Full Product List (734)

97SC (SAC305) Bar MULTICORE 97SC (SAC305) alloy is designed to be a lead free substitute for tin/lead alloys in most electronics assembly soldering operations.
Ablebond 8008NC Ablebond 8008NC is a non-conductive snap cure adhesive.
Ablebond AAA3300 Self-filleting low modulus adhesive for attaching large die on thin organic substrates.
Ablestik 2025D-SF Non-conductive die attach adhesive paste.
Ablestik 8008MD Electrically and thermally conductive die-attach.
ABLESTIK 84-1LMISR4-S25 ABLESTIK 84-1LMISR4-S25 electrically conductive die attach adhesive.
ABLESTIK ABL-2100A ABLESTIK ABL-2100A die attach adhesive is low bleed, low cost, low stress designed for Pb-free array packaging.
ABLESTIK ABLEBOND 16-1 ABLESTIK ABLEBOND 16-1 is a two-component, electrically conductive epoxy adhesive designed for general purpose applications. It cures at room temperature while providing a reasonable work life.
Ablestik ABLEBOND 2000B Electrically conductive die attach paste adhesive is designed for Pb-free PBGA and Array BGA packaging.
Ablestik ABLEBOND 2025D A hybrid chemistry die attach paste adhesive designed for PBGA.
Ablestik Ablebond 2025DSI Ablebond 2025DSI is a non-conductive low bleed adhesive.
Ablestik ABLEBOND 2033SC Die attach adhesive is designed for high throughput smart card bonding applications.
Ablestik ABLEBOND 2035SC Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
Ablestik ABLEBOND 3003 Ablebond 3003 is a low modulus, high adhesion, ultra-low moisture lid attach material.
Ablestik ABLEBOND 3005 Ablebond 3005 is for large packages and lead-free applications.
ABLESTIK ABLEBOND 3230A ABLESTIK ABLEBOND 3230A adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in a variety of package sizes.
Ablestik ABLEBOND 8175Q Electrically conductive, paste adhesive designed for solder replacement in microelectronic interconnect applications
Ablestik ABLEBOND 8177 Screen printable, thermal conductive, paste adhesive.
Ablestik ABLEBOND 8200C Electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements.
Ablestik ABLEBOND 8200TI Ablebond 8200TI is Ablebond 8200C with higher thermal conductivity and optimized adhesion on NiPdAu leadframe.
ABLESTIK ABLEBOND 8340-O ABLESTIK ABLEBOND 8340-O is an electrically conductive die attach adhesive designed for high reliability lead frame packaging applications.
ABLESTIK ABLEBOND 8350M ABLESTIK ABLEBOND 8350M electrically conductive one component die attach adhesive has been formulated for use in high throughput die attach applications.
ABLESTIK ABLEBOND 8387A ABLESTIK ABLEBOND 8387A is a non-conductive die attach adhesive designed for high throughput smart card bonding applications.
Ablestik ABLEBOND 8387B Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
ABLESTIK ABLEBOND 8387B-1B2 Non Conductive Die Attach Adhesive ABLESTIK ABLEBOND 8387B-1B2 non-conductive die attach adhesive.
Ablestik ABLEBOND 8387BS Single component die attach adhesive designed for high throughput bonding applications.
ABLESTIK ABLEBOND 8387BSW ABLESTIK ABLEBOND 8387BSW is a single component, non-conductive adhesive designed for high throughput bonding applications.
Ablestik ABLEBOND 84-1A Adhesive for high volume semiconductor applications, fast cure.
Ablestik ABLEBOND 85-1 A general conductive, gold-filled, high reliability conductive paste adhesive for critical applications.
Ablestik ABLEBOND 8700E Dispensible, fast curing, general conductive, paste adhesive and meets the requirements of MIL-STD-883, Method 5011.
Ablestik ABLEBOND 8700K One component, heat cure, dispensible paste adhesive and meets the requirements of MIL-STD-883, Method 5011.
Ablestik ABLEBOND 8900NC Non-conductive die attach adhesive.
ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ABLESTIK ABLEBOND 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips.
Ablestik ABLEBOND 958-11 One component, low stress paste adhesive.
ABLESTIK ABLEBOND 958-8C ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications.
Ablestik ABLEBOND 967-3 Two components, low temperature cure, paste adhesive.
ABLESTIK ABLEBOND AAA3131A ABLESTIK ABLEBOND AAA3131A die attach is electrically and thermally conductive recommended for package types which require very low electrical resistivity. It is snap curable or heat curable. It is designed for leadframe applications.
Ablestik ABLEBOND FS849-TI Ablebond FS849-TI is a high thermal conductivity adhesive with low electrical resistance.
Ablestik ABLECOAT 8006NS Ablecoat 8006NS (WBC) is a non-conductive oven cure adhesive utilizing wafer backside coating technology.
Ablestik ABLECOAT 8008HT Ablecoat 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology.
Ablestik ABLEFILL UF8806G Ablestik UF8806G is moisture resistant. For die sizes <25mm. Ultra low alpha emissions.
Ablestik ABLEFILL UF8807 One component, high flow liquid underfill encapsulant with superior moisture resistance.
Ablestik ABLEFILL UF8826 Ablestik UF8826 is for eutectic high lead low k applications. Medium modulus, low CTE.
Ablestik ABLEFILL UF8828 Ablestik UF8828 is for eutectic, high lead or lead-free packaging. Higher modulus.
Ablestik ABLEFILL UF8829 Ablestik UF8828 is for eutectic, high lead or lead-free packaging. Higher modulus.
Ablestik ABLEFILM 5020K A high purity adhesive film with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages.
Ablestik ABLEFILM 5025E Unsupported, epoxy adhesive film
Ablestik ABLEFILM 506 A flexible film adhesive designed for bonding TCE mismatched materials.
Ablestik ABLEFILM 550 Supported, high strength adhesive film
Ablestik ABLEFILM 550K Combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive.
ABLESTIK ABLEFILM 551 ABLESTIK ABLEFILM 551 flexible unsupported adhesive film is designed to produce tough, resilient bonds between materials with differing coefficients of thermal expansion. It is also useful for bonding thin, flexible materials where good peel strength is required.
ABLESTIK ABLEFILM 561 ABLESTIK ABLEFILM 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion.
Ablestik ABLEFILM 561K Supported, thermally conductive dielectric adhesive film.
Ablestik ABLEFILM 566K Ablefilm 566K offers low temperature cure in a thermally conductive adhesive with excellent flexibility and adhesion.
Ablestik ABLEFILM 566KAPTON Heat cure epoxy film.
ABLESTIK ABLEFILM ECF550 ABLESTIK ABLEFILM ECF550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, ABLEFILM ECF550 film adhesive maintains electrical continuity between joints.
Ablestik ABLEFILM ECF561E Supported, electrically and thermally conductive adhesive film.
ABLESTIK ABLEFILM ECF563 ABLESTIK ABLEFILM ECF563 adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
Ablestik ABLEFILM ECF564A Ablefilm ECF564A is an ionically clean, fiberglass supported adhesive with very good thermal conductivity.
ABLESTIK ABLEFILM ECF564AHF ABLESTIK ABLEFILM ECF564AHF is a heat cure, electrically conductive epoxy film designed for use in hybrid packages where outgassing and ionic contamination must be kept to a minimum.
Ablestik ABLEFILM ECF568 Ablefilm ECF568 was designed for low temperature cure applications. It has superior adhesion to most surfaces.
Ablestik ABLEFLEX 6200 Ableflex 6200 is a B-stageable printable paste with low moisture uptake and bleed.
Ablestik ABLEFLEX 6202C-X Die attach adhesive.
ABLESTIK ABLELUX A4035T ABLESTIK ABLELUX A4035T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices.
ABLESTIK ABLELUX A4083T ABLESTIK ABLELUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices.
Ablestik ABLELUX A4502 Non-conductive photocurable adhesive.
Ablestik ABLELUX LA-1UV Non-conductive photocurable adhesive.
Ablestik ABLELUX LHA-2 Adhesive paste for lens holder attach.
Ablestik ABLELUX OGR150THTG Photocurable adhesive for wafer level assembly glass lid attach applications.
Ablestik ABLETHERM 3188 Lid Attach adhesive.
ABLESTIK ABP 8611 Die attach adhesive ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach.
Ablestik ABP-2501 Ablestik ABP-2501 is a die attach formulated for use in high throughput die bonding applications. Used in smart card applications.
ABLESTIK ABP-8000 ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto metallic leadframes.
ABLESTIK ABP-8910T ABLESTIK ABP-8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large die sizes.
ABLESTIK ACP-3122 ABLESTIK ACP-3122 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications.
Ablestik ATB-100 Series (Film) Single layer adhesive film for mother/daughter die stacking applications.
Ablestik ATB-105A Non Conductive DDF: DAX film (5 µm).
Ablestik ATB-105U Non Conductive DDF: DAX (5 µm)
Ablestik ATB-105US Non Conductive DDF: DAX (5 µm).
Ablestik ATB-115US Non Conductive DDF: DAX (15 µm).
Ablestik ATB-120 Non-conductive die attach film (20 µm).
Ablestik ATB-120US Non Conductive DDF: DAX (20 µm).
Ablestik ATB-125US Non Conductive DDF: DAX (25 µm).
Ablestik ATB-130 Non-conductive die attach film (30 µm).
Ablestik ATB-130US Non Conductive DDF: DAX (30 µm).
Ablestik ATB-F100E ABLESTIK ATB-F100E adhesive film is formulated for use in water lamination processes and preform decal.
Ablestik C115 Ablestik C100 series (C115 and C130) conductive die attach films. Ablestik C115 supplied in 15 micro thickness enables leadframe package manufacturers to realize the advantages film-based products have over traditional paste die attach products. Benefits include the elimination of die tilt, the ability to process thinner die and facilitation of greater bondline control all of which allow for improved processability, higher yields and better long-term reliability.
Ablestik C130 Ablestik C100 series (C115 and C130) conductive die attach films. Ablestik C130 supplied in 30 micro thickness enables leadframe package manufacturers to realize the advantages film-based products have over traditional paste die attach products. Benefits include the elimination of die tilt, the ability to process thinner die and facilitation of greater bondline control all of which allow for improved processability, higher yields and better long-term reliability.
ABLESTIK ECI-1001 ABLESTIK ECI-1001 screen printable, conductive ink is designed for use on membrane touch switch and other flex circuit applications. It offers excellent balance of flexibility, hardness and adhesion.
