02/16/2015

 

Henkel to Debut New Solder Paste, Highlight Novel Protection and Thermal Materials at APEX 2015

At the upcoming APEX event, set to take place February 24 – 26 in San Diego, California, The Electronics Group of Henkel plans to unveil a breakthrough solder material, showcase several novel innovations that are lending new levels of protection and performance to next-generation devices and introduce the line of Bergquist thermal management materials.

On day one of the show, Henkel plans to reveal its latest innovation: a brand new solder paste material built on a platform that delivers unmatched material stability. Though details of the new paste will not be shared until February 24th, widespread testing and evaluation have already confirmed its significance. The stability of the new LOCTITE brand solder paste delivers tremendous performance improvements on the line, as well as benefits for transportation and storage requirements. Visitors to Henkel Booth 2309 can see the new material in action, as live printing demonstrations will take place onboard an ASM Assembly Systems DEK Horizon 03iX printer throughout the APEX event. 

“This new solder material has been a long time coming,” says Dr. Mark Currie, Henkel Global Product Manager for Solder Materials. “It addresses all of the industry’s concerns and wishes for delivery improvements, storage robustness and performance during printing and reflow. We can’t wait to share this game-changing material with the wider marketplace on February 24th.”

In addition to the new solder paste debut, Henkel Booth 2309 will play host to the company’s full range of device protection materials – from TECHNOMELT low pressure molding materials to LOCTITE underfills and encapsulants. Visitors to the Henkel booth can see live demonstrations of the TECHNOMELT molding process, which provides a viable alternative to traditional potting techniques with single-material processing and the ability to accommodate sensitive components and circuitry. The latest TECHNOMELT materials -- which include white, transparent and chemically-resistant formulas -- will be on show.

Henkel’s emphasis on device protection and high reliability will also be underscored at the APEX event. The industry’s dramatic pace of miniaturization and the increasingly demanding requirements of automotive electronics prioritize the need for robust, underfills and high-reliability encapsulants. The full portfolio of LOCTITE brand materials will be highlighted, with particular emphasis on LOCTITE FP 4531, LOCTITE E1216M and LOCTITE ECCOBOND UV 9052. LOCTITE FP 4531 and LOCTITE E1216M are high-reliability underfill materials with excellent performance for automotive applications -- the former for rugged, under hood situations and the latter for in-cabin systems and sensors. Protection of automotive in-cabin and handheld devices is achieved with Henkel’s novel encacpsulant, LOCTITE ECCOBOND UV 9052. Fast UV curing, excellent fluid resistance and robust safeguarding of moisture-sensitive components make LOCTITE ECCOBOND UV 9052 ideal for applications such as automotive camera modules and chip-caps used in handheld and medical products.

Finally, APEX provides the perfect venue at which to showcase the latest addition to the Henkel portfolio: Bergquist thermal management materials. Acquired by Henkel at the end of 2014, The Bergquist Company is arguably the global leader in thermal materials and substrates. During the show, visitors can talk to thermal specialists about Thermal Clad® insulated metal substrates and liquid dispensed gap fillers, materials that have been specifically designed to deliver optimum cooling and reliable performance for power devices.

From component assembly through to thermal control and device protection, Henkel delivers a comprehensive approach to materials integration. APEX visitors are invited to spend time with our team in Booth 2309 and learn more about the company’s materials expertise and full product portfolio. To schedule an appointment, send an e-mail to farida.jensen@henkel.com.