Henkel: The choice for today’s advanced semiconductor and electronics assembly markets
In the fast-paced electronics industry, product sophistication and manufacturing techniques evolve quickly. That’s why so many top semiconductor and electronics solutions firms rely on Henkel to deliver the enabling materials they require to produce leading-edge products in an ever-tightening time-to-market window. From wafer-level to board-level through to final assembly, Henkel’s world-renowned Ablestik, Acheson, Emerson & Cuming, Hysol, Loctite® and Multicore product portfolios provide today’s electronics specialists with the proven, reliable and compatible material solutions they need to stay competitive.
Though the majority of the industry has transitioned to lead-free manufacturing, ongoing product advances, device miniaturization and pending halogen-free legislation still pose challenges to even the most technically adept firms. With decades of materials science expertise as its foundation, Henkel is delivering solutions today for tomorrow’s electronics requirements.
Through its line of Acheson conductive inks and coatings, Emerson & Cuming Electrically Conductive and Non-Conductive Adhesives, Multicore Solder Materials, Loctite® Chipbonder adhesives, Hysol CSP Underfills and a wide range of conformal coatings and PCB protection materials, Henkel is leading the way for next-generation product development. No other materials supplier offers the breadth of products, depth of supply chain or global presence that Henkel delivers, giving customers outstanding performance and a low-risk proposition.
Driven by consumers’ relentless push for smaller, yet more powerful and less costly products, semiconductor specialists are constantly pushing the envelope when it comes to device packaging. Thinner die, more complex devices, tighter pitches and reduced dimensions are defining the future of the semiconductor packaging market and Henkel is at the forefront of innovative materials development for next-generation products.
Henkel’s Ablestik brand of die attach adhesives in paste, self-filleting, Wafer Backside Coating (WBC) and film formats are arguably the market’s most well-known die attach products. The semiconductor materials portfolio also includes Hysol wafer-level underfills, mold compounds and encapsulants.
The importance of compatibility
Henkel’s unique material set philosophy ensures that all of our materials are designed with compatibility in mind. Both in process and in the field, Henkel’s products deliver performance, reliability and the peace of mind that comes with 24/7 global support and unmatched engineering expertise.