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Circuit Board Protection
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Game Changing Solder
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Thermal Materials
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Water Wash Solder
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Welcome To Henkel Electronics

A total materials solution provider for semiconductor and electronics assembly


Circuit Board Protection

More information

Game Changing Solder

Access exclusive content

Thermal Materials

Product information

Water Wash Solder

More information

Henkel is the world’s leading and most progressive provider of qualified, materials for semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions.  The breadth of Henkel’s product portfolio delivers cost-effective solutions for any manufacturing challenge.

There are hundreds of different ways in which Henkel electronic adhesives can enhance the quality and efficiency of electronic components.

Adhesives for Electronics: An Industry Leader
Henkel is a major supplier to the electronics industry. Focused solutions backed by industry specific collateral and the best in-class support available have resulted in long-term relationships with satisfied customers.

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Electronics News

11/18/2016
Henkel Wins Best Paper Award at IPC India Conference
With shrinking dimensions and increased function, the need for adaptable and effective thermal solutions to ensure electronics reliability is greater than ever before.  This indisputable reality was at the fore during Henkel’s paper presentation during the recent IPC India Conference, which took place alongside Electronica/Productronica India 2016.  In fact, the subject is so important that the paper, entitled “High Efficiency Liquid Gap Filler Materials”, earned the conference’s Best Paper Award.  more...
07/27/2016
New Silicone Sealant Technology from Henkel Offers Automotive Module Manufacturers Process Flexibility through Unique Cure Capability

A brand new silicone adhesive sealant technology from Henkel Adhesive Electronics provides both high performance and process flexibility. The new material, BERGQUIST TLB 400 SLT, is a two-part silicone sealant designed for automotive module applications. With an adaptable thermal cure profile that enables full cure at temperatures from 25°C to 180°C, the technologically advanced sealant allows automotive specialists to accommodate various manufacturing protocols.

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06/29/2016
Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities

Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of award-winning GAP PAD thermal interface materials (TIMs). The new GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components.

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