4/18/2016, Irvine, CA

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Henkel Solder and Thermal Innovations Earn Industry Recognition

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas. Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product development. Hosted by Circuits Assembly magazine, the NPI Award recognizes leading new products introduced to the market over the last 12 months.

Henkel won its third consecutive NPI award in the Solder Materials category, underscoring the company’s industry dominance in solder materials innovation. This year, Henkel’s water soluble solder paste, Loctite GC 3W, was the winner among competitive solder products. A lead-free, halogen-free, halide-free material, Loctite GC 3W combines high-activity flux performance and temperature stability. Even at storage temperatures of up to 26.5°C for six months and up to 40°C for one month, the process integrity of Loctite GC 3W is uncompromised. The material washes clean in aqueous cleaning systems without the addition of saponifiers or co-solvents, and residues can be cleaned as late as seven days following assembly. Stencil life and abandon times are also improved versus previous-generation water soluble solder pastes, at >8 hrs. and >4 hrs., respectively.

Commenting on the NPI Award program and Henkel’s long record of wins, Circuits Assembly magazine Editor-in-Chief Mike Buetow says, “Henkel's long history of process-enabling product formulation is impressive. Clearly, its efforts in chemistry innovation haven’t been lost on the NPI judging panel. We’re delighted Henkel continues to participate and use the NPI Award as one of its many benchmarks for new product success.”

The second NPI honor was awarded to Gap Pad EMI 1.0, which picked up the top prize in the contest among underfill and thermal interface materials suppliers. Recognizing the challenges that miniaturization, higher functionality and greater component density have placed on assembly specialists, Henkel developed the dual-function Gap Pad EMI 1.0 thermal interface material to address the requirements of both heat dissipation and electromagnetic interference (EMI) control in a single material solution. The highly-flexible and compliant gap filling product has been designed to exhibit exceptionally low stress on solder joints for improved reliability. Gap Pad EMI 1.0 provides thermal conductivity of 1.0 W/m-K and EMI absorption for frequencies above 1GHz, making the material ideal for power electronics, consumer, telecommunications, automotive and Wi-Fi/Bluetooth-enabled LED lighting applications.

“Henkel continues to drive material innovation at an unprecedented pace, delivering products that enable new application development, improve time-to-market and provide a competitive advantage,” says Doug Dixon, Henkel Global Marketing Communications Director. “We are grateful to the NPI Awards judging panel for recognizing Henkel’s contributions to technology advancement.”

For more information on Henkel’s electronic materials solutions, visit www.henkel-adhesives.com/electronics.