Full Product List (722)

97SC (SAC305) Bar MULTICORE 97SC (SAC305) alloy is designed to be a lead free substitute for tin/lead alloys in most electronics assembly soldering operations.
ABLEBOND 8008NC ABLEBOND 8008NC is a non-conductive snap cure adhesive.
ABLEBOND AAA3300 Self-filleting low modulus adhesive for attaching large die on thin organic substrates.
ABLESTIK 2025D-SF Non-conductive die attach adhesive paste.
ABLESTIK ABLEBOND 2033SC Die attach adhesive is designed for high throughput smart card bonding applications.
ABLESTIK ABLEBOND 2035SC Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
ABLESTIK ABLEBOND 958-8C ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications.
ABLESTIK ABLEFILM ECF563 ABLESTIK ABLEFILM ECF563 adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
Ablestik ABLELUX A4502 Non-conductive photocurable adhesive.
Ablestik ABLELUX LA-1UV Non-conductive photocurable adhesive.
Ablestik ABLETHERM 3188 Lid Attach adhesive.
ABLESTIK ABP-8000 ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto metallic leadframes.
ABLESTIK ATB-100 Series (Film) Single layer adhesive film for mother/daughter die stacking applications.
Ablestik ATB-105A Non Conductive DDF: DAX film (5 µm).
Ablestik ATB-105U Non Conductive DDF: DAX (5 µm)
Ablestik ATB-120US  Non Conductive DDF: DAX (20 µm).
Ablestik ATB-130US  Non Conductive DDF: DAX (30 µm).
Ablestik ATB-F100E ABLESTIK ATB-F100E adhesive film is formulated for use in water lamination processes and preform decal.
Ablestik C130 Ablestik C100 series (C115 and C130) conductive die attach films. Ablestik C130 supplied in 30 micro thickness enables leadframe package manufacturers to realize the advantages film-based products have over traditional paste die attach products. Benefits include the elimination of die tilt, the ability to process thinner die and facilitation of greater bondline control all of which allow for improved processability, higher yields and better long-term reliability.
ABLESTIK ICP-3513 ABLESTIK ICP-3513 electrically conductive one component adhesive is designed for use in automated assembly and in-line curing operations.
ACHESON ELECTRODAG 456C conductive coating ACHESON ELECTRODAG 456C conductive coating.
Acheson ELECTRODAG 503 High temperature silver conductive coating
ACHESON ELECTRODAG 5915 ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits.
Acheson ELECTRODAG 976SSHV Screen printable silver ink for rigid printed circuit boards.
ACHESON Electrodag PE-428 ACHESON Eelectrodag PE-428 is a blend of silver and silver chloride pigment in a resin system designed for printing on flexible substrates. It is suitable for applications using flexographic or rotogravure printing techniques.
ACHESON ELECTRODAG PF-007 Conductive Ink ACHESON ELECTRODAG PF-007 Conductive Ink
Acheson ELECTRODAG PF-845 Screen printable silver ink for PET film. Excellent flexibility and crease resistance.
ACHESON ELECTRODAG PM-500 Conductive Silver Ink Flexible, printable conductive silver ink.
ACHESON ML25240 Green screen printable ink ACHESON ML25240 Green screen printable ink
ACHESON SS24600 Flexible Non-conductive Coating ACHESON SS24600 is a dispersion of finely divided graphite in a thermoplastic resin that rapidly air dries to form a flexible, non-conductive coating.
BONDERITE C-AK 2592 ALKALINE CLEANER Cleaner is a blend of inorganic alkaline components which remove moderate to heavy deposits of mill oil from ferrous substrates
BONDERITE L-GP 503 CONDUCTIVE COATING ACHESON High temperature resistant, silver conductive coating.
BONDERITE L-GP AQUADAG22% GRAPHITE DISPERSION IN WATER Water based graphite coating/additive.
BONDERITE M-PT 3416 Appearance enhancing seal rinse technology
BONDERITE M-PT E-3 Seal rinse technology with enhanced corrosion resistance
BONDERITE S-FN 109 CONDUCTIVE COATING ACHESON Carbon ink for flexographic/rotogravure printing on plastic film (PET, PVC) and paper substrates.
Hysol 3329 Encapsulant-Fill
Hysol DC0114 Die edge coating on flip chips.
HYSOL E1159 HYSOL E1159 reworkable underfill for CSP and BGA.
Hysol E1172A An innovative nonreworkable, capillary flow underfill.
HYSOL ECCOBOND 281 BLK epoxy adhesive HYSOL ECCOBOND 281 BLK epoxy adhesive
Hysol ECCOBOND 8177-0 Heat cure, general conductive, epoxy paste adhesive.
Hysol ECCOBOND C850-6 Strong, hot adhesion and good anti-migration.
Hysol ECCOBOND C990 One-component, general conductive, silver-filled epoxy paste adhesive.
Hysol ECCOBOND CA3152 Dispensible, low temperature, snap cure paste adhesive.
Hysol ECCOBOND CE3103 Heat cure, tin and tin lead compatible, paste adhesive
Hysol ECCOBOND CE3516LCL General conductive paste adhesive with low outgassing.
Hysol ECCOBOND CE3520-3 One component, flexible, nickel-filled paste adhesive
Hysol ECCOBOND CE3535 Fast cure, tin and tin lead compatible, Pb-free alternative to solder
Hysol ECCOBOND D125F Surface mount adhesive designed for high speed dispensing.
HYSOL ECCOBOND DS7300 HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.
Hysol ECCOBOND DX-20C Dielectric paste adhesive
Hysol ECCOBOND E3503-1 Thermally conductive, low temperature heat cure die attach paste adhesive.
HYSOL ECCOBOND G500 HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish.
Hysol ECCOBOND G500HF Electrically non-conductive paste adhesive.
Hysol ECCOBOND G757HF Electrically non-conductive flexible paste adhesive.
HYSOL ECCOBOND G757HF-D HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications.
Hysol ECCOBOND S-3869 Electrically non-conductive paste adhesive.
Hysol ECCOBOND TE3530 One component, low temperature heat cure thermally conductive epoxy paste adhesive.
HYSOL ECCOSEAL 7100 HYSOL ECCOSEAL 7100 adhesive sealant is designed for high throughput display assembly that require protection against humidity and oxygen.
Hysol ECCOSEAL 7200 Display sealant
Hysol EE1068/HD3404 Two component, room temperature cure, encapsulants potting epoxy.
HYSOL EO1086 HYSOL EO1086 is a one-component epoxy encapsulant.
Hysol EO1088 One component encapsulants potting epoxy.
HYSOL ES1000 Black, low cost, flexible, capable of UL94HB, resistant to thermal shock, non-abrasive filled, high impact strength, long pot life
HYSOL ES1301 Long working time, excellent imprognation of fine windings
HYSOL ES1900 Clear, low shrinkage, excellent chemical resistance, strong bond to substrates
HYSOL ES1901 Tough, fast setting, optically clear, low viscosity, room temperature curing, chemical resistant, industrial grade epoxy adhesive potting/encapsulating material.
HYSOL ES1904 HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications.
HYSOL ES2202 Withstands high heat distortion temperature. Excellent chemical resistance, excellent performance under high moisture and humidity.
HYSOL ES2207 High heat distortion temperature, low expansion, dimensionally stable
HYSOL ES2500 Black, fast gel, capable of UL1446 to 180C and UL94HB at 6mm, Easy handling, resilient
HYSOL ES4512HF Non-Conductive Potting Compound Two-part non-conductive potting compound. It is used in the consumer & Industrial market.
Hysol FF2200 Reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach.
Hysol FP0116
Hysol FP4545FC Hysol FP4545FC is a low viscosity version of FP4548FC
Hysol FP4583 Hysol FP4583 is a high purity, FC underfill, high lead applications
Hysol FP4585 Capillary underfill
Hysol FP4652 Hysol FP4652 is a fast cure, low stress version of FP4450 for a large array of packages.
HYSOL FP5000 One part, high purity, laminate packages, non-conductive paste (NCP, CSP, SCSP, SIP) designed for thermal compression bonding process.
Hysol FP5500 NCP for thermal compression bonding
Hysol FP6401 Hysol FP6401 is a high purity, liquid flexible damming material.
Hysol GR2620  Molding compound
Hysol GR2710 Hysol GR2710 is a gold, low stress/non-flame retarded molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors.
Hysol GR2720  Molding compound
Hysol GR360A Hysol GR360A is a green, high-productivity molding compound designed for use in high voltage power applications requiring good electrical stability at high temperature.
HYSOL GR360A-ST-1 HYSOL GR360A-ST-1 is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant. It meets UL 94 V-0 flammability at 6.35 mm.
Hysol GR725LS Green molding compound designed for power SO and surface mount discrete packages (High Power Packages, Power SOIC, Power SSOP).
Hysol GR750  High thermal conductivity-isolated packages, green, designed to improve thermal management for semiconductor devices.
Hysol GR750-SC  Molding compound
Hysol GR750HT-25  Hysol GR750HT-25 is a high thermal conductivity molding compound using fully alumina fillers designed to improve thermal management for semiconductor devices.
Hysol GR828D  Ultra low stress, high adhesion molding compound
Hysol GR828DD Green, semiconductor grade, low stress and high adhesion molding compound. It is especially designed for DPAK/D2PAK packages with Ni and copper/Ag plating lead frames.
Hysol GR869  Molding compound. Surface mount/leadframes (QFP, T/LQFP, TSOP, SOIC)
Hysol GR9810-1  Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled
Hysol GR9851 Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages
Hysol Huawei KL-G900H High adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant.
Hysol Huawei KLG750 Superior adhesion technology to ensure zero delamination performance for SOT and SOIC packages.
Hysol KL-G450H Low stress, green mold compound suitable for SOIC, SOP, SOJ and QFP; contains no bromine, antimony or phosphorus flame retardant.
Hysol KL-G730 HYSOL KL-G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol KL-G730 offers enhanced reliability peformance for T/LQFP packages. KL-G730 meets UL 94 V-0 flammability at 3.175mm thickness.
Hysol MG15F

Anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.

