Mid-chip solder balling is an occurrence that can be caused by more than one errant manufacturing process. The most efficient means of eliminating this defect is a process modification that removes paste from under a component pad. This study details the research and experiments with different solder pastes and flux systems that prompted this conclusion.
- Neil Poole, Ph.D; Wanda O`Hara
In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.
- Mark Currie, Ph.D; Neil Poole, Ph.D; Wanda O’Hara and Doug Dixon
Recognized for the increasing requirement for lower-stress materials for next-generation high power density devices, Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology.
- Danny Leong
Henkel has developed a waterproof sealing adhesive for camera module lens bonding – yet another milestone on the path to fully waterproofed smartphone and wearable devices.
- Raj Peddi
In this technical article, a drop-in replacement for standard lead alloys that virtually eliminates tombstoning is detailed (Source: SMT).
- Malcom Warwick, Ph. D.
Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.
- Art Ackerman
Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability.
- Raj Peddi and Wei Yao, Ph.D.
In this white paper, Henkel presents its phase change material options – both roll processed as sheets and die-cut parts as well as compounds that can be screened/stenciled, and its new developments in thin bond line, high thermal conductivity and cure-in-place gels for high reliability applications.
- Sanjay Misra, Ph.D.
LOCTITE GC 10 – the market’s first-ever temperature stable solder paste – offers the unprecedented ability to ship the material via standard shipping and without any cold-packing requirements and can be stored at room temperature – no refrigeration required.
- Mark Currie, Ph. D.
Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5° C for one year and at 40° C for one month. While transport and logistics become far less complex and costly, LOCTITE GC 10’s production performance is what truly has manufacturers taking note.
- Ian Wilding
Henkel’s new inks have been designed with a broad range of electrical conductivity to allow lower ink consumption and increased design flexibility in low VOC formulations.
- Todd Williams
Henkel has developed a comprehensive portfolio of products to address all of the demands of fingerprint sensor manufacture – the fastest growing contact biometrics market.
- Raj Peddi
Henkel has developed a new die attach formulation designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market.
- Simon Turvey
Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures.
- Ian Wilding and Gavin Jackson
Reliability testing for conductive Die Attach Film (CDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2.
- Andrew Laib, Pukun Zhu, Mario Saliba and Jihong Deng
Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
-Neil Poole, Ph.D. and Brian Toleno, Ph.D.
When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well known?
- Art Ackerman and Jason Brandi
Lead-free for High-reliability, High-temperature Applications
-Hector Steen, Ph.D. and Brian Toleno, Ph.D.
Mechanical stress in flip-chip (FC) assemblies
-Robert L. Hubbard, Pierino Zappella, Pukun Zhu
Epoxy Flux Technology – Tacky Flux with Value Added Benefits
-Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu
Advancements In Packaging Technology Driven By Global Market Return
-M. G. Todd