ABLESTIK ICP 3556M1 Electrically conductive adhesive ABLESTIK ICP 3556M1 is a one component, snap curable electrically conductive adhesive.
ABLESTIK ICP-3513 ABLESTIK ICP-3513 electrically conductive one component adhesive is designed for use in automated assembly and in-line curing operations.
ABLESTIK ICP-3535M1 ABLESTIK ICP-3535M1 electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. Designed for applications with small size components (0603, 0402) where no bleeding or wicking is tolerated. It can be applied by stencil printing.
ABLESTIK ICP-3801 conductive adhesive ABLESTIK ICP-3801 is a one component electically conductive epoxy .
ABLESTIK ICP4001 ABLESTIK ICP-4001 silicone paste is specifically desgined for applications where a high degree of flexibility is required.
Abletherm 2600AT High thermal conductivity adhesive for thermal management applications
Abletherm 2700B Abletherm 2700B is a very high thermal conductivity adhesive with excellent bleed performance on gold.
ABLETHERM 2700HT ABLESTIK ABLETHERM 2700HT die attach is desgined for Pb-free array packaging. This adhesive is ideal for small needle dispensing in SIP or MCM die attach applications.
Acheson AQUADAG 22 Water based graphite coating/additive.
Acheson DAG 1050 Water based graphite coating/additive.
Acheson ELECTRODAG 109 Carbon ink for flexographic/rotogravure printing on plastic film (PET, PVC) and paper substrates.
ACHESON ELECTRODAG 423SS conductive screen printable ink ACHESON ELECTRODAG 423SS conductive screen printable ink.
Acheson ELECTRODAG 452SS Screen printable, UV curable dielectric ink for plastic film and paper substrates. Excellent flexibility.
ACHESON ELECTRODAG 456C conductive coating ACHESON ELECTRODAG 456C conductive coating.
Acheson ELECTRODAG 461SS Screen printable silver ink for ITO treated plastic film.
Acheson ELECTRODAG 479SS Screen printable silver ink for PET film.
Acheson ELECTRODAG 503 High temperature silver conductive coating
Acheson ELECTRODAG 503-62% High temperature resistant, silver conductive coating.
ACHESON ELECTRODAG 5810 epoxy adhesive ACHESON ELECTRODAG 5810 two component adhesive is designed to cure at ambient temperatures.
ACHESON ELECTRODAG 5915 ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits.
Acheson ELECTRODAG 6017SS Screen printable carbon ink for PET film.
Acheson ELECTRODAG 725A (6S-54) Screen printable, economical silver ink for PET film. Excellent flexibility.
Acheson ELECTRODAG 820B Screen printable, silver filled polymer thick film ink.
Acheson ELECTRODAG 976SSHV Screen printable silver ink for rigid printed circuit boards.
Acheson ELECTRODAG EL-411 Screen printable silver ink for ITO treated plastic film. Good fine line printing capability.
Acheson ELECTRODAG PD-038 Screen printable, UV curable dielectric ink for ITO treated PET film and copper etched circuitry.
ACHESON ELECTRODAG PD-054 conductive Ink ACHESON ELECTRODAG PD-054 electrically conductive silver ink is ideal for applications using solvent or heat sensitive substrates.
Acheson ELECTRODAG PE-007 Silver/silver chloride ink for flexographic/rotogravure printing on plastic film.
ACHESON Electrodag PE-409 ACHESON Electrodag PE-409 is a blend of finely divided silver and silver chloride particles in a thermoplastic resin. It is specially designed for use as an electrode material in polyester film-based medical sensing devices.
ACHESON Electrodag PE-428 ACHESON Eelectrodag PE-428 is a blend of silver and silver chloride pigment in a resin system designed for printing on flexible substrates. It is suitable for applications using flexographic or rotogravure printing techniques.
ACHESON ELECTRODAG PF-007 Conductive Ink ACHESON ELECTRODAG PF-007 Conductive Ink
Acheson ELECTRODAG PF-050 Screen printable silver ink for plastic film and paper substrates. Highly conductive, superior fine line printability.
Acheson ELECTRODAG PF-407A Conductive screen printable ink.
Acheson ELECTRODAG PF-407C Screen printable carbon ink for plastic film and paper substrates.
ACHESON ELECTRODAG PF-410 conductive Ink ACHESON ELECTRODAG PF-410 is designed for production of flexible circuitry.
Acheson ELECTRODAG PF-455B Screen printable, UV curable dielectric ink for plastic film. Excellent humidity resistance.
ACHESON ELECTRODAG PF-455BC Dielectric Ink ACHESON ELECTRODAG PF-455BC is formulated as a crossover dielectric and is compatible with other Electrodag inks.
ACHESON ELECTRODAG PF-465 Dielectric Ink ACHESON ELECTRODAG PF-465 ink is and insulating and protective ink.
Acheson ELECTRODAG PF-845 Screen printable silver ink for PET film. Excellent flexibility and crease resistance.
Acheson ELECTRODAG PM-404 Screen printable, highly resistive ink for PET film.
ACHESON ELECTRODAG PM-406 ACHESON ELECTRODAG PM-406 is a conductive screen printable ink that consists of very finely divided silver particles in a thermoplastic resin. It is designed to be applied by screen printing and can be applied with high coating thicknesses of 10-20 μm.
ACHESON ELECTRODAG PM-500 Conductive Silver Ink Flexible, printable conductive silver ink.
Acheson ELECTRODAG PR-406B Screen printable, carbon ink for rigid printed circuit boards.
Acheson ELECTRODAG PR-800 Screen printable, economical carbon ink for PET film. Excellent flexibility.
Acheson ELECTRODAG PR406 Carbon polymer thick film ink
ACHESON LUMIDAG EL-006 ACHESON LUMIDAG EL-006 is formulated to allow ease of blending.
ACHESON MINICO M2010RS MOD 2 ACHESON MINICO M2000RS MOD2 are a series of one component screen printable resistive carbon inks.
ACHESON MINICO M2012RS MOD 2 MINICO M2000RS MOD2 are a series of one component screen printable resistive carbon inks.
ACHESON MINICO M2013RS MOD2 MINICO M2000 RS MOD 2 are a series of one component screen printable resistive carbon inks.
ACHESON MINICO M2014RS MOD 2 MINICO M2000RS MOD2 are a series of one component screen printable resistive carbon inks.
ACHESON MINICO M2015RS MOD 2 MINICO M2000RS MOD2 are a series of one component screen printable resistive carbon inks.
ACHESON MINICO M2016RS
ACHESON MINICO M4100RS ACHESON MINICO M4100RS is a one-component, silver-filled, electroless nickel plateable conductive polymer.
Acheson MINICO M7000 BLUE A Screen printable dielectric ink
ACHESON ML25240 Green screen printable ink ACHESON ML25240 Green screen printable ink
ACHESON SS24600 Flexible Non-conductive Coating ACHESON SS24600 is a dispersion of finely divided graphite in a thermoplastic resin that rapidly air dries to form a flexible, non-conductive coating.
Aquence 2592 Alkaline Cleaner Cleaner is a blend of inorganic alkaline components which remove moderate to heavy deposits of mill oil from ferrous substrates
Aquence 3416 Reaction Rinse Appearance enhancing seal rinse technology
Aquence E3 Reaction Rinse Seal rinse technology with enhanced corrosion resistance
E&C STYCAST 5952 A/B thermally conductive silicone encapsulant E&C STYCAST 5952 A/B is a filled, thermally conductive silicone encapsulant.
ECCOBOND DS7400UV Eccobond DS7400UV laminating adhesive and perimeter sealant is desgined for high throughput display assembly that require protection against humidity.
ECCOBOND UF 3130 underfill LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
Eccobond UV9001 Eccobond UV9001 is a dual cure sealant and adhesive used in switch leads applications used in consumer and industrial markets.
Electrodag 437 Electrodag 437 is a copper-based EMI shielding coating designed to provide electromagnetic compatibility (EMC) in electronic equipment housing.
Electrodag 440 AS Electrodag 440 AS is a nickel-based EMI shielding coating designed to give electromagnetic compatibility (EMC) used for electronic equipment.
Electrodag 965SS Electrodag 965SS is a graphite-based polymer thick film ink for use in the production of low voltage circuitry on polyester.
Electrodag PF-021 UV Curable Encapsulant Electrodag PF-021 is a UV curable encapsulanting photopolymer.
Electrodag PM-460A Electrodag PM-460A is a high speed printing fast drying silver ink. Suitable for applications using flexographic or rotogravure printing techniques.
Electrodag SP-413 Electrodag SP-413 is a silver based EMI shielding coating
HYSOL 190024LV HYSOL 190024LV single component, UV curable adhesive.
Hysol 3318LV One component UV coating and sealant Hysol 3318 LV is a one-component, fast cure, UV coating and sealant used in LCD module assembly.
Hysol 3329 Encapsulant-Fill
HYSOL 3508NH HYSOL 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components.
Hysol CB0260 High performance encapsulant
Hysol CB0260-1 High performance encapsulant
Hysol CB064/FP4653 High purity, low stress, liquid, self-leveling encapsulant material.
Hysol CF3350 Hysol CF3350 adhesive film offers an excellent balance of adhesion strength, electrical and thermal conductivity, and processability. It is especially suited for RF applications.
Hysol DC0114 Die edge coating on flip chips.
Hysol DP1004 Hysol DP1004 is an epoxy encapsulant used on ink jet applications as a structural die attach.
HYSOL DS6000 HYSOL DS6000 is a one component adhesive sealant designed for display assembly applications. It exhibits high compatibility with liquid crystal materials.
HYSOL DS7301 HYSOL DS7301 adhesive sealant is designed for display assembly applications that require protection against humidity and oxygen.
Hysol E-3239 Hysol E-3239 is an adhesive encapsulant used in ink jet applications and other MEMS devices
HYSOL E1159 HYSOL E1159 reworkable underfill for CSP and BGA.
Hysol E1172A An innovative nonreworkable, capillary flow underfill.
Hysol E1216 An innovative nonreworkable, capillary flow underfill for CSP, BGA or flip chip devices.
HYSOL E1216M HYSOL E1216M capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures in a a single reflow cycle. It is used in CSP, BGA and Flip Chip BGA applications. It is specifically formulated to eliminate anhydride-type curing agents for those who prefer to work with anhydride-free products.
Hysol ECCOBOND 104 A two component, heat cure, epoxy paste adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.
Hysol ECCOBOND 2332 One component, low temperature, high strength paste adhesive.
