05/30/2013, Henkel Electronic Materials, LLC

 

Ruud de Wit: Global Product Manager Mold Compounds

 

Mold Compound Advances Require World-Class Capability

Designed to encapsulate today’s high-performing semiconductor components, transfer mold compounds deliver critical device protection and performance stability. Indeed, they are essential materials and require expertise to formulate and manufacture, particularly when it comes to the performance needed for modern IC’s and power discretes that run at higher voltages in power management applications.  Designing mold compounds that can endure in-field stresses and challenging environments takes world-class facilities, a knowledgeable team, the latest production resources and an innovation program that ensures materials for future technology requirements.

While all of the above may be understood, what may be less well-known is the depth and breadth of the Henkel mold compound research and manufacturing capabilities.  In fact, Henkel Huawei Electronics’ (HHE) world-class mold compound site in Lianyungang, China is the largest mold compound manufacturing facility in the world.  At over 34,000 square meters with nearly 600 employees, the three separate production workshops on this campus total the largest global single-site mold compound manufacturing capacity. Henkel has invested significant resource to expand the HHE facility over the last five years, ensuring the highest quality production standards, manufacturing equipment and expert staff. 

And, this investment extends beyond the Lianyungang manufacturing site.  At Henkel’s new Mold Compound Competence Center in Shanghai, product formulation, small scale pilot production, pelletizing and full analytical and reliability testing can be done to verify performance. What’s more, fundamental mold compound research is carried out in Irvine, California, expanding the technology toolbox with new resins and enabling next-generation research and development for mold compound advances. In all Henkel mold compound facilities, the highest environmental, safety and quality manufacturing standards are employed, ensuring sustainable, high-performance, best-in-class mold compound materials.   

The multi-million dollar investment in and expansion of Henkel’s mold compound capabilities is significant. State-of-the-art production lines with tight process and metal particle control capable of mold compound production for more demanding devices such as SOICs, QFPs and sensors have been incorporated.  Materials innovations focused on higher-end devices running at increasing temperatures and voltages and compatibility with copper wire are a central part of Henkel’s development efforts.  All told, there are over 20 projects in the pipeline – all designed to bring new components to market faster and more reliably than ever before.

Henkel’s commitment to innovating the next-generation of mold compounds means that customers can advance designs, bring new concepts to market and incorporate materials that can cope with emerging device demands.  Take, for example, Henkel’s new LOCTITE HYSOL series of mold compounds for FULLPACK, D(2)PAK and MOSFET devices. These materials are enabling the next generation of power devices through their ability to cope with the high voltage and high temperature demands of modern power discretes. In addition, established compounds such as the LOCTITE HYSOL MG15F series have been proven with voltages as high as 1200V or more and deliver temperature stability for operating temperatures approaching 200°C.  These types of materials are in production on commercialized Silicon Carbide (SiC) MOSFETs, which operate at higher voltages and temperatures as compared to traditional silicon-based MOSFETs, while also reducing energy losses.  Enabling the most advanced technologies – such as the transition from traditional silicon to Silicon Carbide – is the advantage Henkel’s development expertise, global support structure and world-class mold compound operations deliver. 

Mold compound innovation and superior quality manufacturing is happening every day at Henkel – propriety new resin development is ongoing which will enable new ultra-low stress compounds with <0.1% cure shrinkage and glass transition (Tg) temperatures that exceed 250°C.  Top semiconductor companies use Henkel mold compounds successfully in production 24/7 and tomorrow’s devices are being brought to market today due to the performance and reliability of mold compounds from Henkel.  With a broad portfolio of mold compounds for passives, power discretes, IC devices, sensors and more, Henkel’s mold compound offer and expertise is unmatched.  Now, you know!

To find out more about Henkel’s mold compound product line and world-class capabilities, log onto www.henkel.com/electronics or call +1-888-943-6535 in the Americas, +32 1457 5611 in Europe or +86 21 3898 4800 in Asia.