Hysol MG15F-R Hysol MG15F-R is a anhydride cured molding compound designed for use in high voltage power applications.
Hysol MG33F Electronic grade epoxy molding compound
Hysol MG40FS Conventional molding of SMD and SIP networks; gold version MG40F-0526 available
Hysol OTO149-3 Clear glob top material with good adhesion to any substrate.
Hysol PC62 Acrylic conformal coating
Hysol QMI 536UV Used for component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications.
Hysol QMI5030 Unique liquid / paste heat cure die attach adhesive product resulting from blend of thermoset and thermoplastic resins.
HYSOL QMI516IE

 

 

Hysol QMI516LC Hysol QMI516LC is a low temperature cure, general conductive, silver-filled paste adhesive.
Hysol QMI529HT General conductive, die attach adhesive
Hysol QMI536NB-1A3 High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
Hysol STYCAST 2561/CAT 11 Encapsulant-potting
HYSOL STYCAST 2651MM/CATALYST 23LV HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2651MM/CATALYST 9 HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
Hysol STYCAST 2850FT

For high thermal conductivity and low outgassing, consider this encapsulant.

Hysol STYCAST 2850FT"/CAT 11 Heat cure encapsulant-potting.
Hysol STYCAST 2850FT/CAT 23LV Room temperature cure encapsulant-potting
HYSOL STYCAST 2850KT/CATALYST 9 HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies.
HYSOL STYCAST 2850MT-Catalyst 24LV HYSOL STYCAST 2850MT-Catalyst 24LV is a two component, electrically insulating general purpose encapsulant. It
Hysol STYCAST 50500D For protection of wire bonds consider this high purity material as either a dam or a glob top.
Hysol STYCAST A312 A one-component, reworkable unfilled solventless epoxy paste adhesive / underfill encapsulant; fast curing and excellent chemical and heat resistance.
HYSOL STYCAST E1070 HYSOL STYCAST E1070 epoxy encapsulant
Hysol STYCAST E1847 Encapsulant-potting
HYSOL STYCAST EFF15 syntactic foam powder HYSOL STYCAST EFF15 epoxy based free flowing syntactic foam powder.
Hysol STYCAST U2500 Encapsulant
Hysol TRA-BOND FDA16 A medium viscosity, room temperature cure, epoxy resin paste system specifically designed for medical device applications.
HYSOL UF3810 HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications.
Hysol US0146 Hysol US0146 is an unfilled, two component clear amber polyurethane casting system formulated for potting.
HYSOL US1150 HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.
Hysol US5532 Encapsulant potting urethane.
HYSOL UV3001 HYSOL UV3001 is a UV cure adhesive designed for high throughput assembly operations. It can withstand exposure to temperatures as high as 200°C. It is the 4 μm glass rod spacer version of UV3000 adhesive.
HYSOL XUV80260 HYSOL XUV80260 is a UV curable display perimeter sealant for rigid type OLED.
HYSOL XUV80270-1 HYSOL XUV80270-1 is a one-component, non-conductive, UV curable adhesive sealant for high throughput display assembly that require protection against humidity. It is formulated to cure very fast when exposed to UV light, allowing for fast processing of a thin section of material even through ITO coated glass.
LOCTITE 190024LV Single component, UV curable adhesive.
LOCTITE 3118 White image sensor adhesive.
LOCTITE 3119 Cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates.
LOCTITE 3128 Loctite 3128 is an edgebond, thermal cure, black image sensor adhesive.
LOCTITE 3128NH LOCTITE 3128NH edgebond underfill
LOCTITE 3129 Image sensor adhesive.
LOCTITE 3131 Photonics material
LOCTITE 315 Output Room temperature cure adhesive, self-shimming for electrical isolation
Loctite 3192 Loctite® Liquid Optically Clear Adhesives (LOCAs) acrylic
Loctite 3193 Loctite® Liquid Optically Clear Adhesives (LOCAs) acrylic
Loctite 3195 Loctite® Liquid Optically Clear Adhesives (LOCAs) acrylic
Loctite 3195DM Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) acrylic
Loctite 3196 Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) acrylic
LOCTITE 3217 Photonics material
LOCTITE 3220 Photonics material-thermal cure
LOCTITE 3220WH LOCTITE 3220WH is a one component designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. 3220WH is the white colored version of Loctite 3220 adhesive.
LOCTITE 3318 LOCTITE 3318 is suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.
LOCTITE 3318M UV coating for LCD module assembly.
LOCTITE 3323 Has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV fill encapsulants, such as 3327 and 3329. Either combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.
LOCTITE 3327 Has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV dam encapsulants, such as LOCTITE 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.
LOCTITE 3508 Lead-free, one-component epoxy cornerbond adhesive. Applied pre-reflow and allows self-alignment of SMT components during reflow operation. Used for lead-free applications.
LOCTITE 3508NH  Designed to cure during Pb-free solder reflow while allowing self-alignment of IC components.
LOCTITE 3509 One component heat cure epoxy designed for use as board level cornerbond for IC packages such as CSP's and BGA's.
LOCTITE 3513 Reworkable, single-component epoxy used as a underfill for CSP or BGA's.
LOCTITE 3515 One component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation.
LOCTITE 3517 One part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
LOCTITE 3517M One component reworkable underfill.
LOCTITE 3548 Next generation reworkable underfill for thermal and mechanical reliability.
LOCTITE 3549 Next generation reworkable underfill for thermal and mechanical reliability.
Loctite 3551 Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.
LOCTITE 3563 Rapid curing, fast flowing, reworkable, liquid epoxy for use as a capillary flow underfill for packaged IC's
LOCTITE 3593 Loctite 3593 is a nonreworkable, underfill for high mechanical reliability. Fast flow and snap cure for improved process time.
LOCTITE 3609 Used for medium to high speed dispense applications. Excellent green strength for large components.
LOCTITE 3611 Stencil printable/pin transfer product for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3612 Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3616 High speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Ultra low moisture pick-up. Pin transfer capable as well.
LOCTITE 3619 Used for ultra low temperature cure, high speed syringe dispense.
LOCTITE 3621 High performance for ultra high-speed syringe dispense. Recommended product for Dispense Jet.
LOCTITE 3627 High speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Recommended product for DEK Proflow Pumprint process.
LOCTITE 3629C One-component, halogen free, fast cure epoxy formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering.
Loctite 3702 Display sealant
LOCTITE 3705 Edgebond, UV cure adhesive designed for bonding electronics components on PCBs.
LOCTITE 3719 UV acrylic adhesive. (LPD209)
Loctite 3720 ITO/COG overcoat
LOCTITE 3730 Display sealant
LOCTITE 3733 UV acrylic adhesive.
LOCTITE 3736 UV acrylic adhesive.
LOCTITE 3781 UV acrylic adhesive. (LPD181)
LOCTITE 381 Cored Wire
LOCTITE 383 Output LOCTITE 383 Output is a high-strength, room temperature cure adhesive for permanent assemblies.
LOCTITE 384 Loctite 384 Output is a repairable, room temperature cure adhesive utilized for parts subject to disassembly.
LOCTITE 3873 Fast curing, high-conductivity, self-shimming, room temperature cure, paste adhesive for bonding heat-generated devices to thermal spreader.
LOCTITE 3874 Loctite 3874 is a fast-curing, high-conductivity, room temperature cure adhesive for bonding heat-generated devices to thermal spreader without glass beads.
LOCTITE 3888 Room temperature cure adhesive for applications requiring a combination of good mechanical and electrical properties.
LOCTITE 3900 Air-dry acrylic coating designed for small production runs.
LOCTITE 5089 Nuva-Sil Silicone Gasket / Sealant Used for gasketing and sealing applications
Loctite 5192 Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) silicone
Loctite 5192DM Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) silicone
Loctite 5210 Loctite 5210 is an ultra fast curing, non-corrosive RTV silicone designed for potting, wire tracking, selective sealing, vibration dampening and repair/rework applications on PCB's.
Loctite 5290 Loctite 5290 is a solvent-free, low viscosity, UV/moisture cure silicone suited to brush, dip and selective coating.
LOCTITE 5293 Repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.
Loctite 5296 Loctite 5296 is a heat cure silicone that can be applied with brush, dip or spray. High reliability automotive. Clear.
LOCTITE 5404 Self-shimming, heat cure, flexible silicone adhesive paste for demanding parts such as ceramic boards.
LOCTITE 5406M One component flexible RTV silicone engineered to enhance load bearing and shock absorbing properties of the bonded area. It is also used to protect electrical devices from corrosion and mechanical stress such as vibration.
LOCTITE 5421 RTV silicone paste adhesive that provides EMI / RFI shielding on electronic device enclosures.
LOCTITE 7387

Activator designed to initiate the cure of LOCTITE toughened acrylic adhesives such as LOCTITE 315, 383 & 384.

