When it comes to advances in semiconductor packaging technologies and mold compounds, Henkel’s widely acclaimed Hysol line of products is without compare.
Through years of dedicated research and expertise gained from practical, in-field applications, the Hysol portfolio has amassed a full suite of materials solutions for modern semiconductor and electronics packaging processes. From the most innovative die attach materials formulations to liquid encapsulants to package level underfills and low-stress, high strength mold compounds for semiconductor and optoelectronics applications, the products that fall under the Hysol brand are synonymous with reliability, performance, cost effectiveness and ease-of-use.
The Hysol line of products also complies with the latest environmental legislation, delivering “Green” and lead-free compatible materials as the industry moves toward more environmentally-friendly manufacturing.
Emerson & Cuming™ products are now part of the Hysol product line up.