News 2014

New Henkel TECHNOMELT Material Tops Category to Win Global Technology Award 

Henkel’s efforts to expand its popular TECHNOMELT low pressure molding materials portfolio are paying off, as its latest material TECHNOMELT PA 668 – has just been honored with a Global Technology Award, topping the competitive Adhesives/Coatings/Encapsulants category.

Henkel PTC Inks Lend New Efficiency, Functionality to Heating Applications 

The Electronics Group of Henkel today announced the development and commercial availability of LOCTITE ECI 8000 series printable inks, a line of positive temperature coefficient (PTC) materials ideal for heating applications.

Henkel to acquire The Bergquist Company 

Düsseldorf – Henkel signed an agreement to acquire The Bergquist Company, a privately-held leading supplier of thermal-management solutions for the electronics industry worldwide.

New Henkel NCP Material Enables Next-Generation Flip-Chip Devices 

Expanding on its market-leading underfill portfolio, The Electronics Group of Henkel has developed a new non-conductive paste (NCP) material, LOCTITE ECCOBOND NCP 5209.

Henkel Expands Award-Winning TECHNOMELT Portfolio 

Building on the success of its broad TECHNOMELT materials portfolio, The Electronics Group of Henkel today announced the development and commercial availability of three new advanced formulations that address some of today’s most demanding encapsulation requirements.

Henkel Makes Strategic Equity Investment in Vitriflex, Inc. to Accelerate Ultra-Barrier Film Technology  

The Electronics Group of Henkel today announced that it has made a strategic equity investment in and signed a joint development agreement (JDA) with Vitriflex, Inc.

Henkel Wins Pair of Circuits Assembly NPI Awards for New Product Innovations 

During a special ceremony at last week’s APEX event in Las Vegas, Nevada, The Electronics Group of Henkel won NPI Awards for both its high- reliability solder system – LOCTITE MULTICORE HF 212 flux medium and 90iSC alloy – and LOCTITE TAF 8800 thermal absorbent film.

Henkel Develops New Suite of Encapsulant Materials for Maximum Device Protection 

Today’s automotive and handheld applications are increasingly exposed to damaging environmental contaminants.

Henkel’s APEX Presence Brings High Reliability and High Performance to the Fore 

At the annual APEX event, set to take place March 25-27 in Las Vegas, Nevada, show delegates will have the opportunity to learn more about the innovation that has resulted in several new high-reliability, high-performance materials from The Electronics Group of Henkel. Spanning a wide range of material types and applications, Henkel will showcase the latest in halogen-free solder materials for automotive applications, extremely protective underfiill and encapsulant materials and market-leading low-pressure molding formulations.

Henkel to Showcase Medical Materials Innovation Portfolio at MD&M West 2014 

At next month’s MD&M West event in Anaheim, California, The Electronics Group of Henkel will show visitors why it is the leading materials innovator for medical device manufacture.