Conductive Die Attach Film for Multiple Applications Pioneering Market Technology Expands

Consumers continue to demand even more function in ever-shrinking form factors, driving the need for semiconductor packaging specialists to find solutions that allow for robust processing of thinner, smaller, higher density packages. Part of the solution to these challenges lies with the materials used to build today's ultra-small semiconductor devices. This goes not only for laminate-based (non-conductive) devices, but for leadframe (conductive) applications as well - the miniaturization trend extends to multiple package types.

Manufacturers of laminate-based packages have long relied on die attach film technology to enable incorporation of much thinner die and to ensure consistent, uniform bondlines with no die tilt.  But, until the first -ever conductive die attach materials were introduced in 2010, leadframe manufacturers had few options outside of traditional die attach paste. That’s all changed.

When Henkel introduced the market’s first conductive die attach film materials it was, indeed, welcome news for the semiconductor packaging market.  LOCTITE ABLESTIK C100 debuted to widespread validation, with major semiconductor device manufacturers publicly stating the advantages of the material’s ability to enable package scalability.  With a viable alternative to traditional paste-based die attach materials, leadframe device specialists could now capitalize on the inherent benefits of film-based mediums – namely, the ability to incorporate thinner wafers, realize uniform bondlines and integrate more die per package due to the tighter die to pad clearance afforded by film.    Originally available in roll format, where both the die attach film and dicing tape are laminated onto the wafer in two separate lamination processes, Henkel quickly extended the portfolio to also include a pre-cut version of the breakthrough conductive film technology that is ideal for use with ultra-thin wafers.  

Following the successful market introduction of LOCTITE ABLESTIK C100, Henkel pushed forward with the next-generation of conductive die attach film and formulated LOCTITE ABLESTIK CDF 200P.  A two-in-one, pre-cut conductive die attach film, LOCTITE ABLESTIK CDF 200P combines dicing tape and die attach material into single, pre-cut 6” or 8” wafer-sized film formats for easy application.   Compatible with lamination equipment commonly used in the field, LOCTITE ABLESTIK CDF 200P requires no capital equipment investment, as it was specifically designed for equipment adaptability.  With a lamination temperature requirement of 65°C, the conductive film complies with most existing equipment and processes for both lamination and backgrinding. Because of its unique two-in-one format, LOCTITE ABLESTIK CDF 200P streamlines manufacturing by facilitating an in-line process (backgrinding and lamination) for thin and ultra-thin wafers and also allows for a single lamination process in one, combined step.

Now, Henkel has taken the two-in-one, pre-cut conductive film technology even further and has developed the LOCTITE ABLESTIK CDF 800P and LOCTITE ABLESTIK 500P series of die attach film materials.   The LOCTITE ABLESTIK CDF 800P formulas possess all of the benefits of film while also offering good electrical and thermal resistivity with MSL 1 reliability for power applications.  The electrical and thermal performance of the new conductive films provide a 50% improvement over earlier-generation products and deliver results consistent with that of the market’s top die attach paste materials.  The thermal resistance metrics of the LOCTITE ABLESTIK CDF 800P films are based on in-package performance which is commonly recognized as being superior to bulk thermal conductivity analysis.   Ideal for today’s QFN, SFN, SOT, SOD, SOIC and small QFP devices, LOCTITE ABLESTIK CDF 800P now extend the options for power package design and performance.  The LOCTITE ABLESTIK CDF 500P portfolio extends the die size capability for higher reliability to 10.0 mm x10.0 mm, while maintaining the same thermal and electrical performance as that of LOCTITE ABLESTIK CDF 200P films.

Flexibility and extreme capability are the foundation of Henkel’s entire conductive die attach film portfolio.  The complete product range now offers application-specific effectiveness on a wide variety of die sizes (from 0.2 mm x 0.2 mm to 10.0 mm x 10.0 mm), thicknesses down to 50 µm, multiple wafer metallizations including bare silicon, TiNiAg and Au, and several leadframe metallizations  such as Cu, Ag, Au and NiPdAu. 

Not only are these new materials process-friendly, they also offer all of the advantages of film technology. Henkel’s portfolio of conductive die attach films provide greater design leverage by allowing tighter clearance between the die and the die pad due to the elimination of the fillet.  This means that packaging designers can incorporate more die and/or more functionality into a single package.  With no fillet and higher density chip designs, packaging specialist can also lower costs because the amount of gold wire, substrate and mold compound required per unit package is significantly reduced.

Henkel’s portfolio of conductive die attach films –LOCTITE ABLESTIK C100, LOCTITE ABLESTIK CDF 200P, LOCTITE ABLESTIK CDF 500P and LOCTITE ABLESTIK CDF 800P  – are set to accelerate effective implementation of highly miniaturized, multi-die device designs which are simply unachievable with paste- or liquid-based mediums.

To find out more about Henkel’s line of conductive die attach film materials, log onto www.henkel.com/electronics, send an e-mail to electronics@henkel.com  or call 1-888-943-6535 in the Americas, +44 1442 278 000 in Europe and +86 21 3898 4800 in Asia.