LOCTITE ECCOBOND 3005

(Known as ABLESTIK ABLEBOND 3005 )

LOCTITE ECCOBOND 3005 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip BGA reliability.


Applications Lid Attach
Modulus GPa 0.4
Tg Dry (°C) -15
Thermal Conductivity (W/mK) 0.5
Viscosity (Brookfield mPa.s (cP)) 37000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77