LOCTITE ABLESTIK 84-1LMIT1

(Known as Ablebond 84-1LMIT1 )

LOCTITE ABLESTIK 84-1LMIT1 is a fast, low temperature cure electrically & thermally conductive adhesive. Ideally suited for low stress die & component attaching,  this adhesive has a unique silver particle size allowing very thin bond lines.


Applications Electrically Conductive
Heat Cure
Product Note Contact Customer Service for ordering information.
Agency Approvals / Specifications NASA Outgassing ASTM E 595-77/84/90, Method 5011, MIL Standard 883
Cure Schedule Temperature (°C) (Step 1) 130
Cure Schedule Time (Step 1) 4 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 24 hr.
Shelf Life Time 12 mon.
Viscosity (Brookfield mPa.s (cP)) 22000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 0.0001