LOCTITE ABLELOC 5500SB tape adhesive LOCTITE ABLELOC 5500SB is a tape adhesive for high speed operations.
LOCTITE ABLESTIK 104 A two component, heat cure, epoxy paste adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.
LOCTITE ABLESTIK 16-1 A two-component, electrically conductive epoxy adhesive designed for general purpose applications. It cures at room temperature while providing a reasonable work life.
LOCTITE ABLESTIK 2000 Electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging.
LOCTITE ABLESTIK 2000B Electrically conductive die attach paste adhesive is designed for Pb-free PBGA and Array BGA packaging. 
LOCTITE ABLESTIK 2025D A hybrid chemistry die attach paste adhesive designed for PBGA.
LOCTITE ABLESTIK 2025DSI Non-conductive low bleed adhesive.
LOCTITE ABLESTIK 2030SC Die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK 2035SC Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK 2035SC-1B1 Non-conductive, one component die attach adhesive was formulated for high throughput die attach applications.
LOCTITE ABLESTIK 2053S Low stress paste adhesive for die-to-substrate applications.
LOCTITE ABLESTIK 2100A An ultra low moisture absorption paste adhesive for lead-free packaging.
LOCTITE ABLESTIK 2106 BIPAX Two component epoxy is designed for high strength structural bonding applications.
LOCTITE ABLESTIK 2106T BIPAX Two component epoxy designed for high strength structural bonding applications.
LOCTITE ABLESTIK 2115 Excellent choice for bonding optical where alignment accuracy is essential.
LOCTITE ABLESTIK 2116 BIPAX A thixotropic, low vapor pressure, room temperature cure, epoxy paste system that passes the NASA Outgassing Specification.
LOCTITE ABLESTIK 2151 Thixotropic two part, room temperature cure, paste adhesive.
LOCTITE ABLESTIK 2158 BIPAX Two part adhesvie that develops strong, durable high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
LOCTITE ABLESTIK 2300 An ultra low moisture absorption, low stress paste adhesive.
LOCTITE ABLESTIK 2310 LOCTITE ABLESTIK 2310 Is a conductive die attach adhesive.
LOCTITE ABLESTIK 2332 One component, low temperature, high strength paste adhesive.
LOCTITE ABLESTIK 2332-17 A solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C.
LOCTITE ABLESTIK 2600AT High thermal conductivity adhesive for thermal management applications
LOCTITE ABLESTIK 2700B Very high thermal conductivity adhesive with excellent bleed performance on gold.
LOCTITE ABLESTIK 2700HT Die attach is desgined for Pb-free array packaging. This adhesive is ideal for small needle dispensing in SIP or MCM die attach applications.
LOCTITE ABLESTIK 281 A one component filled thixotropic paste,
LOCTITE ABLESTIK 282 One component, silk screenable, heat cure, viscous epoxy paste adhesive with high thermal conductivity.
LOCTITE ABLESTIK 285 A highly filled, thermally conductive, thixotropic epoxy paste with low CTE.
LOCTITE ABLESTIK 2902 Designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties.
LOCTITE ABLESTIK 2958 Two part epoxy
LOCTITE ABLESTIK 3230 Electrically conductive die attach adhesive is designed for high reliability package applications.
LOCTITE ABLESTIK 3230A Adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in a variety of package sizes.
LOCTITE ABLESTIK 3290 Snap curable, electrically conductive die attach adhesive designed for lead-free applications where high reliability is a key requirement.
LOCTITE ABLESTIK 342-37 LOCTITE ABLESTIK 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties.
LOCTITE ABLESTIK 3880 General conductive paste adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.
LOCTITE ABLESTIK 45 BK A two component, room temperature curing, variable flexibility epoxy paste adhesive.
LOCTITE ABLESTIK 5020K A high purity adhesive film with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages.
LOCTITE ABLESTIK 5025E Unsupported, epoxy adhesive film
LOCTITE ABLESTIK 550 Supported, high strength adhesive film
LOCTITE ABLESTIK 550K Combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive.
LOCTITE ABLESTIK 551 Flexible unsupported adhesive film is designed to produce tough, resilient bonds between materials with differing coefficients of thermal expansion. It is also useful for bonding thin, flexible materials where good peel strength is required.
LOCTITE ABLESTIK 561 Thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion.
LOCTITE ABLESTIK 561K Supported, thermally conductive dielectric adhesive film.
LOCTITE ABLESTIK 563K Supported, thermally conductive dielectric adhesive film.
LOCTITE ABLESTIK 566K Low temperature cure in a thermally conductive adhesive with excellent flexibility and adhesion.
LOCTITE ABLESTIK 566KAP Heat cure epoxy film.
LOCTITE ABLESTIK 56C-CAT 11 KIT Electrically conductive paste adhesive.
LOCTITE ABLESTIK 57C Two component, room temperature cure, paste adhesive.
LOCTITE ABLESTIK 59C Two component, flexible, low temperature cure paste adhesive.
LOCTITE ABLESTIK 60L Parts AB carbon filled epoxy adhesive LOCTITE ABLESTIK 60L Parts AB is a carbon filled epoxy adhesive with low electrical conductivity designed for general pupose bonding.
LOCTITE ABLESTIK 6200 B-stageable printable paste with low moisture uptake and bleed.
LOCTITE ABLESTIK 6202C-X Die attach adhesive.
LOCTITE ABLESTIK 724-14C One component, low temperature stability, room temperature cure paste adhesive.
LOCTITE ABLESTIK 8006NS Non-conductive oven cure adhesive utilizing wafer backside coating technology.
LOCTITE ABLESTIK 8008HT HIgh thermal conductivity snap cure adhesive utilizing wafer backside coating technology.
LOCTITE ABLESTIK 8008MD Electrically and thermally conductive die-attach.
LOCTITE ABLESTIK 8175 A general conductive, screen printable thermal conductive paste adhesive.
LOCTITE ABLESTIK 8175Q Electrically conductive, paste adhesive designed for solder replacement in microelectronic interconnect applications
LOCTITE ABLESTIK 8177 Screen printable, thermal conductive, paste adhesive.
LOCTITE ABLESTIK 8200C Electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements.
LOCTITE ABLESTIK 8200TI Higher thermal conductivity and optimized adhesion on NiPdAu leadframe.
LOCTITE ABLESTIK 8290 A low stress die attach adhesive suitable for die size <200 mil.
LOCTITE ABLESTIK 8340-O LOCTITE ABLESTIK 8340-O is an electrically conductive die attach adhesive designed for high reliability lead frame packaging applications.
LOCTITE ABLESTIK 8350M This electrically conductive one component die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK 8350R A snap curable die attach adhesive designed to provide anti-delamination and package reliability.
LOCTITE ABLESTIK 8352L A high electrical and thermal conductivity die attach adhesive.
LOCTITE ABLESTIK 8384 Die attach adhesive is designed for smart card applications.
LOCTITE ABLESTIK 8387A LOCTITE ABLESTIK 8387A is a non-conductive die attach adhesive designed for high throughput smart card bonding applications.
LOCTITE ABLESTIK 8387B Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK 8387B-1B2 Non-conductive die attach adhesive.
LOCTITE ABLESTIK 8387BS Single component die attach adhesive designed for high throughput bonding applications.
LOCTITE ABLESTIK 8387BSW LOCTITE ABLESTIK 8387BSW is a single component, non-conductive adhesive designed for high throughput bonding applications.
LOCTITE ABLESTIK 84-1A Adhesive for high volume semiconductor applications, fast cure.
LOCTITE ABLESTIK 84-1LMI Enhanced thermal conductivity, fast cure, general conductive, low stress die & component attach adhesive paste.
LOCTITE ABLESTIK 84-1LMISR3 Is an electrically conductive adhesive is designed for die attach applications. It is a low viscosity and higher thixotropic index version of ABLEBOND 84-1LMIS.
LOCTITE ABLESTIK 84-1LMISR4 Industry standard die attach paste adhesive.
LOCTITE ABLESTIK 84-1LMISR4-S25 Electrically conductive die attach adhesive.
LOCTITE ABLESTIK 84-1LMISR8 Electrically conductive adhesive.
LOCTITE ABLESTIK 84-1LMIT1 A general conductive, low stress thermal conductive paste adhesive.
LOCTITE ABLESTIK 84-3 Electrically non-conductive adhesive pastes for screen printing, dispensing and insulating applications.
LOCTITE ABLESTIK 85-1 A general conductive, gold-filled, high reliability conductive paste adhesive for critical applications.
LOCTITE ABLESTIK 8700E Dispensible, fast curing, general conductive, paste adhesive and meets the requirements of MIL-STD-883, Method 5011.
LOCTITE ABLESTIK 8700K One component, heat cure, dispensible paste adhesive and meets the requirements of MIL-STD-883, Method 5011.
LOCTITE ABLESTIK 8900NC Non-conductive die attach adhesive.
LOCTITE ABLESTIK 927-10 Epoxy adhesive for medical applications.
LOCTITE ABLESTIK 958-11 One component, low stress paste adhesive.
LOCTITE ABLESTIK 965-1L  An electrically conductive epoxy die attach designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion.
LOCTITE ABLESTIK 967-1 Two components, low temperature cure paste adhesive.
LOCTITE ABLESTIK 967-3 Two components, low temperature cure, paste adhesive.
LOCTITE ABLESTIK 969-1 Is an electrically conductive preimidized adhesive designed for semiconductor die attach. It is not recommended for use in hermetic packages.
LOCTITE ABLESTIK A 312-20 One component, flexible, fast cure
LOCTITE ABLESTIK A164-1 Heat cure epoxy paste adhesive
LOCTITE ABLESTIK A316 A series epoxy adhesive and sealant is designed for high throughput assembly operations.
LOCTITE ABLESTIK A401 Good thermal conductivity; good high temperature resistance paste adhesive - bonds well to metal, glass, plastics and ceramics.
LOCTITE ABLESTIK AAA 3131A LOCTITE ABLESTIK AAA 3131A die attach is electrically and thermally conductive recommended for package types which require very low electrical resistivity. It is snap curable or heat curable. It is designed for leadframe applications.
LOCTITE ABLESTIK ABP 2100AC LOCTITE ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging.
LOCTITE ABLESTIK ABP 2501 LOCTITE ABLESTIK ABP 2501 is a die attach formulated for use in high throughput die bonding applications. Used in smart card applications.
LOCTITE ABLESTIK ABP 8060T Electrically die attach paste.
LOCTITE ABLESTIK ABP 8062T LOCTITE ABLESTIK ABP 8062T electrically conductive die attach paste.
LOCTITE ABLESTIK ABP 8064T LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive.
LOCTITE ABLESTIK ABP 8611 Adhesive is designed for die attach applications as well as component attach.
LOCTITE ABLESTIK ABP 8910T LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large die sizes.
LOCTITE ABLESTIK ACP 3122 Anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications.
LOCTITE ABLESTIK ATB 105US Non Conductive DDF: DAX (5 µm).
LOCTITE ABLESTIK ATB 115US  Non Conductive DDF: DAX (15 µm).
LOCTITE ABLESTIK ATB 120 Non-conductive die attach film (20 µm).
LOCTITE ABLESTIK ATB 125US Non Conductive DDF: DAX (25 µm).
LOCTITE ABLESTIK ATB 130 Non-conductive die attach film (30 µm).
LOCTITE ABLESTIK ATB F125E Adhesive Film Die Attach.
LOCTITE ABLESTIK C 850-5A 114 An electrically conductive adhesive.
LOCTITE ABLESTIK C100 Series Conductive die attach films. LOCTITE ABLESTIK C115 supplied in 15 micro thickness enables leadframe package manufacturers to realize the advantages film-based products have over traditional paste die attach products. Benefits include the elimination of die tilt, the ability to process thinner die and facilitation of greater bondline control all of which allow for improved processability, higher yields and better long-term reliability.
