News 2012

11/26/2012
Henkel’s Pre-cut Conductive Die Attach Film Expands Advantage 

Since its market introduction four months ago, Henkel Electronic Materials’ LOCTITE ABLESTIK CDF 200P pre-cut conductive die attach film has enjoyed broad market success in a very short amount of time.

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11/13/2012
Smaller, Faster and Greener? Trends in the European Semiconductor Industry 

How can the European Semiconductor Industry stay competitive? How does legislation drive the market? And what is the general outlook for Europe?

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11/12/2012
New Material Keeps Handhelds – and your Hands! – Cool 

It’s something every user of smart phones, tablets and even laptops has experienced: heat emanating from your indispensable electronic device. As the device works to perform all of the functions you demand, the temperature rises.

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10/08/2012
QFNs: The Devices We Love to Hate... and the Voids that Come with Them 

QFNs: Designers love them. Assemblers don’t necessarily share that affection. These very popular devices, first on the electronics scene in the late 90’s/early 2000’s, have become one of the more popular packages among handheld manufacturers.    From a design and manufacturing point of view, the QFN is an excellent package.

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09/05/2012
Henkel Electronic Materials Experts Selected to Share Knowledge at SMTA International 

A testament to Henkel’s status as the premiere electronics materials developer and supplier worldwide, several of the company’s well-respected scientists have been chosen to share their expertise at the SMTA International Event.  Set to take place October 15 through 17 in Orlando, Florida, SMTA International is a technically-rich and focused conference and exhibition that offers educational opportunities for a variety of assembly-related topics.

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08/07/2012
Henkel Develops Underfill for Next-Generation Flip Chip Devices 

Addressing the challenges associated with ever-thinner flip chip die, Henkel Electronic Materials has developed a new underfill system designed to reduce package stress through controlling die and substrate warpage. The new material, LOCTITE ECCOBOND UF 8840, is a high-performance underfill specifically designed to meet the demands of modern semiconductor flip chip devices.

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07/31/2012
Less Silver, Equal Performance 

Over the past two years, the rise in silver prices has been unprecedented. In December of 2009, silver was hovering around $17.00 a troy ounce.  As of December 2011, silver’s price was approximately $35.00 per troy ounce – a nearly 100% increase in two years’ time.

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07/31/2012
NCP Technology Paves the Way for Integrated, Advanced Packages 

Underfills have been part of the electronics landscape for decades, offering protection for numerous devices inside a variety of electronic products.

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07/23/2012
Underfill gets Tight New Formula Ideal for TMV PoPs 

When package-on-package (PoP) devices emerged on the scene a few short years ago, they presented many challenges to assembly specialists. Not the least of these hurdles was how to ensure reliable protection of the top level package interconnects, as underfilling the space between the two packages presented some obstacles.

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07/11/2012
Henkel Electronic Materials Names North American Manufacturing Representatives of the Year 

Henkel Electronic Materials today announced that it has selected E-tronix and Far West Micro, Inc. as its 2011 North American Manufacturing Representatives of the Year.

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07/10/2012
Henkel Electronic Materials Expands Groundbreaking Conductive Die Attach Film Portfolio 

Extending its conductive die attach film portfolio, Henkel Electronic Materials announces the commercial availability of LOCTITE ABLESTIK CDF 200P, the latest result of the material leader’s die attach innovation efforts.

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05/08/2012
Henkel develops materials innovations for high power electronics 

Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications.

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05/03/2012
Keeping Packages Cool and Reliability High 

New non-electrically conductive die attach paste has best thermal performance on the market

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02/28/2012
Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions 

Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives.

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02/28/2012
Electrically Conductive Adhesive from Henkel Compatible with Multiple Metals; Delivers Manufacturing Flexibility for Optical Technology Leader, LensVector 

Leveraging research regarding contact resistance performance, Henkel Electronic Materials has developed an electrically conductive adhesive (ECA) that overcomes the drawbacks of older generation ECAs and extends the material’s advantages to multiple applications.

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02/28/2012
High Tg, Reworkable Underfill from Henkel Ideal for High Value, Fine-Pitch Area Array Devices 

Expanding on its portfolio of advanced underfill materials, Henkel has developed LOCTITE UF3810, a new underfill technology that provides extremely high reliability while also allowing for easier reworkability as compared to previous generation products.

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02/28/2012
Award-Winning MACROMELT Portfolio Extended with the Addition of Material with Highest RTI Rating in its Class 

Henkel’s award-winning low-pressure molding MACROMELT technology portfolio has recently been expanded to include a material designed specifically for high thermal stability and chemical resistance.

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01/10/2012
Henkel Develops Electrically Conductive Adhesive Compatible with Lower-Cost Components 

In a significant formulation breakthrough, Henkel Electronic Materials announces that it has developed a new electrically conductive adhesive (ECA) compatible with lower-cost, tin-terminated components to enable more cost-effective assembly processes. The new material, ABLESTIK ICP-3535M1 is a one-component, pre-mixed ECA that provides low and stable contact resistance when used with 100% tin-terminated components.

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01/09/2012
SMTA OC/LA Chapter Training Program 

Join us January 19th at Henkel Electronics Materials, LLC, Irvine, CA
8:30AM, Check-In
9:00AM - 4:00PM, Class

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