White Papers

Low-Stress Die Attach for High Reliability Smart Cards

Henkel has developed a new die attach formulation designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market.
- Simon Turvey

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High Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-level Exposed Pad Performance

Reliability testing for conductive Die Attach Film (CDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2.
- Andrew Laib, Pukun Zhu, Mario Saliba and Jihong Deng

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Solder Materials Science Gets Small

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
-Neil Poole, Ph.D. and Brian Toleno, Ph.D.

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Reliability that Sticks: Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well known?
 - Art Ackerman and Jason Brandi
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Lead-free for High-reliability

Lead-free for High-reliability, High-temperature Applications
-Hector Steen, Ph.D. and Brian Toleno, Ph.D.

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Flip-Chip Process Improvements for Low Warpage

Mechanical stress in flip-chip (FC) assemblies
-Robert L. Hubbard, Pierino Zappella, Pukun Zhu

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Epoxy Flux Technology

Epoxy Flux Technology – Tacky Flux with Value Added Benefits
-Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu

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Advancements In Packaging Technology

Advancements In Packaging Technology Driven By Global Market Return
-M. G. Todd

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