HYSOL ECCOBOND 2332-17 HYSOL ECCOBOND 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C.
HYSOL ECCOBOND 281 BLK epoxy adhesive HYSOL ECCOBOND 281 BLK epoxy adhesive
HYSOL ECCOBOND 281 epoxy paste HYSOL ECCOBOND 281 is a one component filled thixotropic paste,
Hysol ECCOBOND 282 One component, silk screenable, heat cure, viscous epoxy paste adhesive with high thermal conductivity.
Hysol ECCOBOND 285 A highly filled, thermally conductive, thixotropic epoxy paste with low CTE.
Hysol ECCOBOND 45-Catalyst 15 A two component, room temperature curing, variable flexibility epoxy paste adhesive.
Hysol ECCOBOND 56C/CAT 11 Electrically conductive paste adhesive.
Hysol ECCOBOND 57C Two component, room temperature cure, paste adhesive.
Hysol ECCOBOND 59C Two component, flexible, low temperature cure paste adhesive.
Hysol ECCOBOND 8177-0 Heat cure, general conductive, epoxy paste adhesive.
Hysol ECCOBOND A312-20 One component, flexible, fast cure
Hysol ECCOBOND A316-48 One component, heat resistant, fast heat cure, epoxy paste adhesive
Hysol ECCOBOND C850-6 Strong, hot adhesion and good anti-migration.
Hysol ECCOBOND C860-1J Electrically conductive paste adhesive.
Hysol ECCOBOND C990 One-component, general conductive, silver-filled epoxy paste adhesive.
Hysol ECCOBOND CA3150 Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
Hysol ECCOBOND CA3152 Dispensible, low temperature, snap cure paste adhesive.
Hysol ECCOBOND CE3103 Heat cure, tin and tin lead compatible, paste adhesive
Hysol ECCOBOND CE3103WLV Electrically conductive, tin and tin lead compatible adhesive paste for thin film PV assembly.
Hysol ECCOBOND CE3104WXL Electrically conductive, tin and tin lead compatible, paste adhesive with superior contact resistance stability. Viscosity optimized for screen- and/or stencil-printing.
Hysol ECCOBOND CE3126 Anisotropic adhesive
Hysol ECCOBOND CE3513 Electrically conductive paste adhesive.
Hysol ECCOBOND CE3516LCL General conductive paste adhesive with low outgassing.
Hysol ECCOBOND CE3520-3 One component, flexible, nickel-filled paste adhesive
Hysol ECCOBOND CE3535 Fast cure, tin and tin lead compatible, Pb-free alternative to solder
Hysol ECCOBOND CE8500 Electrically conductive paste adhesive
HYSOL ECCOBOND CT5047-2 A/B HYSOL ECCOBOND CT5047-2 A/B is a two component electrically conductive adhesive designed to make electrical connections where hot soldering is impractical or to make electrical connections to conductive plastics at locations which cannot be subjected to high temperatures.
Hysol ECCOBOND D125F Surface mount adhesive designed for high speed dispensing.
HYSOL ECCOBOND DS7300 HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.
Hysol ECCOBOND DX-20C Dielectric paste adhesive
Hysol ECCOBOND E1470 B-stageable, fast cure and dispensible.
Hysol ECCOBOND E3200 Flexible, low temperature, fast cure.
Hysol ECCOBOND E3503-1 Thermally conductive, low temperature heat cure die attach paste adhesive.
HYSOL ECCOBOND E3526 HYSOL ECCOBOND E3526 is specially developed for ferrite core bonding applications.
HYSOL ECCOBOND E3526-5 HYSOL ECCOBOND E3526-5 is especially developed for ferrite core bonding applications.
Hysol ECCOBOND E6752 A one component, low temperature cure, surface mount adhesive that can be applied easily without stringing.
Hysol ECCOBOND E8502-1 This is a low modulus, thermally conductive, heat cure epoxy paste adhesive.
HYSOL ECCOBOND G500 HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish.
Hysol ECCOBOND G500HF Electrically non-conductive paste adhesive.
Hysol ECCOBOND G757HF Electrically non-conductive flexible paste adhesive.
HYSOL ECCOBOND G757HF-D HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications.
Hysol ECCOBOND G909 One component snap curable electrically conductive paste adhesive.
Hysol ECCOBOND S-3869 Electrically non-conductive paste adhesive.
Hysol ECCOBOND TE3530 One component, low temperature heat cure thermally conductive epoxy paste adhesive.
Hysol ECCOBOND UV9000 Light Cure Adhesive One component, low temperature, UV cure, thermally conductive epoxy adhesive.
Hysol ECCOBOND UV9085 Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.
Hysol ECCOBOND XCE3111 One component, snap curable, electrically conductive paste adhesive.
HYSOL ECCOCOAT C110-5 HYSOL ECCOCOAT C110-5 is an electrically conductive epoxy coating.
HYSOL ECCOCOAT C910-3 termination coating HYSOL ECCOCOAT C910-3 epoxy based, nickel plateable termination coating is recommended for use in the assembly of passive components.
HYSOL ECCOCOAT CT5030 Catalyst B97 conductive ink HYSOL ECCOCOAT CT5030 Catalyst B97 is a conductive ink designed to provide thin coating used in shielding and grounding applications.
Hysol ECCOCOAT PC355-1 Lead-free, transparent, one-component protective urethane varnish system that is dry to the touch in under 30 minutes.
HYSOL ECCOCOAT PC355-1FL conformal coating HYSOL ECCOCOAT PC355-1FL flexible thermoplastic varnish is formulated to protect and insulate printed wiring boards both on the component and the soldered side.
Hysol ECCOCOAT SC3613 Heat curable, optically clear, high purity, silicone, one-component coating to be applied by brush, dip or flow coating.
Hysol ECCOCOAT U7510-1 One component polyurethane
Hysol ECCOCOAT UV7993 One component urethane acrylate
HYSOL ECCOSEAL 7100 HYSOL ECCOSEAL 7100 adhesive sealant is designed for high throughput display assembly that require protection against humidity and oxygen.
Hysol ECCOSEAL 7200 Display sealant
Hysol EE1068 Two component, room temperature cure, encapsulants potting epoxy.
Hysol EE1068/HD3404 Two component, room temperature cure, encapsulants potting epoxy.
HYSOL EE1117-HD3561 epoxy system HYSOL EE1117-HD3561 epoxy system is designed for use as a sealant or for potting electronic devices.
Hysol EO1016 Hysol EO1016 is a UL94V-0 encapsulant for Smartcards and watch IC's. Nonabrasive filler allows for grinding if necessary.
Hysol EO1058 Hysol EO1058 is a single component epoxy system that cures at 125°C and provides excellent environmental and thermal protection to encapsulated parts.
Hysol EO1060 Hysol EO1060 is a general purpose, low glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
Hysol EO1061 Hysol EO1061 is a medium glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
Hysol EO1062 Hysol EO1062 is a general purpose, high glob version of EO1061.
Hysol EO1072 Hysol EO1072 is a one component, general purpose, high performance epoxy encapsulant with high Tg and low extractable ionics.
Hysol EO1080 Low CTE version of EO1016.
Hysol EO1086 Hysol EO1086 is a one-component epoxy encapsulant.
Hysol EO1088 One component encapsulants potting epoxy.
Hysol EO7038 Loctite EO7038 is a one-component epoxy potting compound, formulated to protect sensors used in harsh environments, such as automotive applications
HYSOL EO7039 HYSOL EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates.
Hysol ES1000 Black, low cost, flexible, capable of UL94HB, resistant to thermal shock, non-abrasive filled, high impact strength, long pot life
Hysol ES1002 Black, low cost, flexible, room temperature cure, lightweight syntactic encapsulant capable of UL94V-0, non-abrasive filled, long pot life.
Hysol ES1004 Hysol ES1004 is capable of UL94V-0, stable to 155°C.
Hysol ES1301 Long working time, excellent imprognation of fine windings
Hysol ES1900 Clear, low shrinkage, excellent chemical resistance, strong bond to substrates
Hysol ES1901 Tough, fast setting, optically clear, low viscosity, room temperature curing, chemical resistant, industrial grade epoxy adhesive potting/encapsulating material.
Hysol ES1902 Hysol ES1902 is a clear, room temperature cure, transparent, very fast UV gel, excellent dimensional stability and low viscosity; easy to handle.
HYSOL ES1904 HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications.
Hysol ES2202 Hysol ES2202 withstands high heat distortion temperature, Excellent chemical resistance, excellent performance under high moisture and humidity.
Hysol ES2207 High heat distortion temperature, low expansion, dimensionally stable
Hysol ES2500 Black, fast gel, capable of UL1446 to 180C and UL94HB at 6mm, Easy handling, resilient
Hysol ES4512HF Non-Conductive Potting Compound Hysol ES4512HF is a two-part non-conductive potting compound. It is used in the consumer & Industrial market.
Hysol FF2200 Reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach.
Hysol FF2300 Hysol FF2300 is a no-flow underfill for eutectic and lead-free applications.
Hysol FF6000 Hysol FF6000 is a flux with the additional features and benefits of an epoxy flux.
Hysol FP0087 Low stress fill for potting automated sensor and diodes; high Tg.
Hysol FP0114 Low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications.
Hysol FP0116
Hysol FP4323 Hysol FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications.
Hysol FP4410HF Hysol FP0087 is low stress fill for potting automated sensor and diodes, high Tg.
Hysol FP4450 Hysol FP4450 is an industry standard fill material for fills or cavity down BGAs.
Hysol FP4450HF Hysol FP4450HF is a high flow version of FP4450LV using synthetic filler for use in fine wire and low alpha fills applications.
Hysol FP4450LV Hysol FP4450LV is a low viscosity version of FP4450 (Fills) incorporating cleaner resins.
Hysol FP4451 Hysol FP4451 is an industry standard damming material for BGAs.
Hysol FP4451TD Hysol FP4451TD is a tall dam version of FP4451 for applications requiring a taller, narrower dam. Ionically cleaner also.
Hysol FP4460 Hysol FP4460 is a general purpose, high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.
Hysol FP4470 High adhesion version of FP4450 for 260°C L3 JEDEC performance.
HYSOL FP4502 flip chip underfill HYSOL FP4502 is a flip chip underfill.
Hysol FP4526 Hysol FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
Hysol FP4530 Hysol FP4530 is snap cure flip chip underfill for FC on flex. Designed for gap size down to 25 microns.
Hysol FP4531 Hysol FP4531 is a snap cure fast flow, non-reworkable underfill for CSP applications.