LOCTITE ABLESTIK C850-6L A general conductive, low viscosity version of C850-6.
LOCTITE ABLESTIK C860-1J  Electrically conductive paste adhesive.
LOCTITE ABLESTIK C860-1J Electrically conductive paste adhesive.
LOCTITE ABLESTIK CA 3150 Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
LOCTITE ABLESTIK CA3556HF Electrically conductive paste adhesive
LOCTITE ABLESTIK CDF 200 Series Highly filled, conductive die attach film adhesive.
LOCTITE ABLESTIK CDF 800 Series Conductive Die Attach Film Highly filled, conductive die attach adhesive film.
LOCTITE ABLESTIK CE 3103WLV Electrically conductive, tin and tin lead compatible adhesive paste for thin film PV assembly.
LOCTITE ABLESTIK CE 3104WXL Electrically conductive, tin and tin lead compatible, paste adhesive with superior contact resistance stability. Viscosity optimized for screen- and/or stencil-printing.
LOCTITE ABLESTIK CE 3126 Anisotropic adhesive
LOCTITE ABLESTIK CE 3513 Electrically conductive paste adhesive.
LOCTITE ABLESTIK CE 8500 Electrically conductive paste adhesive
LOCTITE ABLESTIK CE3804 Electrically conductive paste adhesive.
LOCTITE ABLESTIK CE3850 One component electrically conductive adhesive is designed for circuit assembly applications.
LOCTITE ABLESTIK CE3920 Dispensible, fast cure, general conductive, Pb-free paste adhesive alternative to solder.
LOCTITE ABLESTIK CF 3350 Adhesive film offers an excellent balance of adhesion strength, electrical and thermal conductivity, and processability. It is especially suited for RF applications.
LOCTITE ABLESTIK CT 5047-2 KIT Two component electrically conductive adhesive designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures.
LOCTITE ABLESTIK CT4042-1 PTA A two component silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in microelectronics applications. It is a lower viscosity version of LOCTITE ABLESTIK CT4042 adhesive.
LOCTITE ABLESTIK DX10 Epoxy base clear type. Low viscosity paste adhesive.
LOCTITE ABLESTIK E 3526 Specially developed for ferrite core bonding applications.
LOCTITE ABLESTIK E 3526 Especially developed for ferrite core bonding applications.
LOCTITE ABLESTIK E 8502-1 This is a low modulus, thermally conductive, heat cure epoxy paste adhesive.
LOCTITE ABLESTIK ECF 506 A flexible film adhesive designed for bonding TCE mismatched materials.
LOCTITE ABLESTIK ECF 550 Adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, LOCTITE ABLESTIK ECF 550 maintains electrical continuity between joints.
LOCTITE ABLESTIK ECF 561E Supported, electrically and thermally conductive adhesive film.
LOCTITE ABLESTIK ECF 564A Ionically clean, fiberglass supported adhesive with very good thermal conductivity.
LOCTITE ABLESTIK ECF 564AHF1004 Heat cure, electrically conductive epoxy film designed for use in hybrid packages where outgassing and ionic contamination must be kept to a minimum.
LOCTITE ABLESTIK ECF 568 Designed for low temperature cure applications. It has superior adhesion to most surfaces.
LOCTITE ABLESTIK FDA 2 A room temperature cure, thixotropic epoxy adhesive designed for medical device applications.
LOCTITE ABLESTIK FDA 2T A room temperature cure, thixotropic epoxy resin paste system specifically designed for medical device applications.
LOCTITE ABLESTIK FS 849-TI LOCTITE ABLESTIK FS 849-TI is a high thermal conductivity adhesive with low electrical resistance. is a high thermal conductivity adhesive with low electrical resistance.
LOCTITE ABLESTIK G 909 One component snap curable electrically conductive paste adhesive.
LOCTITE ABLESTIK GA2W Single component adhesive is designed for CCD/CMOS die attach bonding applications.
LOCTITE ABLESTIK ICP 3535M1 Electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. Designed for applications with small size components (0603, 0402) where no bleeding or wicking is tolerated. It can be applied by stencil printing.
LOCTITE ABLESTIK ICP 3540 Isotropic conductive paste Electrically conductive isotropic conductive paste designed for circuit assembly applications.
LOCTITE ABLESTIK ICP 3556M1 One component, snap curable electrically conductive adhesive.
LOCTITE ABLESTIK ICP 3601 Electrically conductive epoxy paste
LOCTITE ABLESTIK ICP 3801 LOCTITE ABLESTIK ICP 3801 is a one component electically conductive epoxy .
LOCTITE ABLESTIK ICP 4000 Silicone based, electronically conductive adhesive recommended in mounting small components to a variety of interconnect substrates.
LOCTITE ABLESTIK ICP 4001 Silicone paste is specifically desgined for applications where a high degree of flexibility is required.
LOCTITE ABLESTIK ICP 4298 Silicone based electrically conductive adhesive Silicone based, electrically conductive adhesive.
LOCTITE ABLESTIK ICP 4298-S39 One-component silicone based electrically conductive adhesive.
LOCTITE ABLESTIK ICP CB5424 Isotropic conductive paste.
LOCTITE ABLESTIK LHA 2 Adhesive paste for lens holder attach.
LOCTITE ABLESTIK QMI 5200-1X Adhesive film
LOCTITE ABLESTIK QMI3555R A no-dry Ag/glass die attach for glass, solder and seamed sealed packages.
LOCTITE ABLESTIK QMI519 Silver filled conductive adhesive for attachment of integrated circuits and components to metal leadframes advanced substrates.
LOCTITE ABLESTIK QMI529HT Used for component or die attach where very high electrical and thermal conductivity are required.
LOCTITE ABLESTIK QMI529HT-LV LOCTITE ABLESTIK QMI529HT-LV electrically conductive adhesive is designed for die attach applications. It is recommended for use in the attachment integrated circuits and components onto metallic leadframes. 
LOCTITE ABLESTIK QMI529HT-LV Die attach adhesive
LOCTITE ABLESTIK QMI536HT(BORON) A high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging heat cure, die attach filler.
LOCTITE ABLESTIK QMI536NB High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
LOCTITE ABLESTIK QMI536NB-1A5 LOCTITE ABLESTIK QMI536NB-1A5 is a non-conductive die attach paste.
LOCTITE ABLESTIK QMI538NB Non-conductive paste for leadframe applications.
LOCTITE ABLESTIK QMI538NB-1A2 Non-conductive paste for leadframe applications. Very low stress QMI538NB°1A2, 1A3, 1A4 for die sizes greater than 500 x 500 mil. / 13 x 13 mm.
LOCTITE ABLESTIK QMI547 A non-conductive paste for leadframe applications.
LOCTITE ABLESTIK SSP 2020 Silver sintering paste die attach Sintering silver paste die attach.
LOCTITE ABLESTIK SSP-2000 silver sintering paste LOCTITE ABLESTIK SSP-2000 silver sintering paste die attach adhesive for high power devices.
LOCTITE ABLESTIK XCE 3104XL An electrically conductive adhesive with tin compatibility for the stencil and screen print applications.
LOCTITE ABLESTIK XCE 3111 One component, snap curable, electrically conductive paste adhesive.
LOCTITE ABLESTIK XCE 3120 An anisotropic epoxy adhesive designed for high throughput microelectronics assembly applications.
LOCTITE ABLESTIK XCP3302NS ITAR A gold filled, electrically conductive adhesive designed for automatic dispensing operations. It is the no spacer version of XCP3302 adhesive.
LOCTITE ABLESTIK XE 80100 A solventless modified epoxy adhesive that combines low stress with good adhesion on nearly all surfaces and is flexible for mismatched CTE applications. XE80100 is the non-conductive verison of ECCOBOND CE8500 adhesive.
LOCTITE C 11054 E&C Electrically conductive epoxy coating.
LOCTITE C 400 LOCTITE C 400 Flux Cored Wire Halide-free, no-clean, clear residue, increased flux content for improved wetting.
LOCTITE C 502 Solder materials -Cored Wire
LOCTITE C 511 LOCTITE C 511 cored solder wire has been specially formulated to compliment no clean wave and reflow soldering processes.
LOCTITE C 910-3 E&C Epoxy based, nickel plateable termination coating recommended for use in the assembly of passive components.
LOCTITE C110 Is an electrically conductive epoxy coating.
LOCTITE CAT 11 Catalyst used with Stycast resins.
LOCTITE CAT 11 LOCTITE CAT 11 epoxy encapsulant is designed for general potting applications.
LOCTITE CAT 14 Catalyst 14 encapsulant
LOCTITE CAT 15-1 CLEARJ Designed for use with potting and encapsulating resins.
LOCTITE CAT 15-1 LV Designed for use with potting and encapsulating resins.
LOCTITE CAT 23LVJ Catalyst used with Stycast resins.
LOCTITE CAT 24LV Encapsulant designed for general potting applications.
LOCTITE CAT 27-1 Two component, electrically insulating general purpose encapsulant.
LOCTITE CAT 9 LOCTITE CAT 9 epoxy encapsulant designed for general potting applications.
LOCTITE CAT 9 Desgined for potting and encapsulation applications with very small physical spacing between parts.
LOCTITE CP8825 Electrically conducting, acrylic silver coating.
LOCTITE CR 37 LOCTITE CR 37 solder paste is suitable for most assembly processes.
LOCTITE CT 5030 E&C LOCTITE CT 5030 E&C is a conductive ink designed to provide thin coating used in shielding and grounding applications.
LOCTITE D 125 F DR A surface mound adhesive designed for use in high-speed pneumatic and positive displacement dispensers.
LOCTITE DAG 1050 E&C Water based graphite coating/additive.
LOCTITE E 1216M Capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures in a a single reflow cycle. It is used in CSP, BGA and Flip Chip BGA applications. It is specifically formulated to eliminate anhydride-type curing agents for those who prefer to work with anhydride-free products.
LOCTITE E 6752 A one component, low temperature cure, surface mount adhesive that can be applied easily without stringing.
LOCTITE ECCOBOND 3003 LOCTITE ECCOBOND 3003 is a low modulus, high adhesion, ultra-low moisture lid attach material.
LOCTITE ECCOBOND 3005 For large packages and lead-free applications.
LOCTITE ECCOBOND 50500-1 For protection of wire-bonded ICS, consider this flowable material for fills.
LOCTITE ECCOBOND 933 Epoxy encapsulant is designed for encapsulating microelectronic chips.
LOCTITE ECCOBOND CB0260 High performance encapsulant
LOCTITE ECCOBOND CB0260-1 High performance encapsulant
LOCTITE ECCOBOND CB064 High purity, low stress, liquid, self-leveling encapsulant material.
LOCTITE ECCOBOND COB UV8801 LOCTITE ECCOBOND COB UV8801 one component epoxy encapsulant is developed to meet high temperature thermal cycling specifications.
LOCTITE ECCOBOND DP 1002UV LOCTITE ECCOBOND DP 1002UV wire and tab bond lead encapsulant.
LOCTITE ECCOBOND DP 1003UV Wire and tab bond encapsulant and gap filling adhesive.
LOCTITE ECCOBOND DP 1004 LOCTITE ECCOBOND DP 1004 is an epoxy encapsulant used on ink jet applications as a structural die attach.
LOCTITE ECCOBOND DP 1005 Jet dispensable die attach adhesive.
LOCTITE ECCOBOND DP 1012UV One component material designed for use as a wire and tab bond lead encapsulant or damming material.
LOCTITE ECCOBOND DP1000 LOCTITE ECCOBOND DP1000 wirebond encapsulant.
LOCTITE ECCOBOND DS 3318 Fast, UV curable coating and sealant.
LOCTITE ECCOBOND DS 3318LV One-component, fast cure, UV coating and sealant used in LCD module assembly.
LOCTITE ECCOBOND DS 6000 One component adhesive sealant designed for display assembly applications. It exhibits high compatibility with liquid crystal materials.
LOCTITE ECCOBOND DS 6601 Epoxy hybrid for use as the main sealant.
LOCTITE ECCOBOND DS 7301 LOCTITE ECCOBOND DS 7301 adhesive sealant is designed for display assembly applications that require protection against humidity and oxygen.
LOCTITE ECCOBOND DS 7400UV Laminating adhesive and perimeter sealant is desgined for high throughput display assembly that require protection against humidity.
LOCTITE ECCOBOND E 1216 An innovative nonreworkable, capillary flow underfill for CSP, BGA or flip chip devices.
