Hysol ECCOBOND S-3869

Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.


Applications Die Attach Adhesives Electrically Non-Conductive
General
Cure Schedule Temperature (°C) (Step 1) 160
Cure Schedule Time (Step 1) 2 hr.
Cure Type Heat Cure
Key Characteristics General Purpose, Conductivity: Electrically Non-Conductive
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 8 days