Hysol FP4545FC Hysol FP4545FC is a low viscosity version of FP4548FC
Hysol FP4549 Hysol FP4549 is used for fine-pitch flip chip applications, fast flowing, low stress underfill.
Hysol FP4549HT Hysol FP4549HT is an aluminum nitride-filled version of FP4549 for high thermal applications.
Hysol FP4583 Hysol FP4583 is a high purity, FC underfill, high lead applications
Hysol FP4585 Capillary underfill
Hysol FP4651 Hysol FP4651 is a low viscosity version of FP4650 for a large array of packages.
Hysol FP4652 Hysol FP4652 is a fast cure, low stress version of FP4450 for a large array of packages.
Hysol FP4654 Package level: MAP low stress encapsulant
HYSOL FP4655 HYSOL FP4655 is a high performance encapsulant which can be used alone or as a cavity fill material, or in combination with FP4451 material as part of a dam and fill system. Its low viscosity and fine particle filler size make it ideal for devices with fine pitch wire spacing.
Hysol FP5000 One part, high purity, laminate packages, non-conductive paste (NCP, CSP, SCSP, SIP) designed for thermal compression bonding process.
Hysol FP5001 Hysol FP5001 is one part with excellent thermal cycling resistance, laminate packages (CSP, SCSP, SIP). Compatible with both constant and pulse heat tools. Recommended for gold / gold assembly joint.
Hysol FP5201 NCP for thermal compression bonding
Hysol FP5300 Hysol FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates, as well as misc. assembly. Low temp cure ACP, RFID.
Hysol FP5500 NCP for thermal compression bonding
Hysol FP6101 Hysol FP6101 is a reworkable underfill for improvement of mechanical reliability. Fast flow and snap cure for improved process time.
Hysol FP6401 Hysol FP6401 is a high purity, liquid flexible damming material.
Hysol GR2620 Molding compound
Hysol GR2710 Hysol GR2710 is a gold, low stress/non-flame retarded molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors.
Hysol GR2720 Molding compound
Hysol GR360A Hysol GR360A is a green, high-productivity molding compound designed for use in high voltage power applications requiring good electrical stability at high temperature.
HYSOL GR360A-ST-1 HYSOL GR360A-ST-1 is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant. It meets UL 94 V-0 flammability at 6.35 mm.
Hysol GR725LS Green molding compound designed for power SO and surface mount discrete packages (High Power Packages, Power SOIC, Power SSOP).
Hysol GR750 High thermal conductivity-isolated packages, green, designed to improve thermal management for semiconductor devices.
Hysol GR750-SC Molding compound
Hysol GR750HT-25 Hysol GR750HT-25 is a high thermal conductivity molding compound using fully alumina fillers designed to improve thermal management for semiconductor devices.
Hysol GR828D Ultra low stress, high adhesion molding compound
Hysol GR828DD Hysol GR828DD is a green, semiconductor grade, low stress and high adhesion molding compound. It is especially designed for DPAK/D2PAK packages with Ni and copper/Ag plating lead frames.
Hysol GR869 Molding compound. Surface mount/leadframes (QFP, T/LQFP, TSOP, SOIC)
Hysol GR9810-1 Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled
Hysol GR9851 Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages
Hysol Huawei KL-G900H High adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant.
Hysol Huawei KLG750 Hysol HuaweiKLG750 has superior adhesion technology to ensure zero delamination performance for SOT and SOIC packages.
Hysol KL-G450H Low stress, green mold compound suitable for SOIC, SOP, SOJ and QFP; contains no bromine, antimony or phosphorus flame retardant.
Hysol KL-G730 HYSOL KL-G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol KL-G730 offers enhanced reliability peformance for T/LQFP packages. KL-G730 meets UL 94 V-0 flammability at 3.175mm thickness.
HYSOL LA3032-78 HYSOL LA3032-78 encapsulant is designed for high throughput assembly operations.
Hysol MG15F Anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.
Hysol MG15F-R Hysol MG15F-R is a anhydride cured molding compound designed for use in high voltage power applications.
Hysol MG33F Electronic grade epoxy molding compound
Hysol MG40FS Hysol MG40FSBlack / conventional molding of SMD and SIP networks; gold version MG40F-0526 available
Hysol OTO149-3 Clear glob top material with good adhesion to any substrate.
Hysol PC18M Hysol PC18M is a flexible solvent-based, one-component urethane coating.
Hysol PC28STD Hysol PC28STD is a convenient aerosol packaging, oxygen-cure, urethane, printed circuit board coating system.
Hysol PC29M Hysol PC29M is a thin-film, urethane printed circuit board coating with good toughness and high flexibility. Note: Not sold in Europe.
Hysol PC40-UM Hysol PC40-UM is a solvent-free, low-viscosity, rapid gel, UV-moisture cure one component acrylate-based conformal coating.
HYSOL PC40-UMF HYSOL PC40-UMF conformal coating is specifically formulated to rapidly gel and immobolise when exposed to UV light and then fully cure when exposed to atmospheric moisture, ensuring optimum performance even in shadowed areas.
Hysol PC62 Acrylic conformal coating
Hysol QMI 3555R Hysol QMI 3555R is a no-dry Ag/glass die attach for glass, solder and seamed sealed packages.
Hysol QMI 536UV Hysol QMI 536UV is used for component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications.
Hysol QMI5030 Unique liquid / paste heat cure die attach adhesive product resulting from blend of thermoset and thermoplastic resins.
HYSOL QMI516IE HYSOL QMI516IE electrically conductive hydrophobic adhesive is designed for die attach applications.
Hysol QMI516LC Hysol QMI516LC is a low temperature cure, general conductive, silver-filled paste adhesive.
Hysol QMI519 QMI519 is a silver filled conductive adhesive for attachment of integrated circuits and components to metal leadframes advanced substrates.
HYSOL QMI5200-1X adhesive film HYSOL QMI5200-1X adhesive film
Hysol QMI529HT General conductive, die attach adhesive
Hysol QMI529HT-5DLT Hysol QMI529HT-5DLT is used for component or die attach where very high electrical and thermal conductivity are required.
Hysol QMI529HT-LV Die attach adhesive
Hysol QMI536HT Hysol QMI536HT is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging heat cure, die attach filler.
Hysol QMI536NB Hysol QMI536NB has high JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
Hysol QMI536NB-1A3 High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
Hysol QMI536NB-1A5 Hysol QMI536NB-1A5 is a non-conductive die attach paste.
Hysol QMI538NB-1A2 Non-conductive paste for leadframe applications. Very low stress QMI538NB°1A2, 1A3, 1A4 for die sizes greater than 500 x 500 mil. / 13 x 13 mm.
Hysol QMI547 Hysol QMI547 is a non-conductive paste for leadframe applications.
Hysol SB-50 Innovative high mechanical reliability and reworkable edgebond, thermal cure material designed for CSP and BGA devices.
Hysol STYCAST 1090BLK Stycast 1090BLK is a room temperature cure epoxy designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
Hysol STYCAST 2017M4 Epoxy heat cure encapsulant developed for lamp type, blue LED.
Hysol STYCAST 2561/CAT 11 Encapsulant-potting
Hysol STYCAST 2651 Two component, low viscosity, general purpose epoxy encapsulant.
HYSOL STYCAST 2651-40FR/Catalyst 11 HYSOL STYCAST 2651-40FR/Catalyst 11 epoxy encapsulant is designed for general potting applications.
HYSOL STYCAST 2651-40FR/Catalyst 9 HYSOL STYCAST 2651-40FR /Catalyst 9 epoxy encapsulant designed for general potting applications.
HYSOL STYCAST 2651MM/CATALYST 23LV HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2651MM/CATALYST 9 HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2762-Catalyst 14 HYSOL STYCAST 2762 Catalyst 14 encapsulant
Hysol STYCAST 2850FT For high thermal conductivity and low outgassing, consider this encapsulant.
Hysol STYCAST 2850FT"/CAT 11 Heat cure encapsulant-potting.
Hysol STYCAST 2850FT/CAT 23LV Room temperature cure encapsulant-potting
HYSOL STYCAST 2850KT/CATALYST 24LV HYSOL STYCAST 2850KT CATALYST 24LV is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high voltage applications where surface arcing or tracking is a concern.
HYSOL STYCAST 2850KT/CATALYST 9 HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies.
HYSOL STYCAST 2850MT-Catalyst 24LV HYSOL STYCAST 2850MT-Catalyst 24LV is a two component, electrically insulating general purpose encapsulant. It
HYSOL STYCAST 2850MT-Catalyst 27-1 HYSOL STYCAST 2850MT-Catalyst 27-1 is a two component, electrically insulating general purpose encapsulant.
HYSOL STYCAST 2850MT-Catalyst 9 HYSOL STYCAST 2850MT-Catalyst 9 is recommended for encapsulation of components that require heat dissipation and thermal shock properties.
HYSOL STYCAST 3050 Catalyst 11 HYSOL STYCAST 3050 Catalyst 11 is designed for potting and encapsulation applications.
Hysol STYCAST 50500-1 For protection of wire-bonded ICS, consider this flowable material for fills.
Hysol STYCAST 50500D For protection of wire bonds consider this high purity material as either a dam or a glob top.
Hysol STYCAST A312 A one-component, reworkable unfilled solventless epoxy paste adhesive / underfill encapsulant; fast curing and excellent chemical and heat resistance.
HYSOL STYCAST E1070 HYSOL STYCAST E1070 epoxy encapsulant
Hysol STYCAST E1847 Encapsulant-potting
Hysol STYCAST E2534FR Stycast E2534FR/Catalyst 9 is a heat cure epoxy potting compound that complies with recent demands on environmentally friendly products and does not contain brominated flame retardants.
HYSOL STYCAST EFF15 syntactic foam powder HYSOL STYCAST EFF15 epoxy based free flowing syntactic foam powder.
Hysol STYCAST TC4 Thermally conductive, high temperature silicone thermal grease.
Hysol STYCAST TC8M Thermally conductive, high temperature silicone thermal grease.
Hysol STYCAST U2500 Encapsulant
HYSOL STYCAST U2535 Polyurethane Encapsulant HYSOL STYCAST U2535 flexible polyurethane encapsulant.
HYSOL TRA-BOND 2106 HYSOL TRA-BOND 2106 two component epoxy is designed for high strength structural bonding applications.
HYSOL TRA-BOND 2106T HYSOL TRA-BOND 2106T is a two component epoxy designed for high strength structural bonding applications.
