(Known as ABLESTIK ABLEBOND 3003 )

LOCTITE ECCOBOND 3003 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip BGA reliability. This material is sensitive to amines, phosphorus, sulfur and tin containing components.

Applications Lid Attach
Cure Schedule Temperature (°C) (Step 1) 100
Cure Schedule Temperature (°C) (Step 2) 150
Cure Schedule Time (Step 1) 90 min.
Cure Schedule Time (Step 2) 60 min.
Modulus GPa 4
Thermal Conductivity (W/mK) 1
Viscosity (Brookfield mPa.s (cP)) 35000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77