LOCTITE ECCOBOND E 1926 A nonreworkable, wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared to standard first level underfills.
LOCTITE ECCOBOND E 3200 Flexible, low temperature, fast cure.
LOCTITE ECCOBOND E 3239 An adhesive encapsulant used in ink jet applications and other MEMS devices
LOCTITE ECCOBOND EN 3707F LOCTITE ECCOBOND EN 3707F is a no-flow encapsulant.
LOCTITE ECCOBOND EO 0206 LOCTITE ECCOBOND EO 0206 one-component epoxy is designed for use on electronic devices.
LOCTITE ECCOBOND EO1016 UL94V-0 encapsulant for Smartcards and watch IC's. Nonabrasive filler allows for grinding if necessary.
LOCTITE ECCOBOND EO1060 General purpose, low glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
LOCTITE ECCOBOND EO1061 Medium glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
LOCTITE ECCOBOND EO1062 Hysol EO1062 is a general purpose, high glob version of EO1061.
LOCTITE ECCOBOND EO1072 One component, general purpose, high performance epoxy encapsulant with high Tg and low extractable ionics.
LOCTITE ECCOBOND EO1080 Low CTE version of EO1016.
LOCTITE ECCOBOND EO7039 Encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates.
LOCTITE ECCOBOND F 112 This two-part, low viscosity epoxy paste adhesive is designed for use on fiber optic assembly applications.
LOCTITE ECCOBOND F 114 BIPAX Optically clear, low viscosity, room temperature cure, epoxy adhesive.
LOCTITE ECCOBOND F 123 TRAPAX Heat cure epoxy
LOCTITE ECCOBOND F 253 BIPAX Two-part epoxy formulated to change color during the cure process to indicate the cure status.
LOCTITE ECCOBOND FF 2300 No-flow underfill for eutectic and lead-free applications.
LOCTITE ECCOBOND FF 6000 Flux with the additional features and benefits of an epoxy flux.
LOCTITE ECCOBOND FP 5201 NCP for thermal compression bonding
LOCTITE ECCOBOND FP0114 Low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications.
LOCTITE ECCOBOND FP4323 High purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications.
LOCTITE ECCOBOND FP4410HF Low stress fill for potting automated sensor and diodes, high Tg.
LOCTITE ECCOBOND FP4410HF Low stress fill for potting automated sensor and diodes; high Tg.
LOCTITE ECCOBOND FP4450 Industry standard fill material for fills or cavity down BGAs.
LOCTITE ECCOBOND FP4450HF High flow version of FP4450LV using synthetic filler for use in fine wire and low alpha fills applications.
LOCTITE ECCOBOND FP4450LV Low viscosity version of FP4450 (Fills) incorporating cleaner resins.
LOCTITE ECCOBOND FP4451 Industry standard damming material for BGAs.
LOCTITE ECCOBOND FP4451TD Tall dam version of FP4451 for applications requiring a taller, narrower dam. Ionically cleaner also.
LOCTITE ECCOBOND FP4460 General purpose, high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.
LOCTITE ECCOBOND FP4470 High adhesion version of FP4450 for 260°C L3 JEDEC performance.
LOCTITE ECCOBOND FP4526 Epoxy underfill is designed for capillary flow on flip chip applications.
LOCTITE ECCOBOND FP4530 Snap cure flip chip underfill for FC on flex. Designed for gap size down to 25 microns.
LOCTITE ECCOBOND FP4549 Used for fine-pitch flip chip applications, fast flowing, low stress underfill.
LOCTITE ECCOBOND FP4549HT An aluminum nitride-filled version of FP4549 for high thermal applications.
LOCTITE ECCOBOND FP4651 Low viscosity version of FP4650 for a large array of packages.
LOCTITE ECCOBOND FP4654 Package level: MAP low stress encapsulant
LOCTITE ECCOBOND FP4655 High performance encapsulant which can be used alone or as a cavity fill material, or in combination with FP4451 material as part of a dam and fill system. Its low viscosity and fine particle filler size make it ideal for devices with fine pitch wire spacing.
LOCTITE ECCOBOND FP5001 One part with excellent thermal cycling resistance, laminate packages (CSP, SCSP, SIP). Compatible with both constant and pulse heat tools. Recommended for gold / gold assembly joint.
LOCTITE ECCOBOND FP5300 Excellent adhesion strength to 2- and 3-layer flex and Iaminates, as well as misc. assembly. Low temp cure ACP, RFID.
LOCTITE ECCOBOND FP6101 Reworkable underfill for improvement of mechanical reliability. Fast flow and snap cure for improved process time.
LOCTITE ECCOBOND FS 245 BIPAX Thixotropic, two-part adhesive used on staking transistors, diodes, resistors and printed circuit electronics applications.
LOCTITE ECCOBOND LA 3032-78 Encapsulant designed for high throughput assembly operations.
LOCTITE ECCOBOND LUX A4035T LOCTITE ECCOBOND LUX A4035T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices.
LOCTITE ECCOBOND LUX A4083T LOCTITE ECCOBOND LUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices.
LOCTITE ECCOBOND LUX OGR150THTG Photocurable adhesive for wafer level assembly glass lid attach applications.
LOCTITE ECCOBOND MC 723 Bondline control achieved with 75 micron spacers.
LOCTITE ECCOBOND NCP 5208 Non-conductive paste for thermal compression bonding in flip chip to laminate assembly.
LOCTITE ECCOBOND SB 50 Innovative high mechanical reliability and reworkable edgebond, thermal cure material designed for CSP and BGA devices.
LOCTITE ECCOBOND UF 2800A reworkable underfill Reworkable underfill. AVAILABLE FOR PURCHASE AND USE IN CHINA ONLY.
LOCTITE ECCOBOND UF 2800B reworkable underfill Reworkable underfill. ONLY AVAILABLE FOR PURCHASE AND USE IN CHINA
LOCTITE ECCOBOND UF 3037 Reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
LOCTITE ECCOBOND UF 3130 LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
LOCTITE ECCOBOND UF 3537 LOCTITE ECCOBOND UF 3537 is a fast cure underfill used on chip scale packaging.
LOCTITE ECCOBOND UF 3800 High reliability reworkable underfill designed for CSP and BGA applications.
LOCTITE ECCOBOND UF 3808 LOCTITE ECCOBOND UF 3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components.
LOCTITE ECCOBOND UF 8806G LOCTITE ECCOBOND UF 8806G is moisture resistant. For die sizes <25mm. Ultra low alpha emissions.
LOCTITE ECCOBOND UF 8807 One component, high flow liquid underfill encapsulant with superior moisture resistance.
LOCTITE ECCOBOND UF 8826 LOCTITE ECCOBOND UF 8826 is for eutectic high lead low k applications. Medium modulus, low CTE.
LOCTITE ECCOBOND UF 8828 For eutectic, high lead or lead-free packaging. Higher modulus.
LOCTITE ECCOBOND UF 8829 For eutectic, high lead or lead-free packaging. Higher modulus.
LOCTITE ECCOBOND UF 8830 Liquid epoxy underfill for flip chip BGA.
LOCTITE ECCOBOND UF 8840 Liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage.
LOCTITE ECCOBOND UV 3000 A UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as 200°C.
LOCTITE ECCOBOND UV 3000LH LOCTITE ECCOBOND UV 3000LH cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000. It is used in CMOS glass bonding.
LOCTITE ECCOBOND UV 9000 One component, low temperature, UV cure, thermally conductive epoxy adhesive.
LOCTITE ECCOBOND UV 9001 Dual cure sealant and adhesive used in switch leads applications used in consumer and industrial markets.
LOCTITE ECCOBOND UV 9052 A one component, dual cure (UV & moisture) general adhesive designed as a lead encapsulant.
LOCTITE ECCOBOND UV 9060 No-flow UV moisture cure encapsulant.
LOCTITE ECCOBOND UV 9060F LOCTITE ECCOBOND UV9060F no flow, UV cure encapsulant.
LOCTITE ECCOBOND XE 1218 Reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits.
LOCTITE ECCOBOND XUV 9085 Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.
LOCTITE ECCOBOND XUV 9086 A one component UV cure encapsulant used in ink jet applications.
LOCTITE ECI 1001 E&C Screen printable, conductive ink is designed for use on membrane touch switch and other flex circuit applications. It offers excellent balance of flexibility, hardness and adhesion.
LOCTITE ECI 1004 E&C conductive screen printable ink LOCTITE ECI 1004 E&C conductive screen printable ink
LOCTITE ECI 4001 E&C Electrically conductive ink
LOCTITE ECI 7001 E&C Conductive, screen printable ink.
LOCTITE ECI 8001 E&C PTC Electrically conductive screen printable ink Electrically conductive Positive Temperature Coefficient (PTC) screen printable ink.
LOCTITE EDAG 423SS E&C Conductive screen printable ink.
LOCTITE EDAG 437 E&C Copper-based EMI shielding coating designed to provide electromagnetic compatibility (EMC) in electronic equipment housing.
LOCTITE EDAG 440 AS E&C Nickel-based EMI shielding coating designed to give electromagnetic compatibility (EMC) used for electronic equipment.
LOCTITE EDAG 452SS E&C Screen printable, UV curable dielectric ink for plastic film and paper substrates. Excellent flexibility.
LOCTITE EDAG 461SS E&C Screen printable silver ink for ITO treated plastic film.
LOCTITE EDAG 479SS E&C Screen printable silver ink for PET film.
LOCTITE EDAG 5810 E&C LOCTITE EDAG 5810 E&C two component adhesive is designed to cure at ambient temperatures.
LOCTITE EDAG 6017SS E&C Screen printable carbon ink for PET film.
LOCTITE EDAG 725A Screen printable, economical silver ink for PET film. Excellent flexibility.
LOCTITE EDAG 820B E&C Screen printable, silver filled polymer thick film ink.
LOCTITE EDAG 965SS E&C Graphite-based polymer thick film ink for use in the production of low voltage circuitry on polyester.
LOCTITE EDAG EL 411 E&C Screen printable silver ink for ITO treated plastic film. Good fine line printing capability.
LOCTITE EDAG PD 038 E&C Screen printable, UV curable dielectric ink for ITO treated PET film and copper etched circuitry.
LOCTITE EDAG PD 054 E&C LOCTITE EDAG PD 054 E&C electrically conductive silver ink is ideal for applications using solvent or heat sensitive substrates.
LOCTITE EDAG PE 007 E&C Silver/silver chloride ink for flexographic/rotogravure printing on plastic film.
LOCTITE EDAG PE 409 E&C A blend of finely divided silver and silver chloride particles in a thermoplastic resin. It is specially designed for use as an electrode material in polyester film-based medical sensing devices.
LOCTITE EDAG PF 050 E&C Screen printable silver ink for plastic film and paper substrates. Highly conductive, superior fine line printability.
LOCTITE EDAG PF 407A E&C Conductive screen printable ink.
LOCTITE EDAG PF 407C E&C Screen printable carbon ink for plastic film and paper substrates.
LOCTITE EDAG PF 410 E&C Designed for production of flexible circuitry.
LOCTITE EDAG PF 455B E&C Screen printable, UV curable dielectric ink for plastic film. Excellent humidity resistance.
LOCTITE EDAG PF 455BC E&C LOCTITE EDAG PF 455BC E&C is formulated as a crossover dielectric and is compatible with other Electrodag inks.
LOCTITE EDAG PF 465 E&C Insulating and protective ink.
LOCTITE EDAG PF-021 E&C LOCTITE EDAG PF-021 E&C is a UV curable encapsulanting photopolymer.
LOCTITE EDAG PM 404 E&C Screen printable, highly resistive ink for PET film.
LOCTITE EDAG PM 406 E&C Conductive screen printable ink that consists of very finely divided silver particles in a thermoplastic resin. It is designed to be applied by screen printing and can be applied with high coating thicknesses of 10-20 μm.
LOCTITE EDAG PM 460A E&C High speed printing fast drying silver ink. Suitable for applications using flexographic or rotogravure printing techniques.
LOCTITE EDAG PR 406 E&C Carbon polymer thick film ink
LOCTITE EDAG PR 406B E&C Screen printable, carbon ink for rigid printed circuit boards.
LOCTITE EDAG PR 800 PTB E&C Screen printable, economical carbon ink for PET film. Excellent flexibility.
LOCTITE EDAG SP 413 E&C Silver based EMI shielding coating
LOCTITE EO7021 Encapsulant for use in smart card chip module applications.
LOCTITE EO7029 Encapsulant for smart card applications.
LOCTITE EO7038

