(Known as Ablestik 8008MD )

LOCTITE ABLESTIK 8008MD is an adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.

Applications Leaded Packages Electrically Conductive Paste
Electrical Conductivity (S/m) 5 x 10-5
Key Characteristics Conductivity: Electrically Conductive
Metal Finish Ag, Au
Moisture Resistance Testing (MRT) L1 / 260°C
Thermal Conductivity (W/mK) 6