Hysol TRA-BOND 2115 Tra-Bond 2115 is an excellent choice for bonding optical where alignment accuracy is essential.
HYSOL TRA-BOND 2116 HYSOL TRA-BOND 2116 is a thixotropic, low vapor pressure, room temperature cure, epoxy paste system that passes the NASA Outgassing Specification.
Hysol TRA-BOND 2151 Thixotropic two part, room temperature cure, paste adhesive.
HYSOL TRA-BOND 2158 HYSOL TRA-BOND 2158 is a two part adhesvie that develops strong, durable high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
Hysol TRA-BOND F112 This two-part, low viscosity epoxy paste adhesive is designed for use on fiber optic assembly applications.
Hysol TRA-BOND F113SC Optically clear, room temperature cure, low viscosity adhesive
Hysol TRA-BOND F114 Optically clear, low viscosity, room temperature cure, epoxy adhesive.
Hysol TRA-BOND F123 Heat cure epoxy
Hysol TRA-BOND F253 Tra-Bond F253 is a two-part epoxy formulated to change color during the cure process to indicate the cure status.
Hysol TRA-BOND FDA16 A medium viscosity, room temperature cure, epoxy resin paste system specifically designed for medical device applications.
Hysol TRA-BOND FDA2 A room temperature cure, thixotropic epoxy adhesive designed for medical device applications.
Hysol TRA-BOND FDA2T A room temperature cure, thixotropic epoxy resin paste system specifically designed for medical device applications.
Hysol Tra-Cast FS245 Tra-Cast FS245 is a thixotropic, two-part adhesive used on staking transistors, diodes, resistors and printed circuit electronics applications.
Hysol TRA-DUCT 2902 Tra-Duct 2902 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties.
Hysol TRA-DUCT 2958 Two part epoxy
HYSOL UF3037 HYSOL UF3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
Hysol UF3537 Hysol UF3537 is a fast cure underfill used on chip scale packaging.
Hysol UF3800 reworkable underfill HYSOL UF3800 is a high reliability reworkable underfill designed for CSP and BGA applications.
HYSOL UF3808 HYSOL UF3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components.
HYSOL UF3810 HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications.
Hysol UF8830 Hysol UF8830 is a liquid epoxy underfill for flip chip BGA.
Hysol US0146 Hysol US0146 is an unfilled, two component clear amber polyurethane casting system formulated for potting.
Hysol US0154 Encapsulant potting urethane.
HYSOL US1150 HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.
HYSOL US1151 HYSOL US1151 is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a bed of 8-12 mesh sand increases thermal conductivity while decreasing shrinkage and cost. HYSOL® US1151™ can be used to encapsulate electronics for various applications including under-the-hood automotive and marine. The low glass transition temperature means that sensitive compounds are not damaged during low temperature excursions.
HYSOL US1750 HYSOL US1750 elastomeric polyurethane, is a waterwhite, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and oxygenerator units.
Hysol US2050 Hysol US2050 is a quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance.
Hysol US2350 Hysol US2350 is a flexible, flame retardant, mineral filled, polyurethane compound.
Hysol US5532 Encapsulant potting urethane.
HYSOL UV3000 HYSOL UV3000 is a UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as 200°C.
HYSOL UV3000LH HYSOL UV3000LH UV cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000. It is used in CMOS glass bonding.
HYSOL UV3001 HYSOL UV3001 is a UV cure adhesive designed for high throughput assembly operations. It can withstand exposure to temperatures as high as 200°C. It is the 4 μm glass rod spacer version of UV3000 adhesive.
Hysol UV8800M UV cure encapsulant for smart card and other COB applications.
Hysol UV9060 Hysol UV9060 is a no-flow UV moisture cure encapsulant.
HYSOL XCE3104XL HYSOL XCE3104XL is an electrically conductive adhesive with tin compatibility for the stencil and screen print applications.
HYSOL XCE3120 HYSOL XCE3120 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications.
HYSOL XCP3302NS HYSOL XCP3302NS gold filled, electrically conductive adhesive is designed for automatic dispensing operations. It is the no spacer version of XCP3302 adhesive.
Hysol XE1218 Reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits.
HYSOL XE80100 HYSOL XE80100 is a solventless modified epoxy adhesive that combines low stress with good adhesion on nearly all surfaces and is flexible for mismatched CTE applications. XE80100 is the non-conductive verison of ECCOBOND CE8500 adhesive.
HYSOL XUV 9086 HYSOL XUV9086 is a one component UV cure encapsulant used in ink jet applications.
Hysol XUV-9052 Hysol XUV-9052 is a one component, dual cure (UV & moisture) general adhesive designed as a lead encapsulant.
HYSOL XUV80260 HYSOL XUV80260 is a UV curable display perimeter sealant for rigid type OLED.
HYSOL XUV80270-1 HYSOL XUV80270-1 is a one-component, non-conductive, UV curable adhesive sealant for high throughput display assembly that require protection against humidity. It is formulated to cure very fast when exposed to UV light, allowing for fast processing of a thin section of material even through ITO coated glass.
ICP-4000 ABLESTIK ICP-4000 is a silicone based, electronically conductive adhesive recommended in mounting small components to a variety of interconnect substrates.
Loctite 3118 Loctite 3118 is a white image sensor adhesive.
Loctite 3119 Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates.
Loctite 3128 Loctite 3128 is an edgebond, thermal cure, black image sensor adhesive.
LOCTITE 3128NH edgebond underfill LOCTITE 3128NH edgebond underfill
Loctite 3129 Loctite 3129 is an image sensor adhesive.
Loctite 3131 Photonics material
Loctite 315 Output Room temperature cure adhesive, self-shimming for electrical isolation
Loctite 3192 Loctite® Liquid Optically Clear Adhesives (LOCAs) acrylic
Loctite 3193 Loctite® Liquid Optically Clear Adhesives (LOCAs) acrylic
Loctite 3195 Loctite® Liquid Optically Clear Adhesives (LOCAs) acrylic
Loctite 3195DM Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) acrylic
Loctite 3196 Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) acrylic
Loctite 3217 Photonics material
Loctite 3220 Photonics material-thermal cure
LOCTITE 3220WH LOCTITE 3220WH is a one component designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. 3220WH is the white colored version of Loctite 3220 adhesive.
LOCTITE 3318 LOCTITE 3318 is suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.
LOCTITE 3318M UV coating LOCTITE 3318M UV coating for LCD module assembly.
LOCTITE 3323 Has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV fill encapsulants, such as 3327 and 3329. Either combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.
LOCTITE 3327 Has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV dam encapsulants, such as LOCTITE 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.
Loctite 3508 Loctite 3508 is a lead-free, one-component epoxy cornerbond adhesive. Applied pre-reflow and allows self-alignment of SMT components during reflow operation. Used for lead-free applications.
Loctite 3509 Loctite 3509 is a one component heat cure epoxy designed for use as board level cornerbond for IC packages such as CSP's and BGA's.
Loctite 3513 Loctite 3513 is a reworkable, single-component epoxy used as a underfill for CSP or BGA's.
LOCTITE 3515 One component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation.
Loctite 3517 Loctite 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.
LOCTITE 3517M reworkable underfill LOCTITE 3517M one component reworkable underfill.
Loctite 3548 Loctite 3548 is a next generation reworkable underfill for thermal and mechanical reliability.
Loctite 3549 Loctite 3549 is a next generation reworkable underfill for thermal and mechanical reliability.
Loctite 3551 Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.
Loctite 3563 Rapid curing, fast flowing, reworkable, liquid epoxy for use as a capillary flow underfill for packaged IC's
Loctite 3593 Loctite 3593 is a nonreworkable, underfill for high mechanical reliability. Fast flow and snap cure for improved process time.
LOCTITE 3609 Used for medium to high speed dispense applications. Excellent green strength for large components.
Loctite 3611 Loctite 3611 is a stencil printable/pin transfer product for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3612 Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3616 High speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Ultra low moisture pick-up. Pin transfer capable as well.
Loctite 3619 Loctite 3619 is used for ultra low temperature cure, high speed syringe dispense.
LOCTITE 3621 High performance for ultra high-speed syringe dispense. Recommended product for Dispense Jet.
LOCTITE 3627 High speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Recommended product for DEK Proflow Pumprint process.
LOCTITE 3629C LOCTITE 3629C is a one-component, halogen free, fast cure epoxy formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering.
Loctite 3702 Display sealant
Loctite 3705 Light Cure Adhesive Loctite 3705 is an edgebond, UV cure adhesive designed for bonding electronics components on PCBs.
Loctite 3719 Light Cure Adhesive UV acrylic adhesive. (LPD209)
Loctite 3720 ITO/COG overcoat
Loctite 3730 Display sealant
Loctite 3733 (LPD166) UV acrylic adhesive.
Loctite 3736 UV acrylic adhesive.
Loctite 3781 Light Cure Adhesive / Sealant UV acrylic adhesive. (LPD181)
LOCTITE 383 Output LOCTITE 383 Output is a high-strength, room temperature cure adhesive for permanent assemblies.
Loctite 384 Output Loctite 384 Output is a repairable, room temperature cure adhesive utilized for parts subject to disassembly.
Loctite 3873 Loctite 3873 is a fast curing, high-conductivity, self-shimming, room temperature cure, paste adhesive for bonding heat-generated devices to thermal spreader.
Loctite 3874 Loctite 3874 is a fast-curing, high-conductivity, room temperature cure adhesive for bonding heat-generated devices to thermal spreader without glass beads.
Loctite 3880 Loctite 3880 is a general conductive paste adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.
Loctite 3888 Loctite 3888 is a room temperature cure adhesive for applications requiring a combination of good mechanical and electrical properties.
Loctite 3900 Loctite 3900 is an air-dry acrylic coating designed for small production runs.
Loctite 5089 Nuva-Sil Silicone Gasket / Sealant Used for gasketing and sealing applications
Loctite 5192 Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) silicone
Loctite 5192DM Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) silicone
Loctite 5210 Loctite 5210 is an ultra fast curing, non-corrosive RTV silicone designed for potting, wire tracking, selective sealing, vibration dampening and repair/rework applications on PCB's.
Loctite 5290 Loctite 5290 is a solvent-free, low viscosity, UV/moisture cure silicone suited to brush, dip and selective coating.
Loctite 5293 Loctite 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.
Loctite 5296 Loctite 5296 is a heat cure silicone that can be applied with brush, dip or spray. High reliability automotive. Clear.
