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Low Pressure Molding by TECHNOMELT

Henkel’s renowned TECHNOMELT low pressure molding solutions stand for modern PCB and circuitry protection.  The simplicity of these products is their advantage: because the entire TECHNOMELT operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged.  See how beneficial TECHNOMELT can be implemented in your potting and encapsulating processes.


News

Henkel Expands Partnership with Ellsworth

Henkel Adhesive Technologies’ long-time business relationship with global distributor Ellsworth Adhesives has grown to now include Moldman Systems LLC, which was…

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Henkel forms Partnership with LPMS USA

In a move designed to offer customers greater access to low pressure molding solutions and its award-winning TECHNOMELT materials, Henkel Adhesive Technologies has formed a partnership…

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New Henkel TECHNOMELT Material Tops Category to Win Global Technology Award

Henkel’s efforts to expand its popular TECHNOMELT low pressure molding materials portfolio are paying off…

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Low Pressure Molding Technomelt Industry Solutions

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