1/31/2018, Irvine, CA

 
 
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Henkel to debut new materials, share expertise at IPC APEX Expo 2018

Coming off a historic 2017 during which the electronics business of Henkel Adhesive Technologies launched over 50 new products and enjoyed significant sales wins, the company is poised to have a repeat performance this year.  At IPC APEX Expo in San Diego, CA, the Henkel team will showcase a host of new products in booth # 3001 and share its knowledge base in paper presentations during the event’s conference.

“Henkel’s innovation portfolio – from package-level EMI solutions to board-level interconnect and protection materials to thermal management products – has driven customer success in all of our core markets,” says Henkel Global Marketing Director, Doug Dixon, noting the company’s leadership position in the semiconductor packaging, automotive, consumer and industrial sectors. “Enabling our customers’ competitiveness has led to one of the most exciting growth years on record. We look forward to sharing the products and expertise fueling this progress with APEX show delegates.”

Expanding on its process-enhancing masking material that was introduced just over a year ago, Henkel has brought to market a next-generation version of the TECHNOMELT solution which delivers greater visibility for application and removal. The new formula offers all of the automation, cost reduction and precision advantages over conventional masking techniques, but is now also available in a colored version for high visibility of the material to facilitate even more accurate application and thorough removal from PCBs and components. TECHNOMELT masking materials, in addition to TECHNOMELT molding formulations, will be demonstrated live in the Henkel booth on LPMS USA dispensing and molding equipment.

Brand new solder pastes will also be on show at APEX, with two materials that leverage the chemistry platform of Henkel’s multi-award-winning, temperature stable LOCTITE GC 10. At APEX 2018, the company will introduce customers to LOCTITE GC 18, an ultra-low voiding, Type 4 formula designed to reduce voiding on components such as QFNs and LGAs; and, LOCTITE GC 50, a jettable, Type 5 material to accommodate applications that incorporate flexible substrates, intricate board configurations and complex, ultra-fine pitch architectures. Henkel solder technologists will be at the booth to discuss both materials, which are available for immediate sampling.

During the conference portion of the event, Henkel thought leaders will share their materials expertise. Show attendees who are interested in TECHNOMELT as a masking alternative should register to attend the “Residue Analysis of Masking Alternatives for Advanced Electronics” paper by Henkel Senior Technical Service Engineer Dave Edwards, on Tuesday, February 27th at 3:30 p.m. The presentation will compare various masking methods and share residue analysis results.

The following day, Dr. Neil Poole, Henkel Chemistry Fellow, presents a paper entitled “Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount Assembly”, which discusses the design process employed to address an urgent industry requirement for an advanced solder paste evaluation test board. The new material analysis tool takes into account current and future dimensional challenges, processing variables and reliability expectations. Sample test boards will also be available at Henkel booth # 3001.

For more information about Henkel’s complete electronic materials portfolio, visit www.henkel-adheisves.com/electronics.