as ABLESTIK ABLEBOND 958-11 )

An electrically insulating adhesive designed to absorb stress produced when bonding large ICs.


Applications General
Agency Approvals / Specifications MIL Standard 883, Method 5011
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 60 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Non-Conductive
Shelf Life Time 12 mon.
Viscosity (Brookfield mPa.s (cP)) 45000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77