Loctite 5404 Output Loctite 5404 Output is a self-shimming, heat cure, flexible silicone adhesive paste for demanding parts such as ceramic boards.
Loctite 5406M Loctite 5406M is a one component flexible RTV silicone engineered to enhance load bearing and shock absorbing properties of the bonded area. It is also used to protect electrical devices from corrosion and mechanical stress such as vibration.
Loctite 5421 Loctite 5421 is an RTV silicone paste adhesive that provides EMI / RFI shielding on electronic device enclosures.
Loctite 7360 Surface Mount Adhesive Cleaner Loctite 7360 Surface Mount Adhesive Cleaner is a nozzle and dispense machine component cleaner. Excellent for removal of uncured adhesive from the board without causing the adhesive to gel.
Loctite 7387 Depend Activator Activator designed to initiate the cure of Loctite toughened acrylic adhesives such as Loctite 315, 383 & 384.
Loctite 7419 Surface Activator Halogen-free, non-CFC solvent based surface activator
LOCTITE ABLELOC 5500SB tape adhesive LOCTITE ABLELOC 5500SB is a tape adhesive for high speed operations.
LOCTITE ABLESTIK 2000 Electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging.
LOCTITE ABLESTIK 2030SC Die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK 2035SC Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK 2035SC-1B1 Non-conductive, one component die attach adhesive was formulated for high throughput die attach applications.
LOCTITE ABLESTIK 2053S Low stress paste adhesive for die-to-substrate applications.
LOCTITE ABLESTIK 2100A An ultra low moisture absorption paste adhesive for lead-free packaging.
LOCTITE ABLESTIK 2300 An ultra low moisture absorption, low stress paste adhesive.
LOCTITE ABLESTIK 2310 LOCTITE ABLESTIK 2310 Is a conductive die attach adhesive.
LOCTITE ABLESTIK 3230 Electrically conductive die attach adhesive is designed for high reliability package applications.
LOCTITE ABLESTIK 3290 Snap curable, electrically conductive die attach adhesive designed for lead-free applications where high reliability is a key requirement.
LOCTITE ABLESTIK 342-37 LOCTITE ABLESTIK 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties.
LOCTITE ABLESTIK 563K Supported, thermally conductive dielectric adhesive film.
LOCTITE ABLESTIK 60L Parts AB carbon filled epoxy adhesive LOCTITE ABLESTIK 60L Parts AB is a carbon filled epoxy adhesive with low electrical conductivity designed for general pupose bonding.
LOCTITE ABLESTIK 724-14C One component, low temperature stability, room temperature cure paste adhesive.
LOCTITE ABLESTIK 8175 A general conductive, screen printable thermal conductive paste adhesive.
LOCTITE ABLESTIK 8290 A low stress die attach adhesive suitable for die size <200 mil.
LOCTITE ABLESTIK 8350R A snap curable die attach adhesive designed to provide anti-delamination and package reliability.
LOCTITE ABLESTIK 8352L A high electrical and thermal conductivity die attach adhesive.
LOCTITE ABLESTIK 8384 Die attach adhesive is designed for smart card applications.
LOCTITE ABLESTIK 84-1LMI Enhanced thermal conductivity, fast cure, general conductive, low stress die & component attach adhesive paste.
LOCTITE ABLESTIK 84-1LMISR3 Is an electrically conductive adhesive is designed for die attach applications. It is a low viscosity and higher thixotropic index version of ABLEBOND 84-1LMIS.
LOCTITE ABLESTIK 84-1LMISR4 Industry standard die attach paste adhesive.
LOCTITE ABLESTIK 84-1LMISR8 Electrically conductive adhesive.
LOCTITE ABLESTIK 84-1LMIT1 A general conductive, low stress thermal conductive paste adhesive.
LOCTITE ABLESTIK 84-3 Electrically non-conductive adhesive pastes for screen printing, dispensing and insulating applications.
LOCTITE ABLESTIK 927-10 Epoxy adhesive for medical applications.
LOCTITE ABLESTIK 965-1L An electrically conductive epoxy die attach designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion.
LOCTITE ABLESTIK 967-1 Two components, low temperature cure paste adhesive.
LOCTITE ABLESTIK 969-1 Is an electrically conductive preimidized adhesive designed for semiconductor die attach. It is not recommended for use in hermetic packages.
LOCTITE ABLESTIK A164-1 Heat cure epoxy paste adhesive
LOCTITE ABLESTIK A316 Is a series epoxy adhesive and sealant is designed for high throughput assembly operations.
LOCTITE ABLESTIK A401 Good thermal conductivity; good high temperature resistance paste adhesive - bonds well to metal, glass, plastics and ceramics.
LOCTITE ABLESTIK ABP 8060T Electrically Conductive Die Attach Paste LOCTITE ABLESTIK ABP 8060T electrically die attach paste.
LOCTITE ABLESTIK ABP 8062T Electrically Conductive Die Attach Paste LOCTITE ABLESTIK ABP 8062T electrically conductive die attach paste.
LOCTITE ABLESTIK ABP 8064T Electrically Conductive Die Attach Paste Adhesive LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive.
LOCTITE ABLESTIK ABP-2100AC Die Attach Adhesive LOCTITE ABLESTIK ABP-2100AC die attach adhesive is designed for Pb-free array packaging.
LOCTITE ABLESTIK ATB-F125E Adhesive Film Die Attach LOCTITE ABLESTIK ATB-F125E Adhesive Film Die Attach.
LOCTITE ABLESTIK C 850-5A Electrically Conductive Adhesive LOCTITE ABLESTIK C 850-5A is an electrically conductive adhesive.
LOCTITE ABLESTIK C850-6L A general conductive, low viscosity version of C850-6.
LOCTITE ABLESTIK C860-1J Electrically conductive paste adhesive.
LOCTITE ABLESTIK CA3556HF Electrically conductive paste adhesive
LOCTITE ABLESTIK CDF 200 Conductive Die Attach Film LOCTITE ABLESTIK CDF 200 highly filled, conductive die attach film adhesive.
LOCTITE ABLESTIK CDF 800 Series Conductive Die Attach Film LOCTITE ABLESTIK CDF 800 Series are highly filled, conductive die attach adhesive film.
LOCTITE ABLESTIK CE3804 Electrically conductive paste adhesive.
LOCTITE ABLESTIK CE3850 One component electrically conductive adhesive is designed for circuit assembly applications.
LOCTITE ABLESTIK CE3920 Dispensible, fast cure, general conductive, Pb-free paste adhesive alternative to solder.
LOCTITE ABLESTIK CT4042-1 PTA A two component silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in microelectronics applications. It is a lower viscosity version of LOCTITE ABLESTIK CT4042 adhesive.
LOCTITE ABLESTIK DX10C Epoxy base clear type. Low viscosity paste adhesive.
LOCTITE ABLESTIK GA2W Single component adhesive is designed for CCD/CMOS die attach bonding applications.
LOCTITE ABLESTIK ICP 3540 Isotropic conductive paste LOCTITE ABLESTIK ICP 3540 is an electrically conductive isotropic conductive paste designed for circuit assembly applications.
LOCTITE ABLESTIK ICP 3601 Electrically conductive epoxy paste
LOCTITE ABLESTIK ICP 4298 /S39electrically conductive adhesive LOCTITE ABLESTIK ICP 4298 is a one-component silicone based electrically conductive adhesive.
LOCTITE ABLESTIK ICP 4298 Silicone based electrically conductive adhesive LOCTITE ABLESTIK ICP 4298 is a silicone based, electrically conductive adhesive.
LOCTITE ABLESTIK ICP CB5424 Isotropic Conductive Paste LOCTITE ABLESTIK ICP CB5424 is an isotropic conductive paste.
LOCTITE ABLESTIK QMI538NB Non-conductive paste for leadframe applications.
LOCTITE ABLESTIK SSP 2020 Silver sintering paste die attach LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach.
LOCTITE ABLESTIK SSP-2000 silver sintering paste LOCTITE ABLESTIK SSP-2000 silver sintering paste die attach adhesive for high power devices.
Loctite Bearing Mount Stick - High Temperature (Automotive Aftermarket Only) Revolutionary method to bond non-threaded, cylindrical metal assemblies
LOCTITE C110 Is an electrically conductive epoxy coating.
LOCTITE CAT 15-1 CLEARJ Designed for use with potting and encapsulating resins.
LOCTITE CAT 15-1 LV Designed for use with potting and encapsulating resins.
LOCTITE CAT 17 two component epoxy encapsulant designed for electronic components exposed to harsh environments.
LOCTITE CAT 24LV Encapsulant designed for general potting applications.
LOCTITE CP8825 Electrically conducting, acrylic silver coating.
LOCTITE D 125F-DR LOCTITE D 125F-DR surface mound adhesive is designed for use in high-speed pneumatic and positive displacement dispensers.
LOCTITE ECCOBOND COB UV8801 LOCTITE ECCOBOND COB UV8801 one component epoxy encapsulant is developed to meet high temperature thermal cycling specifications.
LOCTITE ECCOBOND DP 1002UV wire and tab bond lead encapsulant LOCTITE ECCOBOND DP 1002UV wire and tab bond lead encapsulant.
LOCTITE ECCOBOND DP 1003UV wire and tab bond encapsulant LOCTITE ECCOBOND DP 1003UV wire and tab bond encapsulant and gap filling adhesive.
LOCTITE ECCOBOND DP 1012UV wire and tab bond lead encapsulant LOCTITE ECCOBOND DP 1012UV is a one component material designed for use as a wire and tab bond lead encapsulant or damming material.
LOCTITE ECCOBOND DP1000 wirebond encapsulant LOCTITE ECCOBOND DP1000 wirebond encapsulant.
LOCTITE ECCOBOND DP1005 jet dispensable die attach adhesive. LOCTITE ECCOBOND DP1005 jet dispensable die attach adhesive.
LOCTITE ECCOBOND DS 3318LVT UV curable coating and sealant LOCTITE ECCOBOND DS 3318LVT, fast, UV curable coating and sealant.
LOCTITE ECCOBOND DS 6601 Sealant LOCTITE ECCOBOND DS 6601 epoxy hybrid for use as the main sealant.
LOCTITE ECCOBOND E1926 A nonreworkable, wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared to standard first level underfills.
LOCTITE ECCOBOND EN 3707F no flow encapsulant LOCTITE ECCOBOND EN 3707F is a no-flow encapsulant.
LOCTITE ECCOBOND EO 0206 LOCTITE ECCOBOND EO 0206 one-component epoxy is designed for use on electronic devices.
