LOCTITE ABLESTIK 84-1LMI

(Known as ABLEBOND 84-1LMI )

LOCTITE ABLESTIK 84-1LMI enhanced thermal conductivity, fast cure, low stress die & component attach adhesive optimized for GaAs MMIC attach.


Applications Heat Cure
Product Note Contact Customer Service for ordering information.
Cure Schedule Temperature (°C) (Step 1) 150
Cure Schedule Time (Step 1) 60 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive, Isotropic
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 14 days
Shelf Life Time 12 mon.
Viscosity (Brookfield mPa.s (cP)) 30000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 0.0005