11/01/2013, Irvine, CA

 

Camera Module Assembly: Henkel Offers Focused Portfolio for Growing Market

A camera module is an image sensor integrated with control electronics that transfers optical signal into a digital signal. The market for these devices continues to grow, as more and more products incorporate image sensing capability.

Camera modules can be found in numerous applications including handheld devices, audio, TV and gaming products, traditional DSC and SLR cameras, video camcorders, automobiles and medical systems, and one can get a sense for just how varied and broad the market has become. In fact, according to a new report just issued by Transparency Market Research, the global camera module market, which was worth $12 billion USD in 2012, is expected to grow at a CAGR of 19.7% over the next six years. That puts the total camera module market value at a staggering $43.06 billion USD by 2019. (1)

While the camera module market has experienced healthy expansion rates for some time, it’s clear that the   proliferation of smartphones and tablets are primary factors in its projected six year high-growth path. Most mobile phones have two cameras – front and rear – and are driving technology advancement of Complementary Metal-Oxide-Semiconductor (CMOS) devices, pushing the envelope for thinner and more capable cameras.   Consumers want high resolution camera capability in a mobile device and this demand is driving pixel capability from its current 5 MP to 8 MP up to as much as 13 MP in the not-too-distant future. (2)

There are generally two different types of camera modules found within handheld devices: a fixed-focus module and an auto-focus module. Fixed-focus cameras are most often found on the front side of the device and are used for functions like chatting and Skyping. The rear-side cameras are typically auto-focus and used for pictures and video.  Each module contains many different components, including voice coil motors, image sensors, lens barrels, filters, voice coil actuators and more. Because of the number of components found in both fixed-focus and auto-focus camera modules, partnering with a materials supplier that has a broad portfolio and expertise in multiple applications is essential.  Understanding die attach characteristics and performance to minimize warpage, bonding adhesive optimization for filter bonding and lens bonding, and reinforcement materials for flexible PCBs are all key factors for ensuring a reliable, high-performance module assembly.

As the market leader in semiconductor packaging and electronics assembly materials, Henkel has in-depth expertise and a broad market portfolio to address the requirements of current and future camera module demands.  In fact, for nearly all camera module component assembly processes, Henkel has multiple material solutions -- including non-conductive and conductive adhesives -- to ensure robust assembly and excellent in-field performance. The below highlights the primary components of each module type and the material characteristics required for assembly. For each of these, Henkel offers a variety of formulations to address specific manufacturing preferences.




Fixed Focus Camera Module

 Camera Component Assembly Process  Material Requirements
1. Instant Bonding of Lens Barrel
  • Very rapid cure that provides handling strength
  • UV curing is preferable
  • High thixotropic index to reduce liquid migration or flow
  • Ability to enhance load bearing & shock absorbing characteristics of bond area
2. Permanent Thread Locking of Lens Barrel
  • Low temperature and fast cure
  • High Adhesion
3. IR Filter Bonding to Lens Holder
  • Fast cure
  • UV curing is preferable
  • High Adhesion
4. Bonding Lens Holder to Substrate
  • Low temperature cure <100°C
  • Fast cure <60mins
  • Adhesion to a variety of substrates (PC, LCP etc.)
5. Flexible PCB Reinforcement & Rigid Substrate Connection
  • Flexible product to accommodate stress
  • High adhesion
6. Die Attach onto FR4, Ceramic or Au-plated Substrate
  • Low warpage
  • Low temperature cure




Auto-focus Camera Module

 Camera Component Assembly Process Material Requirements 
 1. Instant Lens Bonding after Focus Adjustment
  • Very rapid cure that provides handling strength
  • Highly thixotropic fluid 
 2. Solder Alternative for Electrical Connection of Voice Coil Activator (VCA) to Spring
  • Good electrical connection
  • Low temperature cure, fast cure
  • High Adhesion
 3. Magnet Bonding for Auto-Focus Lens Functionality
  • Heat cure (low temperature )
  • High adhesion
 4. Side Stiffener Sealing for Grounding (GND) Bonding
  • Stable electrical resistance
  • High adhesion
  • Good side sealing with stable volume control
 5. Bonding of Lens Holder to Substrate
  • Low temperature cure, fast cure
  • Adhesion to a variety of substrates (PC, LCP etc.)
 6. Voice Coil Motor Terminal Bonding: VCM Yoke and Au pad on Ceramic Substrate
  • Low temperature cure, fast cure
  • Low stable resistance & good adhesion
 7. Reinforcement of Flip-Chip Die Bonding and Rigid Substrate Connection
  • Flexible product to accommodate stress
  • High adhesion
 8. Bonding of IR Filter to Ceramic Substrate
  • UV Cure
  • High Adhesion
 9. Fixture of Stiffener for GND Bonding
  • Stable electrical resistance
  • High adhesion
  • Fast heat curing
 10. Reinforcement of Flexible PCB and Rigid Substrate Connection
  • Flexible product to accommodate stress
  • High adhesion

Henkel’s team of materials scientists has developed numerous adhesive systems to address the requirements of each level of fixed-focus and auto-focus camera module assembly.  With unmatched expertise and a global footprint that delivers technical service, advanced development labs, application specialists and knowledgeable sales staff worldwide, Henkel can support multi-site operations better than anyone else in the business.  What’s more, new material evaluation, development and formulation happens quickly at Henkel, which ensures no opportunity is lost to market launch delays. 

To find out more about Henkel’s focused CMOS camera module materials portfolio, call 1-888-943-6535 in the Americas, +32 1457 5611 in Europe or +86 21 3898 4800 in Asia or log onto www.henkel.com/electronics.

 

Sources

1., 2.  Yahoo Finance, “Camera Module Market is Expected to Reach USD 43.06 Billion Globally in 2019: Transparency Market Research”, October 28, 2013