LOCTITE ECCOBOND MC 723 Is for bondline control achieved with 75 micron spacers.
LOCTITE ECCOBOND NCP 5208 Non conductive paste LOCTITE ECCOBOND NCP 5208 is a non-conductive paste for thermal compression bonding in flip chip to laminate assembly.
LOCTITE ECCOBOND NX76 One-component epoxy encapsulant designed for SMD LED. Low CTE and good light dispersion by adding a small amount of filler.
LOCTITE ECCOBOND UF 2800A reworkable underfill LOCTITE ECCOBOND UF 2800A reworkable underfill. AVAILABLE FOR PURCHASE AND USE IN CHINA ONLY.
LOCTITE ECCOBOND UF 2800B reworkable underfill LOCTITE ECCOBOND UF 2800B reworkable underfill. ONLY AVAILABLE FOR PURCHASE AND USE IN CHINA
LOCTITE ECCOBOND UF 8840 epoxy underfill LOCTITE ECCOBOND UF 8840 liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage.
LOCTITE ECCOBOND UV9060F UV Cure Encapsulant LOCTITE ECCOBOND UV9060F no flow, UV cure encapsulant.
LOCTITE ECI 1004 E&C conductive screen printable ink LOCTITE ECI 1004 E&C conductive screen printable ink
LOCTITE ECI 4001 E&C Electrically conductive ink
LOCTITE ECI 5001 E&C Electrically conductive ink LOCTITE ECI 5001 E&C screen printable electrically conductive ink.
LOCTITE ECI 5002 E&C electrically conductive ink LOCTITE ECI 5002 E&C electrically conductive ink
LOCTITE ECI 5003 E&C Conductive Ink LOCTITE ECI 5003 E&C is a screen printable conductive ink.
LOCTITE ECI 7001 E&C LOCTITE ECI 7001 E&C conductive, screen printable ink.
LOCTITE ECI 8001 E&C PTC Electrically conductive screen printable ink LOCTITE ECI 8001 E&C is and electrically conductive Positive Temperature Coefficient (PTC) screen printable ink.
LOCTITE EO7021 Encapsulant for use in smart card chip module applications.
LOCTITE EO7029 Encapsulant for smart card applications.
LOCTITE HYSOL CF0559 MG40FS-AM Epoxy molding compound delivers outstanding performance and ease of use. It is used in PDIP, SOIC and power discrete applications.
LOCTITE HYSOL CF0593 MG33F-0593 BK A green specially formulated product for use in high volume molding of tantalum capacitors.
LOCTITE HYSOL CF0671 GR2310 Gold Gold / non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors.
LOCTITE HYSOL CG0645 GR735 Thermally conductive molding compound
LOCTITE HYSOL EE0182 EB0625 LOCTITE HYSOL EE0182 EB6025 is a two part, white epoxy casting system having low abrasion and rapid gel features.
LOCTITE HYSOL GR 2220

LOCTITE HYSOL GR 2220 is a black, non-halogenated conventional molding of leaded components.

LOCTITE HYSOL GR 2310 A gold, non-halogenated molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors.
LOCTITE HYSOL GR 2340 Specially formulated molding compound designed for use in high volume molding of tantalum capacitors.
LOCTITE HYSOL GR 360A

LOCTITE HYSOL GR 360A is an epoxy molding compound

LOCTITE HYSOL GR 646HV-L1 LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound
LOCTITE HYSOL GR 838LC

Molding compound. Surface mount/leadframes (DPAK/D2PAK).

LOCTITE HYSOL GR15F-1 A green anhydride cured molding compound that contains spherical filler and is designed for high voltage applications. This product has excellent moldability performance with high yield rates.
LOCTITE HYSOL GR15F-1P Molding compound
LOCTITE HYSOL GR15F-A Anhydride cured molding compound is formulated to contain spherical fillers.
LOCTITE HYSOL GR2320 Black/non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors
LOCTITE HYSOL GR2720 A Molding compound
LOCTITE HYSOL GR2811 Epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements to 260°C reflow temperature. GR2811 meets UL 94 V-0 Flammability at 6.35mm thickness.
LOCTITE HYSOL GR360A(ON)-TSHT Epoxy molding compound.
LOCTITE HYSOL GR360A-FC2A Epoxy molding compound.
LOCTITE HYSOL GR640HV Low stress, green molding compound suitable for SOT packages. Provides superior moldability and reliability with lowest cost of ownership.
Loctite Hysol GR640HV-L1 Molding compound
LOCTITE HYSOL GR725LV Is a green, semiconductor grade, low stress and high adhesion molding compound for High Power Packages, Power SOIC, Power SSOP applications.
LOCTITE HYSOL GR828FC1(IMP) BULK An environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant.
LOCTITE HYSOL GR9810-1P A state-of-the-art epoxy molding compound developed to meet the stringent encapsulation requirements of package-on-package PoP, SCSP, and MMC devices.
LOCTITE HYSOL KL 1000-4T LOCTITE HYSOL KL 1000-4T provides the lowest cost of ownership with superior moldability and reliability. Extremely suitable for DIP packages.
LOCTITE HYSOL KL 4500-1 Low stress and high reliability molding compound suitable for TO, SOIC, SSOP and QFP packages, providing high purity and low uranium content. It’s low viscosity properties enables low wire sweep molding with a large operating window.
LOCTITE HYSOL KL 4500-1N Low stress and high reliability molding compound suitable for TO, SOP and SSOP packages.
LOCTITE HYSOL KL 4500-1NT A low stress and high reliability molding compound suitable for SOIC packages.
LOCTITE HYSOL KL 6500S Is a low stress molding compound suitable for SOT/SMX and SOD packages.
LOCTITE HYSOL KL 7000HA Is suitable for QFP, T/LQFP, TSOP packages. Provides ultra low stress, low moisture absorption, high purity and high reliability.
LOCTITE HYSOL KL-1000-3LX HRHJ Provides the lowest cost of ownership with superior moldability and reliability. KL1000-3LX is extremely suitable for bridge, axial and TO packages.
LOCTITE HYSOL KL-1000-3LX P Provides the lowest cost of ownership with superior moldability and reliability. Bridge Package, Axial Package and TO are typical package applications.
LOCTITE HYSOL KL-1000-4TX(NT) Epoxy molding compound delivers outstanding performance and ease of use.
LOCTITE HYSOL KL-3000-FF(H) Epoxy molding compound.
LOCTITE HYSOL KL-5000-HT Has alumina fillers and delivers a high thermal conductive solution for TO-220F/3PF's thermal requirements.
LOCTITE HYSOL KL-G 100 Loctite Hysol KL-G 100 is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages.
LOCTITE HYSOL KL-G 500HT Through hole discretes/high thermal conductivity molding compound
LOCTITE HYSOL KL-G 800H High adhesion, ultra low stress, green mold compound suitable for SOT/SMX, TSOP, D/D2PAK and L/TQFP and contains no bromine, antimony or phosphorus flame retardant.
LOCTITE HYSOL KL-G100L CQPW An environmentally friendly, "green" molding compound, containing no bromine, antimony or phosphorous flame retardant.
LOCTITE HYSOL KL-G200 Is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages.
LOCTITE HYSOL KL-G800H CD A green epoxy molding compound suitable for thin leaded packages. It is designed to achieve JEDEC level 2. It is used in SOT and SMX applications.
LOCTITE HYSOL MG 15F Anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.
LOCTITE HYSOL MG 15F-0140 Loctite Hysol MG15F-0140 is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.
LOCTITE HYSOL MG 15F-35A An anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperatures.
LOCTITE HYSOL MG 35F Loctite Hysol MG35F is suitable for discrete semiconductors requiring improvement in heat dissipation. Provides high productivity for power transistors.
LOCTITE HYSOL MG15F BULK A white epoxy molding compound specifically formulated for use as an overmold for opto coupler devices.
Loctite Hysol MG15F-0140R Loctite Hysol MG15F-0140R is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.
LOCTITE HYSOL MG33F-0520 A specially formulated green product desigmed for use in high volume molding of tantalum capacitors.
LOCTITE HYSOL MG40 BIM 74A BULK Epoxy molding compound for discretes and small signal and small outline transistors. It is only recommended for automatic molding operations.
LOCTITE HYSOL MG40F-4023 Conventional molding of SMD and SIP networks; gold version MG40F-0526 available
LOCTITE HYSOL MG52F-99B NXP High productivity molding compound, designed for high volume encapsulation of surface mount devices.
Loctite Isostrate Loctite Isostrate 2000 is an industry standard electrically insulating phase change material.
LOCTITE ISOSTRATE 2000 LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material.
LOCTITE MULTICORE HF 108RWF- reworkable flux LOCTITE MULTICORE HF 108RWF is a halogen-free flux gel for rework processes.
LOCTITE MULTICORE HF 212 Halogen-Free Solder Paste LOCTITE MULTICORE HF 212 is a halogen-free solder paste.
LOCTITE MULTICORE HF 250DP Solder Paste LOCTITE MULTICORE HF 250DP is a type 5, halogen-free, lead-free, low-voiding solder paste.
LOCTITE NCI 9001 E&C Non-conductive screen printable dielectric coating. LOCTITE NCI 9001 E&C is a non-conductive screen printable dielectric coating.
Loctite NSWC100 Loctite NSWC100 is a non-silicone, water cleanable thermal compound.
Loctite Powerstrate Xtreme Loctite Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure.Also available in other versions (PSX-D-LV, PSX-D, PSX-Pm, PSX-PE)
Loctite PSX-D Loctite PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Also available in other versions (PSX-D-LV, PSX-Pm, PSX-PE)
Loctite PSX-D-LV Loctite PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. (It is also available in other versions (PSX-D, PSX-Pm, PSX-PE)
Loctite PSX-Pm Loctite PSX-Pm (Medium Dry) (Powerstrate Xtreme) is a reworkable and repeatable phase change material. Also available other versions (PSX-D-LV, PSX-D, PSX-PE)
Loctite SF 7900 Ceramic Shield for Welding A ceramic dry film protective coating for MIG/MAG welding processes. Protects contact tips and welding nozzles by preventing adhesion of welding spatter.
Loctite Silverstrate Loctite Silverstrate has excellent thermal performance, particularly at higher pressures. Typically used on RF devices and SCR's where electrical conductivity is required (silver-filled).
LOCTITE STYCAST 1090SI A room temperature cure lightweight syntactic encapsulant that is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work..
