Henkel Develops New Suite of Encapsulant Materials for Maximum Device Protection
Today’s automotive and handheld applications are increasingly exposed to damaging environmental contaminants.
Protecting devices within these products from chemicals, fluids and other environmental conditions is critical to ensuring long-term reliability. To this end, the Electronics Group of Henkel has developed and made commercially available three new encapsulant materials that offer exceptional protection for modern devices.
LOCTITE ECCOBOND EN 3810T and LOCTITE ECCOBOND EN 3838T are novel encapsulant formulations that can be selectively applied to environmentally-susceptible components, delivering a barrier that is impervious to moisture and fluids. Both materials are ideal for handheld and automotive applications where exposure to various liquids, chemicals and fluids is common and potentially detrimental. The encapsulants cure quickly at moderate temperature, are well-suited for high-volume manufacturing operations with unique rheologies conducive to jet dispensing. LOCTITE ECCOBOND EN 3810T is a non-flexible material and LOCTITE ECCOBOND EN 3838T is a flexible, low Tg encapsulant. When evaluated in temperature/humidity/bias testing, both materials enabled physical protection and stable electronic performance of the encapsulated components.
“Electronics continue to push the form and function envelope,” explains Dr. Brian Toleno, Henkel Director of Global Product Management for Encapsulants and Underfills. “Protecting those components most exposed and susceptible to outside influences is becoming an increasingly challenging endeavor, but one that is essential for robust product performance. These new encapsulants offer the ability to protect only those devices that have the greatest opportunity for environmental exposure and, in some cases, eliminate the need to conformal coat the entire PCB assembly which lowers cost and often increases protection.”
In addition to LOCTITE ECCOBOND EN 3810T and LOCTITE ECCOBOND EN 3838T, Henkel has also brought to market a unique encapsulant material that has proven very effective for certain automotive and handheld applications. Specifically, LOCTITE ECCOBOND UV 9052 has shown excellent results with automotive camera modules. Used to seal the lens assembly to the camera body, the fast UV cure mechanism of the material enables active alignment whereby the lens is aligned and the material cure secures the lens in place. LOCTITE ECCOBOND UV 9052 also has excellent fluid resistance, which offers improved reliability for safety-critical automotive cameras. In addition to camera lens assembly, LOCTITE ECCOBOND UV 9052 is being used successfully in handheld and medical applications where it protects chip-caps in sensitive areas from moisture.
“Consumers expect their smartphones, tablets and automobiles to function as designed and on-demand,” says Toleno in conclusion. “Effective component protection is an essential element for unfailing performance and Henkel is leading the innovation effort for these materials.”