LOCTITE ABLESTIK QMI3555R

(Known as Hysol QMI 3555R )

LOCTITE ABLESTIK QMI3555R is a no-dry Ag/glass die attach for glass, solder and seamed sealed packages. Very high thermal conductivity with a 450°C temperature resistance for glass-sealed hermetic packages.


Applications Die Attach
Die Attach Adhesives Electrically Conductive