LOCTITE STYCAST 2651-40 A filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion to a wide variety of substrates and excellent electrical properties. It can be cured with CATALYST 11, CATALYST 9 and CATALYST 23 LV.
LOCTITE STYCAST 2651MM Is designed as a general purpose encapsulant which requires low viscosity and low abrasion. It is especially useful for machine dispensing and for parts that require post molding machining.
LOCTITE STYCAST 276 Epoxy is formulated not to sag or run during cure when applied on loose fitting parts set on vertical or overhead surfaces.
LOCTITE STYCAST 2850FT For high thermal conductivity and low outgassing, consider this encapsulant.
LOCTITE STYCAST 3050 LOCTITE STYCAST 3050 is desgined for potting and encapsulation applications with very small physical spacing between parts.
LOCTITE STYCAST ES 4322FC epoxy encapsulant LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant
LOCTITE STYCAST NX17 A two-component, heat cure, epoxy encapsulant with good adhesion to PPA.
LOCTITE STYCAST SC 8001 B-Stageable, Electrically Insulating Epoxy Adhesive LOCTITE STYCAST SC 8001 B-Stageable, Electrically Insulating Epoxy Adhesive
LOCTITE TAF 8800 Thermal Absorbing Film LOCTITE TAF 8800 is a heat absorbing material designed to reduce the skin temperature of mobile electronic devices.
Loctite TG100 Ultra high performance thermal grease
LOCTITE Thermstrate 2000 Phase Change LOCTITE Thermstrate 2000 is a phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components.
LOCTITE US5533 flame retardant potting compound LOCTITE US5533 flexible, flame retardant potting compound.
Loctite UV8000 Photonics material UV cure
Macromelt 6206 Macromelt 6206 is a moldable polyamide with excellent adhesion to tough substrates.
Macromelt 6211 Good low temperature and adhesion properties
Macromelt MM 6208S Low pressure molding polyamide with good adhesion to plastics.
Macromelt MM Q-5375 Macromelt MM Q-5375 is a moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates.
Macromelt MM6208 Low pressure molding
Macromelt OM 633 Moldable polyamide with good adhesion to plastics and a service temperature up to 125°C such as in an automotive firewall
Macromelt OM 638 Moldable polyamide with service temperature up to 125°C such as in an automotive firewall
Macromelt OM 641 Moldable polyamide where strength and hardness are needed such as in memory sticks and computer connectors
Macromelt OM 646 Macromelt OM 646 is a moldable polyamide where strength and increased hardness are needed such as in memory sticks and computer connectors.
Macromelt OM 657 Macromelt OM 657 is a moldable polyamide where excellent adhesion to plastics and cold temperature flexibility are important such as in an automotive exterior.
Macromelt OM 673 Moldable polyamide with good adhesion for higher temperature applications such as in an automotive under-hood
Macromelt OM 678 Macromelt OM 678 is a moldable polyamide with good adhesion and high temperature resistance for applications such as in an automotive under-hood.
Macromelt OM 682 Macromelt OM682 is a moldable polyamide with high temperature resistance for the most demanding high humidity applications such as on the inside of automobile tires.
MACROMELT OM648 Macromelt OM648 is designed for bonding of cylindrical fitting parts. Cures when confined in the absence of air between close fitting.
Minico M2000 RS MOD2 Series ACHESON Minico M2000RS MOD2 are a series of one component screen printable resistive carbon inks.
Minico M4100 Minico M4100 is a one component electroless nickel plateable, conductive polymer.
Multicore 381 Cored Wire
Multicore C400 Flux Cored Wire MULTICORE C400 Flux Cored Wire Halide-free, no-clean, clear residue, increased flux content for improved wetting.
Multicore C502 Cored Wire Solder materials -Cored Wire
Multicore C511 MULTICORE C511 cored solder wire has been specially formulated to compliment no clean wave and reflow soldering processes.
MULTICORE CR37 solder paste MULTICORE CR37 solder paste is suitable for most assembly processes.
Multicore DA100 Solder Paste Multicore DA100 is a flux designed for solder die attach paste applications.
Multicore DA101 Die attach solder paste
Multicore FluxPen Hydro-X20 Multicore FluxPen Hydro-X20 is a controlled release, water wash, VOC Free, liquid flux and cleaner pen applicator. Range of compatible flux types available.
MULTICORE HF108 MULTICORE HF108 is a halogen-free, no clean, low voiding Pb-free solder paste development product. HF108 also shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including Immersion Ag and OSP copper.
Multicore HF200 Multicore HF200 is a Halogen-free, no clean, low voiding Pb-free solder paste.
MULTICORE HF208 MULTICORE HF208 is a halogen-free, no clean, low voiding Pb-free solder paste. It shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including OSP copper.
Multicore Hydro-X Flux Cored Wire MULTICORE Hydro-X cored wire is a high activity, water washable flux with excellent wetting on difficult substrates.
Multicore Hydro-X20 High Activity Flux Multicore Hydro-X20 is a high activity, water wash, VOC Free, liquid flux designed for the soldering of the most difficult electronic assemblies.
Multicore LF318 No-Clean Solder Paste: Lead-Free Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF318 No-Clean Solder Paste: Lead-Free Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF318 No-Clean Solder Paste: Lead-Free Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF318 No-Clean Solder Paste: Lead-Free (96SC AGS 88.5) Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF318 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5) Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
Multicore LF318 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5V) Multicore LF318 solder paste is a halide-free, no clean lead free, pin testable solder paste.
MULTICORE LF318M Ultra low voiding lead free solder paste MULTICORE LF318M halide-free, no clean, low voiding Pb-free solder paste.
Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding Multicore LF328 is a halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing.
Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding (96SC AGS 88.5) MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing.
Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding (97SC DAP 88.5) Multicore LF328 is a halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing.
Multicore LF600 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5V) Multicore LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability.
Multicore LF600 No-Clean Solder Paste: Lead-Free (97SC DAP 88.5V) Multicore LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability.
Multicore LF620 Halide-free, no clean lead free, low voiding solder paste with excellent humidity resistance and broad process window. Suitable for both reflow and printing.
Multicore LF700 A halide-free, no clean lead free solder paste with a broad process window for printing, reflow and humidity resistance.
Multicore LF721 Multicore LF721 is a halide-free, no clean, low voiding Pb free solder paste.
MULTICORE LF721 RWF MULTICORE LF721 RWF is a reworkable tacky flux designed for a wide range of electronics assembly and rework processes. It is recommended for rework processes in conjunction with MULTICORE LF721.
Multicore LF722 Multicore LF722 is a halide-free, no clean, low voiding Pb-free solder paste.
Multicore LF730 Halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow.
MULTICORE LM100 no clean flux solder paste MULTICORE LM100 no clean flux solder paste
Multicore MCF800 Multicore MCF800 is designed for the effective removal of all types of soldering process residues from circuit boards, screens, fixtures and equipment.
Multicore MF210 Liquid Flux Multicore MF210 is a no clean, resin-free, halide-free liquid flux designed for surfaces with poor solderability.
MULTICORE MF388 No Clean Flux MULTICORE MF388 sustained activity in high pre-heats for dual wave and lead-free processes. High PTH fill, low residues. High reliability.
MULTICORE MF390HR MULTICORE MF390HR is an halogen free, no clean liquid flux. It is used in the automotive, consumer & industrial electronics and the defense & aerospace markets.
MULTICORE MP200 MULTICORE MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both air and nitrogen. It has been formulated to have increased reflow operating window.
Multicore MP218 No-Clean Solder Paste: High humidity and temperature resistance MULTICORE MP218 solder paste is a halide-free, no clean tin lead, pin testable solder paste which has excellent humidity resistance and a broad process window both for reflow and printing.
Multicore NC-00 Solder wicks
Multicore NC-AA Solder wicks
Multicore NC-AB No Clean desoldering wick MULTICORE NC-AB No clean desoldering wick.
Multicore NC-BB No Clean desoldering wick Multicore NC-BB No Clean desoldering wick
Multicore SC01 Multicore SC01 is designed for the stencil cleaning and hand cleaning of process soldering residues. A highly effective cleaner that dries rapidly (fast evaporation).
Multicore Spot-On Multicore Spot-On is a temporary solder resistance designed to be used on printed circuit boards prior to soldering and will withstand fluxing and wave soldering operations.
Multicore TFN600 Tacky flux used in hanheld devices
Multicore TFN700B Newtonian tacky flux designed for PoP applications.
Multicore TFN800HF-BLUE PoP tacky flux
Multicore TTC-LF Lead-Free Tip Tinner Multicore TTC-LF is a handy, non-abrasive, solder iron tip tinner. Easily wets hot solder irons leaving a brightly tinned tip.
Multicore WS300 WS300 TACKY FLUX Multicore WS300 is a water wash flux system specially formulated with fine-powder lead-free alloys.
Multicore WS300 WS300HV TACKY FLUX Multicore WS300 is a water wash flux system specially formulated with fine-powder lead-free alloys.
Multicore X32-10I No Clean Flux Multicore X32-10I No Clean Flux is a low solids synthetic resin liquid flux that meets global demand for ultra low residue medium activity tacky flux.
Optal 4079 Consumer packaging jelly gum bottle labeling adhesive
Purmelt QR 5301 Premium product for PVC and aluminum profiles, problem solver.
QMI529HT-LV2C1.5 Hysol QMI529HT-LV2C1.5 electrically conductive adhesive is designed for die attach applications. It is recommended for use in the attachment integrated circuits and components onto metallic leadframes.
Stycast CAT 11 Catalyst used with Stycast resins.
STYCAST EO2000HV STYCAST EO2000HV one component, oxide-filled epoxy adhesive used in potting.
Technomelt PA 341 Technomelt PA 341 is a high performance thermoplastic polyamide designed to offer blaze orange color for easy identification of components. It is typically used to encapsulate high voltage modules.
TECHNOMELT PA 6208

Low pressure molding.

TECHNOMELT PA 652

Moldable polyamide where excellent adhesion to plastics and cold temperature flexibility are important such as in an automotive exterior.

TECHNOMELT PA 7808 BLACK Low pressure molding polyamide with good adhesion to plastics.
TECHNOMELT PA 7833 Moldable polyamide with good adhesion to plastics and a service temperature up to 125°C such as in an automotive firewall
TECHNOMELT PA 7838 BLACK Moldable polyamide with service temperature up to 125°C such as in an automotive firewall
Terostat SA-415 Catalyst used with Stycast resins.
XCS80091-2 Flexible, general conductive, low stress, low temperature cure, paste adhesive.