2/3/2016, Irvine, CA

 
 
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Henkel Expands Partnership with Ellsworth Adhesives through New Moldman Systems LLC Equipment Division

Henkel Adhesive Technologies’ long-time business relationship with global distributor Ellsworth Adhesives has grown to now include Moldman Systems LLC, which was acquired by Ellsworth Corporation in 2014. Henkel previously worked with Moldman Systems’ low pressure molding equipment through its former owner, but the new ties to Ellsworth Adhesives significantly expand worldwide sales and support opportunities.

“For years, the combination of Henkel’s TECHNOMELT® low pressure molding materials and Mold-Man® equipment has delivered a fast and effective alternative to conventional potting processes,” explains Henkel Global Product Manager Circuit Board Protection, Art Ackerman. “Now backed by Ellsworth Adhesives’ expansive global network, electronics customers around the world will have greater access to this novel encapsulation solution.”

Henkel’s award-winning TECHNOMELT® polyamide hotmelt materials are enabling applications in multiple markets including medical, wearables, automotive, industrial and telecom, and are revered for their process simplicity and functional effectiveness. Via Mold-Man® low pressure molding equipment, TECHNOMELT® materials are melted, molded and cooled around electronics devices to form a functional, fully-enclosed assembly. As Ellsworth Adhesives has been a distributor of TECHNOMELT® materials for more than 15 years, its familiarity with the product line makes the company’s expanded Moldman Systems LLC partnership with Henkel a natural fit.

“Henkel consistently develops innovative electronic materials that address challenging market requirements,” says Roger Lee, Ellsworth Adhesives Vice President and General Manager, North America, “and our enduring business relationship has been highly successful. By leveraging our global reach, which includes 38 Ellsworth Adhesives locations and an international team of more than 150, we are confident that we can deliver the advantages of low pressure molding and the TECHNOMELT® - Mold-Man® solution to even more customers globally.”

For more information, visit www.henkel.com/electronics and www.moldmansystems.com. To see TECHNOMELT® materials demonstrated live with the new Mold-Man®1050 tabletop system, visit Henkel in booth 413 at the upcoming MD&M West event in Anaheim, CA taking place from February 9-11. (http://b.mdmwest.mddionline.com)

MOLD-MAN is a registered trademark of Moldman Systems LLC. All other marks are trademarks and/or registered trademarks of Henkel and its affiliates in the US and elsewhere.