LOCTITE ABLESTIK 8700K

(Known as Ablebond 8700K (5.4g) )

LOCTITE ABLESTIK 8700K is a high thermal conductivity, low temperature curing, microelectronics grade adhesive.


Applications Electrically Non-Conductive
Non-Shimming Adhesives
Thermally Conductive Paste
Product Note Contact Customer Service for ordering information.
Agency Approvals / Specifications Method 5011, NASA Outgassing ASTM E 595-77/84/90, MIL Standard 883
CTEa2 (Above Tg) (ppm/°C) 55
Cure Schedule Temperature (°C) (Step 1) 175
Cure Schedule Time (Step 1) 60 min.
Cure Type Heat Cure
Key Characteristics Shimming: Non-Shimming, Performance: High Performance, Conductivity: Thermally Conductive
Number of Components 1 Part
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 30 days
Shelf Life Time 12 mon.
Technology Epoxy
Viscosity (Brookfield mPa.s (cP)) 45000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77