2/14/2017, Irvine, CA
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Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications
“Excellent results and process adaptability underpin our latest development initiative,” says Ian Wilding, Henkel Global Technology Director, explaining LOCTITE HF 2W’s manufacturing advantages. “The unique formulation allows a tin-lead solder paste to work seamlessly with lead-free components, which is essential for the reliability of many mission-critical applications.”
LOCTITE HF 2W is available with a standard, tin-lead Sn63 eutectic alloy, as well as Henkel’s proprietary anti-tombstoning 63S4 alloy. The material’s properties allow it to reflow at high temperatures, expanding the reflow process window to facilitate strong intermetallic formation between the tin-lead paste and lead-free and tin-lead components. The result is excellent solderability in air or nitrogen across a broad range of challenging surface finishes including OSP-Cu, ENIG and silver.
The material is suitable for high-speed, fine-pitch printing, with a wide print window and excellent results on components as small as 0201s, keeping defects such as solder bridging to a minimum. In addition, LOCTITE HF 2W flux residues can be cleaned via ultrasonic and spray under immersion cleaning processes as many as seven days post-assembly, providing assembly specialists with maximum flexibility.
LOCTITE HF 2W has been formulated for high-reliability applications such as those found in the medical, hard disk drive, aerospace and defense markets, among others. For more information, visit www.henkel-adhesives.com/electronics. To order a sample of LOCTITE HF 2W for evaluation, call 888.943.6535.