White Papers


Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect

In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

- Mark Currie, Ph.D; Neil Poole, Ph.D; Wanda O’Hara and Doug Dixon


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High Power Density Applications Enabled by New Thermal Interface Material

Recognized for the increasing requirement for lower-stress materials for next-generation high power density devices, Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology.
- Danny Leong


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Waterproof Sealant for Camera Modules

Henkel has developed a waterproof sealing adhesive for camera module lens bonding – yet another milestone on the path to fully waterproofed smartphone and wearable devices.
- Raj Peddi

 

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Tombstoning Reduction via Phased-reflow Soldering Technical Article

In this technical article, a drop-in replacement for standard lead alloys that virtually eliminates tombstoning is detailed (Source: SMT).
- Malcom Warwick, Ph. D.

 

 

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Undressing Wearables: Electronic Materials are Essential to Function and Reliability

Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.
- Art Ackerman

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Customizable Silicone Materials for Advanced MEMS Performance

Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability.
- Raj Peddi and Wei Yao, Ph.D.

 

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Beyond Thermal Grease: Enhancing Thermal Performance and Reliability

In this white paper, Henkel presents its phase change material options – both roll processed as sheets and die-cut parts as well as compounds that can be screened/stenciled, and its new developments in thin bond line, high thermal conductivity and cure-in-place gels for high reliability applications.
- Sanjay Misra, Ph.D.

 

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Temperature Stable Solder Paste Transforming Industry Mindset

LOCTITE GC 10 – the market’s first-ever temperature stable solder paste – offers the unprecedented ability to ship the material via standard shipping and without any cold-packing requirements and can be stored at room temperature – no refrigeration required.
- Mark Currie, Ph. D.


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First-Ever Temperature Stable Solder Paste Unveiled: Major Development in Solder Paste Formulation Set to Change Market Paradigms

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5° C for one year and at 40° C for one month. While transport and logistics become far less complex and costly, LOCTITE GC 10’s production performance is what truly has manufacturers taking note.
- Ian Wilding

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New Printed Ink Technologies Allow Lower Material Use, New Product Functionality

Henkel’s new inks have been designed with a broad range of electrical conductivity to allow lower ink consumption and increased design flexibility in low VOC formulations.
- Todd Williams


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Personal Identity Verification Made Possible by Advanced Materials

Henkel has developed a comprehensive portfolio of products to address all of the demands of fingerprint sensor manufacture – the fastest growing contact biometrics market.
- Raj Peddi

 

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Low-Stress Die Attach for High Reliability Smart Cards

Henkel has developed a new die attach formulation designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market.
- Simon Turvey

 

 

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High-Reliability Meets Pb-free and Halogen-Free: The Ultimate Solder Material Trifecta

Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures.
- Ian Wilding and Gavin Jackson

 

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High Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-level Exposed Pad Performance

Reliability testing for conductive Die Attach Film (CDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2.
- Andrew Laib, Pukun Zhu, Mario Saliba and Jihong Deng

 

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Solder Materials Science Gets Small

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
-Neil Poole, Ph.D. and Brian Toleno, Ph.D.

 

 

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Reliability that Sticks: Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well known?
 - Art Ackerman and Jason Brandi


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Lead-free for High-reliability

Lead-free for High-reliability, High-temperature Applications
-Hector Steen, Ph.D. and Brian Toleno, Ph.D.

 

 

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Flip-Chip Process Improvements for Low Warpage

Mechanical stress in flip-chip (FC) assemblies
-Robert L. Hubbard, Pierino Zappella, Pukun Zhu

 

 

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Epoxy Flux Technology

Epoxy Flux Technology – Tacky Flux with Value Added Benefits
-Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu

 



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Advancements In Packaging Technology

Advancements In Packaging Technology Driven By Global Market Return
-M. G. Todd

 

 

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