News 2015

12/08/2015
Henkel’s GAP FILLER 1400SL Offers Robust Thermal Performance and Void Filling Capabilities 

Henkel Adhesive Technologies continues to expand its thermal materials portfolio and today announced the development and commercialization of GAP FILLER 1400SL. An evolution in thermal interface materials, GAP FILLER 1400SL combines the properties of low viscosity and, relative to conventional self-leveling products, comparatively high thermal conductivity in a unique formula designed to accommodate challenging architectures.

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11/30/2015
Henkel’s New Low-Volatility GAP FILLER 3500LV Delivers Excellent Thermal Performance 

Addressing the thermal requirements of next-generation product designs, Henkel Adhesive Technologies has formulated GAP FILLER 3500LV, a liquid gap filler material that delivers high thermal conductivity and low volatility for reduced outgassing.

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11/17/2015
Henkel Selected as Morey Corporation’s Primary Solder and Adhesive Provider 

Building on a business relationship that spans more than three decades, Henkel Adhesive Technologies announces that The Morey Corporation (Morey) has named the company its primary partner for supplying solder and adhesive materials for the production of advanced electronic technology. Located in suburban Chicago, Morey utilizes more than 15 Henkel products, including its most recent innovation, LOCTITE® GC 10 solder paste, within its 24/7, 240,000 square-foot manufacturing facility.

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09/28/2015
Henkel Expands Temperature Stable Solder Portfolio; Develops Water Washable Solder Paste 

In early 2015, Henkel introduced the electronics market to the first-ever temperature stable solder paste, LOCTITE GC 10. Building on this success, the company has now developed a lead-free, halogen-free water washable solder paste that leverages this formulation know-how and has shown equally impressive results.

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09/22/2015
Henkel forms Partnership with LPMS USA to Broaden Customer Access to TECHNOMELT Low Pressure Molding Processes 

In a move designed to offer customers greater access to low pressure molding solutions and its award-winning TECHNOMELT materials, Henkel Adhesive Technologies has formed a partnership with leading molding equipment manufacturer, LPMS USA.

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09/08/2015
Henkel's Temperature Stable LOCTITE GC 10 Solder Paste Living Up to its Game-Changing Promise 

Since its official debut in February, over 1,000 sample requests of the material have been fulfilled and customers who have qualified the game-changing solder paste are singing its praises.

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08/17/2015
Henkel Develops First-Ever Extremely Low Stress Thermal Interface Material with EMI Absorption Capabilities 

Henkel today announced that it has developed the market's first-ever extremely low stress thermal interface material that unites thermal conductivity with EMI absorption capabilities.

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07/15/2015
Henkel Featured in MEPTEC Report 

The Henkel company and its innovations have been profiled in the Summer 2015 edition.

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06/16/2015
Henkel Receives Two Pinnacle Awards and an Above and Beyond Award from Delphi 

The Electronics Group of Henkel today announced that it has received two 2014 Pinnacle Awards and one Above and Beyond Award from Delphi Automotive PLC - its prestigious supplier honors - during Delphi's Global Supplier Conference & Pinnacle Awards event in Shanghai, China.

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06/09/2015
Henkel Leads Series C Investment in Vitriflex, Inc.; Reaffirms Commitment to Next-Generation Display Technologies 

Based on the strong, continued progress in developing customized, integrated barrier films for display applications, The Electronics Group of Henkel announced today that it has made an additional investment in ultra-barrier film technology innovator, Vitriflex, Inc.

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03/18/2015
Henkel’s New Game Changing Solder Paste Wins NPI Award 

The launch of Henkel’s much-anticipated game changing solder paste, LOCTITE GC 10, at the recent APEX event did not disappoint. Customers and booth visitors were intrigued and the industry took note.

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02/24/2015
Henkel Develops Market’s First - Ever Temperature Stable Solder Paste, LOCTITE GC 10 

In a major materials development breakthrough that is set to change current solder paste processing performance and cost paradigms, The Electronics Group of Henkel announces the launch of the first-ever temperature stable solder paste material.

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02/24/2015
Brian Betti Named Americas Sales Director for The Electronics Group of Henkel 

The Electronics Group of Henkel has appointed Brian Betti as the company’s new Americas Sales Director.

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02/16/2015
Henkel to Debut New Solder Paste, Highlight Novel Protection and Thermal Materials at APEX 2015 

At the upcoming APEX event, set to take place February 24 – 26 in San Diego, California, The Electronics Group of Henkel plans to unveil a breakthrough solder material, showcase several novel innovations that are lending new levels of protection and performance to next-generation devices and introduce the line of Bergquist thermal management materials.

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