One-component epoxy potting compound, formulated to protect sensors used in harsh environments, such as automotive applications

LOCTITE HF 108 Halogen-free, no clean, low voiding Pb-free solder paste development product. HF108 also shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including Immersion Ag and OSP copper.
LOCTITE HF 200 Halogen-free, no clean, low voiding Pb-free solder paste.
LOCTITE HYDX-20 LOCTITE HYDX-20 is a high activity, water wash, VOC Free, liquid flux designed for the soldering of the most difficult electronic assemblies.
LOCTITE HYSOL MG40FS-AM Epoxy molding compound delivers outstanding performance and ease of use. It is used in PDIP, SOIC and power discrete applications.
LOCTITE HYSOL CF0593 MG33F-0593 BK A green specially formulated product for use in high volume molding of tantalum capacitors.
LOCTITE HYSOL CF0671 GR2310 Gold Gold / non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors.
LOCTITE HYSOL CG0645 GR735 Thermally conductive molding compound
LOCTITE HYSOL EE0182 EB0625 LOCTITE HYSOL EE0182 EB6025 is a two part, white epoxy casting system having low abrasion and rapid gel features.
LOCTITE HYSOL GR 2220

 LOCTITE HYSOL GR 2220 is a black, non-halogenated conventional molding of leaded components.

LOCTITE HYSOL GR 2310 A gold, non-halogenated molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors.
LOCTITE HYSOL GR 2340 Specially formulated molding compound designed for use in high volume molding of tantalum capacitors.
LOCTITE HYSOL GR 360A

Epoxy molding compound

LOCTITE HYSOL GR 646HV-L1 LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound
LOCTITE HYSOL GR 838LC

Molding compound. Surface mount/leadframes (DPAK/D2PAK).

