(Known as Hysol QMI529HT-5DLT )

LOCTITE ABLESTIK QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices and solder replacement applications.

Applications Die Attach
Die Attach Adhesives Electrically Conductive
Electrically Conductive
Heat Cure
Leaded Packages Electrically Conductive Paste
Thermally Conductive
Thermally Conductive Paste
Cure Schedule Temperature (°C) (Step 1) 185
Cure Schedule Time (Step 1) 60 sec.
Cure Type Heat Cure
Electrical Conductivity (S/m) 4 x 10-5
Key Characteristics Conductivity: Electrically Conductive, Isotropic
Metal Finish Ag, Au
Moisture Resistance Testing (MRT) L1 / 260°C
Physical Form Paste
Pot Life Temperature (°C) 25
Pot Life Temperature (°F) 77
Pot Life Time 24 hr.
Shelf Life Time 12 mon.
Viscosity (Brookfield mPa.s (cP)) 18500
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 0.00004
Warpage (m) <4 <6