LOCTITE 3549 30ML EFD EN/CH
LOCTITE 3549 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved process time.
Loctite® 3549™ for Lead-free Solder Joint Reliability
The experts at Henkel developed a flexible, fluxing underfill material that provides more protection than older generation more rigid materials.
By nature, lead-free solder joints are more brittle than those formed from tin-lead materials. This tendency to fracture from either CTE (coefficient of thermal expansion) mismatches or from severe mechanical stress brought on by shock, drop or vibration presents significant end-product reliability issues. Hand-held devices are subjected to these stresses on a daily basis and one well-known cell phone manufacturer turned to Henkel for help.
The experts at Henkel developed a flexible, fluxing underfill material that provides more protection than older generation more rigid materials. This product not only delivers the thermal cycling protection required for lead-free solder joint reliability, but also provides outstanding drop test fracture resistance for modern hand-held devices manufactured in a lead-free environment.