News 2013

11/12/2013
Henkel’s Novel Thermal Absorbent Films Deliver Robust Heat Management for Handheld Devices 

To address the heat management challenges associated with higher functioning, smaller footprint handheld devices, The Electronics Group of Henkel has formulated a series of novel thermal absorbent films.  The Loctite TAF portfolio of materials effectively lowers the CPU and skin temperature of popular handheld devices, enabling improved performance, user comfort and product-design latitude.

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11/01/2013
Camera Module Assembly: Henkel Offers Focused Portfolio for Growing Market 

A camera module is an image sensor integrated with control electronics that transfers optical signal into a digital signal. The market for these devices continues to grow, as more and more products incorporate image sensing capability.

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10/28/2013
High-Reliability Meets Pb-free and Halogen-Free The Ultimate Solder Material Trifecta 

While traditional SnAgCu (SAC) halide-free solder materials are suitable for many electronics assembly applications, some market sectors are having challenges incorporating these materials into devices and systems that will be subjected to harsh operating environments. In particular, automotive products that will experience high operating temperatures, increased thermal cycling conditions, high vibration and moisture or liquid contact are not compatible with previous-generation Pb-free, halide-free solder materials.

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10/10/2013
Conductive Die Attach Film for Multiple Applications Pioneering Market Technology Expands  

Consumers continue to demand even more function in ever-shrinking form factors, driving the need for semiconductor packaging specialists to find solutions that allow for robust processing of thinner, smaller, higher density packages. Part of the solution to these challenges lies with the materials used to build today's ultra-small semiconductor devices. This goes not only for laminate-based (non-conductive) devices, but for leadframe (conductive) applications as well - the miniaturization trend extends to multiple package types.

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08/15/2013
Henkel Develops Versatile Halogen-Free Rework Flux 

The Electronics Group of Henkel announces the development and commercial availability of Loctite Multicore HF 108RWF. The new material is a halogen-free flux formulation designed for rework processes and applications where halogen-free processing is required.

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07/10/2013
Henkel Names New Vice-President of Product Development and Engineering 

The Electronics Group of Henkel today announced that it has tapped Kevin Becker, Ph.D. to lead its global Product Development and Engineering (PD&E) team.  Becker replaces Dr. Michael Todd, who has held the position for the past seven years and has moved to Henkel headquarters in Düsseldorf, Germany to head up the company’s Adhesives Research group.

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06/18/2013
Absorbing the Heat for Cooler, Better Performing Handhelds 

It’s something every user of smart phones, tablets and even laptops has experienced: heat emanating from your indispensable electronic device. As the device works to perform all of the functions you demand, the temperature rises. Not only does the heat generation put stress on the internal device components, it can also be uncomfortable for the user. What’s more, this problem has only gotten worse as handhelds have become smaller and thinner while, at the same time, increasing functionality. Temperature concerns not only cause user discomfort; they also limit advancing semiconductor designs as many next-generation chips are simply too hot for current products.

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05/30/2013
MEMS Need Comprehensive, Market-Ready Solutions 

Microelectromechanical systems -- commonly known as MEMS -- applications are on the rise.  In fact, the MEMS market is currently outpacing overall IC market growth at a rate that is twice as fast and is expected to be a $20B US market as early as 2017.  Why the uptick in MEMS use?  The consumer (primarily handheld) and automotive markets hold the answer for now, but other market sectors such as medical, for example, are also beginning to incorporate MEMS devices

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05/30/2013
Mold Compound Advances Require World-Class Capability  

Designed to encapsulate today’s high-performing semiconductor components, transfer mold compounds deliver critical device protection and performance stability. Indeed, they are essential materials and require expertise to formulate and manufacture, particularly when it comes to the performance needed for modern IC’s and power discretes that run at higher voltages in power management applications.  Designing mold compounds that can endure in-field stresses and challenging environments takes world-class facilities, a knowledgeable team, the latest production resources and an innovation program that ensures materials for future technology requirements.

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04/04/2013
New Silicone-Based Electrically Conductive Adhesives Ideal for Automotive Applications 
Recognizing the emerging requirements of higher temperature, higher vibrational energy automotive sensor applications, Henkel has developed a new portfolio of silicone-based electrically conductive adhesives (ECAs) with unique properties to address harsh environmental conditions. The Loctite Ablestik ICP 4000 series of ECAs withstand operating temperatures as high as 200 degrees Celsius and deliver the flexibility required to cope with significant vibration.  more...
03/27/2013
Highly Reliable Solutions for Microelectronics 

These requirements are essential especially in the automotive industry. To meet them, Henkel has developed highly reliable adhesives, solder materials and underfills innovations, which will be debuted at SMT trade show in Nürnberg from April 16 to 18.

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02/20/2013
Henkel Debuts High-Reliability Pb-Free Solder Alloy for High-Temperature Applications 

Developed alongside and accepted by the automotive industry, Henkel Electronic Materials announces the commercial availability of 90iSC, a high-reliability, lead-free solder alloy for demanding high-temperature applications.

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02/20/2013
Henkel Introduces Two Encapsulants Ideal for Sensitive Components 

Formulated to address the limitations of alternative products, Henkel Electronic Materials announces the commercial availability of two encapsulants for selective protection of environmentally-susceptible components.

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02/14/2013
New Type of Paste with Enhanced Thermal Conductivity for Modules – TIM Allows Higher Power Density for Same Ageing Resistance 

Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today’s power semiconductors must be integrated as early as their design phase.

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