08/17/2015, Irvine, CA

 

Henkel Develops First-Ever Extremely Low Stress Thermal Interface Material with EMI Absorption Capabilities

Henkel today announced that it has developed the market's first-ever extremely low stress thermal interface material that unites thermal conductivity with EMI absorption capabilities.

 “Today’s electronics devices are smaller and higher-functioning than ever before,” explains Doug Dixon, Global Marketing Director for Henkel. “In addition, widely recognized industry standards defined to control applications that use multiple frequencies dictate effective EMI and heat transfer management for end product acceptance and reliability. These facts were the driving force behind the development of GAP PAD EMI 1.0.”
 
GAP PAD thermal interface materials have long been recognized as the market’s most effective gap filling thermal management products. Now, these trusted materials take device protection one step further by integrating electromagnetic energy absorption functionality. With thermal conductivity of 1.0 W/m-K and EMI absorption for frequencies above 1GHz, GAP PAD EMI 1.0 provides robust thermal management control and an added level of EMI protection. GAP PAD EMI 1.0’s improved wet-out at the interface results in thermal performance that is superior to other competitive materials with a similar rating. Thermal conductivity is also enhanced by the material’s natural tack on one side, which eliminates the requirement for any thermally-impeding adhesive layers and also makes component rework simple.
 
Not only does GAP PAD EMI 1.0 technology offer superb thermal and EMI performance, but the material is the softest and most compliant on the market. Its ability to conform to various topographies and provide a high degree of flexibility ensures exceptionally low stress on solder joints. As compared to traditional EMI materials with high modulus,GAP PAD EMI 1.0 helps improve reliability by reducing in-field failures caused by solder joint stress and fractures.

“The latest GAP PAD innovation has advantages for applications in multiple market sectors including power electronics, consumer, telecommunications, automotive and Wi-Fi/Bluetooth-enabled LEDs,” says Dixon in summary. “Its versatility and dual-function performance are unmatched.”

Supplied in both sheet and die-cut formats, GAP PAD EMI 1.0 is available in various thicknesses and custom part sizes and can be applied manually or by automated placement.

All marks used above are trademarks and/or registered trademarks of Henkel and its affiliates in the US and elsewhere.