LOCTITE HYSOL GR15F-1 A green anhydride cured molding compound that contains spherical filler and is designed for high voltage applications. This product has excellent moldability performance with high yield rates.
LOCTITE HYSOL GR15F-1P Molding compound
LOCTITE HYSOL GR15F-A Anhydride cured molding compound is formulated to contain spherical fillers.
LOCTITE HYSOL GR2320 Black/non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors
LOCTITE HYSOL GR2720 A Molding compound
LOCTITE HYSOL GR2811 Epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements to 260°C reflow temperature. GR2811 meets UL 94 V-0 Flammability at 6.35mm thickness.
LOCTITE HYSOL GR360A(ON)-TSHT Epoxy molding compound.
LOCTITE HYSOL GR360A-FC2A Epoxy molding compound.
LOCTITE HYSOL GR640HV Low stress, green molding compound suitable for SOT packages. Provides superior moldability and reliability with lowest cost of ownership.
Loctite Hysol GR640HV-L1  Molding compound
LOCTITE HYSOL GR725LV Is a green, semiconductor grade, low stress and high adhesion molding compound for High Power Packages, Power SOIC, Power SSOP applications.
LOCTITE HYSOL GR828FC1(IMP) BULK An environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant.
LOCTITE HYSOL GR9810-1P A state-of-the-art epoxy molding compound developed to meet the stringent encapsulation requirements of package-on-package PoP, SCSP, and MMC devices.
LOCTITE HYSOL KL 1000-4T LOCTITE HYSOL KL 1000-4T provides the lowest cost of ownership with superior moldability and reliability. Extremely suitable for DIP packages.
LOCTITE HYSOL KL 4500-1 Low stress and high reliability molding compound suitable for TO, SOIC, SSOP and QFP packages, providing high purity and low uranium content. It’s low viscosity properties enables low wire sweep molding with a large operating window.
LOCTITE HYSOL KL 4500-1N Low stress and high reliability molding compound suitable for TO, SOP and SSOP packages.
LOCTITE HYSOL KL 4500-1NT A low stress and high reliability molding compound suitable for SOIC packages.
LOCTITE HYSOL KL 6500S Is a low stress molding compound suitable for SOT/SMX and SOD packages.
LOCTITE HYSOL KL 7000HA Is suitable for QFP, T/LQFP, TSOP packages. Provides ultra low stress, low moisture absorption, high purity and high reliability.
LOCTITE HYSOL KL-1000-3LX HRHJ Provides the lowest cost of ownership with superior moldability and reliability. KL1000-3LX is extremely suitable for bridge, axial and TO packages.
LOCTITE HYSOL KL-1000-3LX P Provides the lowest cost of ownership with superior moldability and reliability. Bridge Package, Axial Package and TO are typical package applications.
LOCTITE HYSOL KL-1000-4TX(NT) Epoxy molding compound delivers outstanding performance and ease of use.
LOCTITE HYSOL KL-3000-FF(H) Epoxy molding compound.
LOCTITE HYSOL KL-5000-HT Has alumina fillers and delivers a high thermal conductive solution for TO-220F/3PF's thermal requirements.
LOCTITE HYSOL KL-G 100 LOCTITE Hysol KL-G 100 is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages.
LOCTITE HYSOL KL-G 500HT Through hole discretes/high thermal conductivity molding compound
LOCTITE HYSOL KL-G 800H High adhesion, ultra low stress, green mold compound suitable for SOT/SMX, TSOP, D/D2PAK and L/TQFP and contains no bromine, antimony or phosphorus flame retardant.
LOCTITE HYSOL KL-G100L CQPW An environmentally friendly, "green" molding compound, containing no bromine, antimony or phosphorous flame retardant.
LOCTITE HYSOL KL-G200 Is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages.
LOCTITE HYSOL KL-G800H CD A green epoxy molding compound suitable for thin leaded packages. It is designed to achieve JEDEC level 2. It is used in SOT and SMX applications.
LOCTITE HYSOL MG 15F Anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.
LOCTITE HYSOL MG 15F-0140

LOCTITE Hysol MG15F-0140 is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.

LOCTITE HYSOL MG 15F-35A An anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperatures.
LOCTITE HYSOL MG 35F

LOCTITE Hysol MG35F is suitable for discrete semiconductors requiring improvement in heat dissipation. Provides high productivity for power transistors.

LOCTITE HYSOL MG15F BULK A white epoxy molding compound specifically formulated for use as an overmold for opto coupler devices.
LOCTITE Hysol MG15F-0140R

LOCTITE Hysol MG15F-0140R is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.

LOCTITE HYSOL MG33F-0520 A specially formulated green product desigmed for use in high volume molding of tantalum capacitors.
LOCTITE HYSOL MG40 BIM 74A BULK Epoxy molding compound for discretes and small signal and small outline transistors. It is only recommended for automatic molding operations.
LOCTITE HYSOL MG40F-4023 Conventional molding of SMD and SIP networks; gold version MG40F-0526 available
LOCTITE HYSOL MG52F-99B NXP High productivity molding compound, designed for high volume encapsulation of surface mount devices.
Loctite Isostrate Loctite Isostrate 2000 is an industry standard electrically insulating phase change material.
LOCTITE ISOSTRATE 2000 LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material.
LOCTITE LDAG EL-006 E&C LOCTITE LDAG EL-006 E&C is formulated to allow ease of blending.
LOCTITE LF 318 96SCAGS88.5 BU LOCTITE LF 318 96SCAGS88.5 BU is a halide-free, no clean lead free, pin testable solder paste.
LOCTITE LF 318 97SCAGS88.5 BU LOCTITE LF 318 97SCAGS88.5 BU is a halide-free, no clean lead free, pin testable solder paste.
LOCTITE LF 318M Solder paste is a halide-free, no clean lead free, pin testable solder paste.
LOCTITE LF 318M LOCTITE LF 318M halide-free, no clean, low voiding Pb-free solder paste.
LOCTITE LF 620 Halide-free, no clean lead free, low voiding solder paste with excellent humidity resistance and broad process window. Suitable for both reflow and printing.
LOCTITE LF 700 A halide-free, no clean lead free solder paste with a broad process window for printing, reflow and humidity resistance.
LOCTITE LF 721 Halide-free, no clean, low voiding Pb free solder paste.
LOCTITE M 2010RS MOD2 E&C A series of one component screen printable resistive carbon inks.
LOCTITE M 2012RS MOD2 E&C A series of one component screen printable resistive carbon inks.
LOCTITE M 2013RS MOD2 E&C One component screen printable resistive carbon inks.
LOCTITE M 2014RS MOD2 E&C One component screen printable resistive carbon ink.
LOCTITE M 2014RS MOD2 E&C One component screen printable resistive carbon ink.
LOCTITE M 2016RS E&C One component, screen printable resistive carbon ink with a resistance of >5 x 105 ohms/sq/25 μm.  It is specifically designed for printing potentiometers and resistors onto printed circuit boards.  With laser trimming a linearity of 1% can be obtained.
LOCTITE M 4100 E&C LOCTITE M 4100 E&C is a one component electroless nickel plateable, conductive polymer.
LOCTITE M 4100 E&C One-component, silver-filled, electroless nickel plateable conductive polymer.
LOCTITE M 7000A BL E&C Screen printable dielectric ink
LOCTITE MCF 800 Designed for the effective removal of all types of soldering process residues from circuit boards, screens, fixtures and equipment.
LOCTITE MF 210 No clean, resin-free, halide-free liquid flux designed for surfaces with poor solderability.
LOCTITE MF 388 Sustained activity in high pre-heats for dual wave and lead-free processes. High PTH fill, low residues. High reliability.
LOCTITE MF 390HR LOCTITE MF 390HR is an halogen free, no clean liquid flux. It is used in the automotive, consumer & industrial electronics and the defense & aerospace markets.
LOCTITE MP 218 MULTICORE MP218 solder paste is a halide-free, no clean tin lead, pin testable solder paste which has excellent humidity resistance and a broad process window both for reflow and printing.
LOCTITE MSC 01 Designed for the stencil cleaning and hand cleaning of process soldering residues. A highly effective cleaner that dries rapidly (fast evaporation).
LOCTITE MULTICORE HF 108RWF LOCTITE MULTICORE HF 108RWF is a halogen-free flux gel for rework processes.
LOCTITE MULTICORE HF 212 Halogen-free solder paste.
LOCTITE MULTICORE HF 250DP LOCTITE MULTICORE HF 250DP is a type 5, halogen-free, lead-free, low-voiding solder paste.
LOCTITE NC-AA WICK Solder wicks
LOCTITE NC-AB WICK LOCTITE NC-AB WICK No clean desoldering wick.
LOCTITE NC-BB WICK LOCTITE NC-BB WICK No Clean desoldering wick
LOCTITE NC-OO WICK Solder wicks
LOCTITE NCI 9001 E&C Non-conductive screen printable dielectric coating. Non-conductive screen printable dielectric coating.
LOCTITE NSWC100

LOCTITE NSWC100 is a non-silicone, water cleanable thermal compound.

LOCTITE Powerstrate Xtreme

LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure.Also available in other versions (PSX-D-LV, PSX-D, PSX-Pm, PSX-PE)

LOCTITE PSX-D

LOCTITE PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Also available in other versions (PSX-D-LV, PSX-Pm, PSX-PE)

LOCTITE PSX-D-LV

LOCTITE PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. (It is also available in other versions (PSX-D, PSX-Pm, PSX-PE)

LOCTITE PSX-Pm

Reworkable and repeatable phase change material. Also available other versions (PSX-D-LV, PSX-D, PSX-PE)

LOCTITE SF 7360

Surface Mount Adhesive Cleaner is a nozzle and dispense machine component cleaner. Excellent for removal of uncured adhesive from the board without causing the adhesive to gel.

LOCTITE SF 7419 PRIMER Halogen-free, non-CFC solvent based surface activator
LOCTITE Silverstrate

LOCTITE Silverstrate has excellent thermal performance, particularly at higher pressures. Typically used on RF devices and SCR's where electrical conductivity is required (silver-filled).

