01/10/2014

 

New Materials from Henkel Deliver High Performance for a Breadth of Medical Applications

 

Henkel to Showcase Medical Materials Innovation Portfolio at MD&M West 2014

At next month’s MD&M West event in Anaheim, California, The Electronics Group of Henkel will show visitors why it is the leading materials innovator for medical device manufacture.

From booth #453, Henkel will showcase some of its most recent materials developments, all designed to improve medical device performance to enable accurate diagnostics, better patient monitoring and more effective patient care. For robust manufacture of biosensors including glucose test strips, EKG/ECG electrodes, TENS pads and iontophoreseis pads, Henkel has developed a full suite of high performance printed inks including silver/silver chloride and fine-line ink materials. Formulated to be compatible various substrates, processes, environmental factors and additional materials used to manufacture medical devices, Henkel’s advanced inks are making modern medical devices possible. The materials are developed for applications that span screen printing, flexography, gravure and pad printing to provide medical device specialists with the ultimate in flexibility. LOCTITE EDAG PE 428E E&C, for example, is a silver/ silver chloride ink capable of being printed with gravure or flexographic methods. It contains no VOCs, dries rapidly for fast processing, delivers greater coverage as compared to solvent-based products and offers excellent performance for EKG electrodes and medical sensors.

“Improving the patient experience and the effectiveness of diagnostics are very much dependent on medical device reliability,” comments Bob Palmer, Henkel Global Business Manager for Industrial Electronics. “Henkel invests significant resource to develop materials that enable the most sophisticated medical devices and we look forward to discussing these innovations with MD&M show delegates.”
In addition to its portfolio of inks and coatings, Henkel has also formulated some of the market’s most effective electrically conductive adhesives (ECAs) which will be on show at MD&M West. The latest of these, LOCTITE CE 3103WLV, delivers a lower-stress alternative to solder and provides exceptional contact resistance stability on surfaces such as OSP copper and Sn alloys– metals which have previously been challenging for ECAs. The material has excellent dissimilar metals compatibility, which results in very stable electrical resistance over the life of the device, thereby increasing reliability. The metal compatibility also has the potential to enable reduced-cost components to be incorporated by medical device manufacturers, as lower-cost metals or dissimilar metals can be used because LOCTITE CE 3103WLV maintains the circuit reliability.

Other Henkel materials that will be highlighted during the February 11 – 13 event include the company’s most recent underfills, encapsulants and solder innovations. High- reliability underfill LOCTITE ECCOBOND E1216M delivers fast flow and fast cure capabilities for devices such as BGAs, CSPs and PoPs. In high volume operations where throughput and high yields are critical, LOCTITE ECCOBOND E1216M offers the ideal underfill solution. In addition to underfill protection, encapsulation of medical device components is essential to their long-term performance. LOCTITE ECCOBOND UV9060F provides tough protection from the destructive effects of environmental contaminants like moisture and fluids. The encapsulant material has a fast UV cure and a secondary moisture cure for increased reliability. Low pressure molding, which protects the device while also providing a secure housing, is achieved through Henkel’s TECHNOMELT materials and a unique molding process. Live demonstrations of TECHNOMELT molding will take place at the Henkel booth throughout the show.
For medical device manufacturers seeking a superior performance halogen- and lead- free solder material, Henkel has developed LOCTITE MULTICORE HF 212. The unique solder paste system exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, a very long stencil life and excellent solderability over a wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag and OSP copper. A team of Henkel technical experts will be on hand at MD&M West to discuss all of these materials and help develop a customized, product-specific approach.

“Today’s medical devices rely on these critical materials for superb function and cost- effective performance,” says Palmer in conclusion. “With an unmatched depth of understanding regarding medical device requirements and a holistic view on materials systems, Henkel is the go-to supplier for superior medical device solutions. We invite all show delegates to visit booth #453 at MD&M West to discover the power of a Henkel partnership.”

For more information on Henkel’s medical materials, visit www.henkel.com/electronics or download the company’s latest medical brochure here.