Product Highlights

Here you'll find all of the latest news about Henkel's most recently-introduced products, as well as an introduction to their applications and benefits. Click on any of the product links below for additional information.

LOCTITE GC 10 Temperature Stable Solder Paste

This revolutionary solder paste is stable at 26.5°C for one year, which provides benefits throughout the logistics and operations chain.

Conductive Die Attach Films (CDAF)

Consumers continue to demand ever smaller and more capable devices, and Henkel's Conductive Die Attach Film materials are making this ongoing product dynamic possible.

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE® HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies.

TECHNOMELT Low Pressure Molding Solutions

Henkel’s renowned TECHNOMELT® low pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance.

Thermal Management Materials

To address the thermal demands of today’s electronic devices, Henkel has developed a complete portfolio of high-performance, user-friendly products.

LOCTITE Package Level EMI Shielding Solutions

Henkel has developed innovative material technologies that provide effective protection at the package level with compartmental shielding and conformal shielding using simple and scalable processes.