LOCTITE STYCAST 1090 BK LOCTITE STYCAST 1090 BK is a room temperature cure epoxy designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
LOCTITE STYCAST 1090SI A room temperature cure lightweight syntactic encapsulant that is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work..
LOCTITE STYCAST 2017M4 PTA Epoxy heat cure encapsulant developed for lamp type, blue LED.
LOCTITE STYCAST 2651-40 A filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion to a wide variety of substrates and excellent electrical properties. It can be cured with CATALYST 11, CATALYST 9 and CATALYST 23 LV.
LOCTITE STYCAST 2651J Two component, low viscosity, general purpose epoxy encapsulant.
LOCTITE STYCAST 2651MM Designed as a general purpose encapsulant which requires low viscosity and low abrasion. It is especially useful for machine dispensing and for parts that require post molding machining.
LOCTITE STYCAST 276 Epoxy is formulated not to sag or run during cure when applied on loose fitting parts set on vertical or overhead surfaces.
LOCTITE STYCAST 2762 Two component epoxy encapsulant designed for electronic components exposed to harsh environments.
LOCTITE STYCAST 2850 MT Recommended for encapsulation of components that require heat dissipation and thermal shock properties.
LOCTITE STYCAST 2850FT For high thermal conductivity and low outgassing, consider this encapsulant.
LOCTITE STYCAST 2850KT LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high voltage applications where surface arcing or tracking is a concern.
LOCTITE STYCAST 3050 LOCTITE STYCAST 3050 is designed for potting and encapsulation applications.
LOCTITE STYCAST 5952 RD PTA A filled, thermally conductive silicone encapsulant.
LOCTITE STYCAST A 316-48 One component, heat resistant, fast heat cure, epoxy paste adhesive
LOCTITE STYCAST E 1470 B-stageable, fast cure and dispensible.
LOCTITE STYCAST E 2534 FR Heat cure epoxy potting compound that complies with recent demands on environmentally friendly products and does not contain brominated flame retardants.
LOCTITE STYCAST EE 1068 Two component, room temperature cure, encapsulants potting epoxy.
LOCTITE STYCAST EO 10587 LOCTITE STYCAST EO 10587 is a single component epoxy system that cures at 125°C and provides excellent environmental and thermal protection to encapsulated parts.
LOCTITE STYCAST ES 1002 DQ Black, low cost, flexible, room temperature cure, lightweight syntactic encapsulant capable of UL94V-0, non-abrasive filled, long pot life.
LOCTITE STYCAST ES 1004 DQ LOCTITE STYCAST ES 1004 DQ is capable of UL94V-0, stable to 155°C.
LOCTITE STYCAST ES 1902 DQ LOCTITE STYCAST ES 1902 DQ is a clear, room temperature cure, transparent, very fast UV gel, excellent dimensional stability and low viscosity; easy to handle.
LOCTITE STYCAST ES 4322FC epoxy encapsulant LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant
LOCTITE STYCAST HD 3561 Epoxy system is designed for use as a sealant or for potting electronic devices.
LOCTITE STYCAST NX17 A two-component, heat cure, epoxy encapsulant with good adhesion to PPA.
LOCTITE STYCAST NX76 One-component epoxy encapsulant designed for SMD LED. Low CTE and good light dispersion by adding a small amount of filler.
LOCTITE STYCAST PC 18M LOCTITE STYCAST PC 18M is a flexible solvent-based, one-component urethane coating.
LOCTITE STYCAST PC 28-STD LOCTITE STYCAST PC 28-STD is a convenient aerosol packaging, oxygen-cure, urethane, printed circuit board coating system.
LOCTITE STYCAST PC 29M PTB LOCTITE STYCAST PC 29M PTB is a thin-film, urethane printed circuit board coating with good toughness and high flexibility. Note: Not sold in Europe.
LOCTITE STYCAST PC 355-1 Lead-free, transparent, one-component protective urethane varnish system that is dry to the touch in under 30 minutes.
LOCTITE STYCAST PC 355-1FL Flexible thermoplastic varnish formulated to protect and insulate printed wiring boards both on the component and the soldered side.
LOCTITE STYCAST PC 40-UM LOCTITE STYCAST PC 40-UM is a solvent-free, low-viscosity, rapid gel, UV-moisture cure one component acrylate-based conformal coating.
LOCTITE STYCAST PC 40-UMF LOCTITE STYCAST PC 40-UMF conformal coating is specifically formulated to rapidly gel and immobolise when exposed to UV light and then fully cure when exposed to atmospheric moisture, ensuring optimum performance even in shadowed areas.
LOCTITE STYCAST SC 3613 Heat curable, optically clear, high purity, silicone, one-component coating to be applied by brush, dip or flow coating.
LOCTITE STYCAST SC 8001 LOCTITE STYCAST SC 8001 B-Stageable, Electrically Insulating Epoxy Adhesive
LOCTITE STYCAST U 2535 PTB Flexible polyurethane encapsulant.

LOCTITE STYCAST U 7510-1 One component polyurethane
LOCTITE STYCAST US 0154 Encapsulant potting urethane.
LOCTITE STYCAST US 1151 LOCTITE STYCAST US 1151 is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a bed of 8-12 mesh sand increases thermal conductivity while decreasing shrinkage and cost. LOCTITE STYCAST US 1151 can be used to encapsulate electronics for various applications including under-the-hood automotive and marine. The low glass transition temperature means that sensitive compounds are not damaged during low temperature excursions.
LOCTITE STYCAST US 1750 LOCTITE STYCAST US 1750 elastomeric polyurethane, is a waterwhite, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and oxygenerator units.
LOCTITE STYCAST US 2050 LOCTITE STYCAST US 2050 is a quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance.
LOCTITE STYCAST US 2350 LOCTITE STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound.
LOCTITE STYCAST US 5533 PTB LOCTITE STYCAST US 5533 PTB flexible, flame retardant potting compound.
LOCTITE STYCAST UV 7993 One component urethane acrylate
LOCTITE TAF 8800 Thermal Absorbing Film LOCTITE TAF 8800 is a heat absorbing material designed to reduce the skin temperature of mobile electronic devices.
LOCTITE TC 4 Thermally conductive, high temperature silicone thermal grease.
LOCTITE TC 8M Thermally conductive, high temperature silicone thermal grease.
LOCTITE TCF 1000 AL Phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components.
LOCTITE TFN 700B Newtonian tacky flux designed for PoP applications.
LOCTITE TG100 Ultra high performance thermal grease
LOCTITE TTC-LF 32 LOCTITE TTC-LF 32 is a handy, non-abrasive, solder iron tip tinner. Easily wets hot solder irons leaving a brightly tinned tip.
LOCTITE UV8000 Photonics material UV cure
LOCTITE UV8800M UV cure encapsulant for smart card and other COB applications.
LOCTITE WS 300 RWF BU LOCTITE WS 300 RWF BU is a water wash flux system specially formulated with fine-powder lead-free alloys
LOCTITE X 32-10I Low solids synthetic resin liquid flux that meets global demand for ultra low residue medium activity tacky flux.
Macromelt 6211 Good low temperature and adhesion properties
Macromelt MM 6208S Low pressure molding polyamide with good adhesion to plastics.
Macromelt MM Q-5375 Macromelt MM Q-5375 is a moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates.
Macromelt MM6208 Low pressure molding
Macromelt OM 633 Moldable polyamide with good adhesion to plastics and a service temperature up to 125°C such as in an automotive firewall
Macromelt OM 638 Moldable polyamide with service temperature up to 125°C such as in an automotive firewall
Macromelt OM 641 Moldable polyamide where strength and hardness are needed such as in memory sticks and computer connectors
Macromelt OM 646 Macromelt OM 646 is a moldable polyamide where strength and increased hardness are needed such as in memory sticks and computer connectors.
Macromelt OM682 Macromelt OM682 is a moldable polyamide with high temperature resistance for the most demanding high humidity applications such as on the inside of automobile tires.
Minico M2000 RS MOD2 Series ACHESON Minico M2000RS MOD2 are a series of one component screen printable resistive carbon inks.
Multicore DA100 Solder Paste Multicore DA100 is a flux designed for solder die attach paste applications.
Multicore DA101 Die attach solder paste
MULTICORE HF208 MULTICORE HF208 is a halogen-free, no clean, low voiding Pb-free solder paste. It shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including OSP copper.
Multicore Hydro-X Flux Cored Wire MULTICORE Hydro-X cored wire is a high activity, water washable flux with excellent wetting on difficult substrates.
Multicore LF318 No-Clean Solder Paste: Lead-Free Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF318 No-Clean Solder Paste: Lead-Free Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF318 No-Clean Solder Paste: Lead-Free Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding Multicore LF328 is a halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing.
Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding (96SC AGS 88.5) MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing.
MULTICORE LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding (97SC DAP 88.5) MULTICORE LF328 is a halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing.
MULTICORE LF600 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5V) MULTICORE LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability.
MULTICORE LF600 No-Clean Solder Paste: Lead-Free (97SC DAP 88.5V)

MULTICORE LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability.

MULTICORE LF721 RWF MULTICORE LF721 RWF is a reworkable tacky flux designed for a wide range of electronics assembly and rework processes. It is recommended for rework processes in conjunction with MULTICORE LF721.
Multicore LF722 Multicore LF722 is a halide-free, no clean, low voiding Pb-free solder paste.
Multicore LF730 Halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow.
MULTICORE LM100 no clean flux solder paste MULTICORE LM100 no clean flux solder paste
MULTICORE MP200 MULTICORE MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both air and nitrogen. It has been formulated to have increased reflow operating window.
Multicore Spot-On Multicore Spot-On is a temporary solder resistance designed to be used on printed circuit boards prior to soldering and will withstand fluxing and wave soldering operations.
Multicore TFN600

Tacky flux used in handheld devices

Multicore TFN800HF-BLUE PoP tacky flux
Multicore WS300 WS300HV TACKY FLUX Multicore WS300 is a water wash flux system specially formulated with fine-powder lead-free alloys.
STYCAST EO2000HV STYCAST EO2000HV one component, oxide-filled epoxy adhesive used in potting.
TECHNOMELT PA 341 High performance thermoplastic polyamide designed to offer blaze orange color for easy identification of components. It is typically used to encapsulate high voltage modules.
TECHNOMELT PA 6206 Macromelt 6206 is a moldable polyamide with excellent adhesion to tough substrates.
TECHNOMELT PA 6208

Low pressure molding.

TECHNOMELT PA 648

Designed for bonding of cylindrical fitting parts. Cures when confined in the absence of air between close fitting.

TECHNOMELT PA 652

Moldable polyamide where excellent adhesion to plastics and cold temperature flexibility are important such as in an automotive exterior.

TECHNOMELT PA 657 Moldable polyamide where excellent adhesion to plastics and cold temperature flexibility are important such as in an automotive exterior.
TECHNOMELT PA 673 Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood
TECHNOMELT PA 678

Moldable polyamide with good adhesion and high temperature resistance for applications such as in an automotive under-hood.

TECHNOMELT PA 7808 BLACK Low pressure molding polyamide with good adhesion to plastics.
TECHNOMELT PA 7833 Moldable polyamide with good adhesion to plastics and a service temperature up to 125°C such as in an automotive firewall
TECHNOMELT PA 7838 BLACK Moldable polyamide with service temperature up to 125°C such as in an automotive firewall
XCS80091-2 Flexible, general conductive, low stress, low temperature cure, paste adhesive.