News 2016

Henkel Wins Best Paper Award at IPC India Conference 
With shrinking dimensions and increased function, the need for adaptable and effective thermal solutions to ensure electronics reliability is greater than ever before.  This indisputable reality was at the fore during Henkel’s paper presentation during the recent IPC India Conference, which took place alongside Electronica/Productronica India 2016.  In fact, the subject is so important that the paper, entitled “High Efficiency Liquid Gap Filler Materials”, earned the conference’s Best Paper Award.  more...
Henkel's Latest Printed Electronics Innovations on Show at IDTechEX 2016 

From booth #I10 at this month’s IDTechEX Printed Electronics USA event, taking place November 16 and 17 in Santa Clara, California, Henkel Adhesive Technologies will highlight its strong focus on material solutions for printed electronics. Decades of formulation expertise have resulted in brand new LOCTITE highly conductive silver ink materials and inks to build force sensors, which are important developments for enabling next-generation printed electronics applications.

Henkel’s portfolio of LOCTITE GC solder paste materials deliver unprecedented stability both on and off the line.
Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016 
September 20, 2016 – From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.  more...
New Silicone Sealant Technology from Henkel Offers Automotive Module Manufacturers Process Flexibility through Unique Cure Capability 

A brand new silicone adhesive sealant technology from Henkel Adhesive Electronics provides both high performance and process flexibility. The new material, BERGQUIST TLB 400 SLT, is a two-part silicone sealant designed for automotive module applications. With an adaptable thermal cure profile that enables full cure at temperatures from 25°C to 180°C, the technologically advanced sealant allows automotive specialists to accommodate various manufacturing protocols.

Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities 

Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of award-winning GAP PAD thermal interface materials (TIMs). The new GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components.

Henkel Gives Display Customers a Competitive Edge with New Precise Edge Control (PEC) LOCA 

Henkel Adhesive Technologies’ Electronics business has developed and commercialized a novel suite of liquid optically clear adhesive (LOCA) materials that offer significant process and design enabling capabilities for touch screens including smart phone, notebook, all-in-one (AIO) PC and large format displays. The new Loctite® brand materials are precise edge control (PEC) LOCA formulations that allow for the construction of displays with narrow bezel and ultra-narrow bezel architectures.

Henkel Honors Manufacturing Representative, E-Tronix, with its Fifth North American Representative of the Year Award 

Henkel Adhesive Technologies’ Electronics business has named E-Tronix its 2015 North American Manufacturing Representative of the Year. This is the fifth time in six years that the company has earned this distinction, which Henkel awards to its top performing representative as measured against very stringent criteria.

Henkel Partners with Tekra to Expand Coverage of its Electronic Inks Business in North America 

Henkel Adhesive Technologies’ Electronics business today announced a new distribution partnership with plastic film and adhesives solutions provider, Tekra, A Division of EIS, Inc. Under the terms of the agreement, Tekra will deliver sales, technical consultation and post-sale service for Henkel’s full line of electronic ink materials in support of customers throughout North America.

Henkel Solder and Thermal Innovations Earn Industry Recognition 

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas. Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product development. Hosted by Circuits Assembly magazine, the NPI Award recognizes leading new products introduced to the market over the last 12 months.

Henkel to Showcase Loctite® GC 10 Success alongside Distributor, AAT Aston, at SMT Hybrid Packaging 2016 

Henkel Adhesive Technologies’ Electronics business will highlight the success of its temperature stable Loctite® GC 10 solder paste at the upcoming SMT Hybrid Packaging event, taking place from April 26-28 in Nuremberg, Germany. The company will exhibit with its Central European distributor, AAT Aston GmbH (Aston), in Hall 7, Booth 349 and showcase how the strong, 20-year Henkel-Aston partnership and the unprecedented performance of Loctite GC 10 have accelerated adoption of the material with customers in the region.

Henkel Granted China Patent for Two-Component Fluid Dispensing System 

Henkel Adhesive Technologies is pleased to announce that the State Intellectual Property Office of the P.R.C. (SIPO) has granted China Patent No. CN 203525578 U in recognition of the company’s innovation, relating to a fluid dispensing system that provides precision ratio metering and fluid flow shut-off of a mixed fluid.

Henkel Develops Thermally Conductive Technomelt® Solution 

Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.

New Technomelt® Material Streamlines Substrate Coating Processes 

Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.

Benoit Pouliquen to Lead Electronics Business of Henkel Adhesive Technologies 

Benoit Pouliquen has been appointed as Corporate Senior Vice President and Global Head of the Electronics business of Henkel Adhesive Technologies. He is succeeding Alan Syzdek who retired last year.

Comprehensive Lighting Solutions 

From Hall 4, Booth G61 at the upcoming Light & Building event taking place March 13 through 18 in Frankfurt, Henkel Adhesive Technologies will showcase its total solutions approach to modern lighting applications. With an innovative materials portfolio that addresses the full spectrum of lighting manufacturing requirements – from semiconductor packaging to solder to thermal management and encapsulation – Henkel delivers a single supplier alternative.

Henkel Changes the Game Again New, Innovative Materials to Debut at APEX 2016 

Since its introduction at last year’s APEX event, the global adoption of Loctite® GC 10 temperature stable solder paste and its excellent in-process performance have been unprecedented. At APEX 2016, Henkel Adhesive Technologies will highlight the success of this ground-breaking material and showcase its new water soluble counterpart, Loctite GC 3W – another game-changer for the electronics market.

Henkel Expands Partnership with Ellsworth Adhesives through New Moldman Systems LLC Equipment Division 

Henkel Adhesive Technologies’ long-time business relationship with global distributor Ellsworth Adhesives has grown to now include Moldman Systems LLC, which was acquired by Ellsworth Corporation in 2014. Henkel previously worked with Moldman Systems’ low pressure molding equipment through its former owner, but the new ties to Ellsworth Adhesives significantly expand worldwide sales and support opportunities.