LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.

Applications Heat Cure
Thermally Conductive
Cure Schedule Temperature (°C) (Step 1) 175
Cure Schedule Time (Step 1) 3 min.
Cure Type Heat Cure
Key Characteristics Conductivity: Electrically Conductive, Conductivity: Thermally Conductive, Adhesion: High Adhesion, Isotropic
Physical Form Paste
Substrates Ceramic, Metal, Plastic, Rubber
Viscosity Range (Brookfield mPa.s (cP)) 50000 to 130000
Viscosity Temperature (°C) 25
Viscosity Temperature (°F) 77
Volume Resistivity (Ohm cm) 0.008