09/05/2012

 

Henkel Electronic Materials Experts Selected to Share Knowledge at SMTA International

A testament to Henkel’s status as the premiere electronics materials developer and supplier worldwide, several of the company’s well-respected scientists have been chosen to share their expertise at the SMTA International Event.  Set to take place October 15 through 17 in Orlando, Florida, SMTA International is a technically-rich and focused conference and exhibition that offers educational opportunities for a variety of assembly-related topics.

In a session entitled “Alternate Solder Alloys for Various Applications”, Henkel Electronic Materials’ Solder Development Product Manager, Dr. Gavin Jackson, along with a team from the Stokes Institute, will share details on a SnZn solder alternative for low-cost lead-free surface mount assemblies.  Based on work conducted alongside several other Henkel colleagues, the paper will present findings on the novel material’s shelf-life and long-term reliability -- among other performance characteristics -- as compared to traditional lead-free solders.   Conference attendees are invited to join this discussion on October 16 from 10:30 a.m. to 12:30 p.m.
 
Protecting modern devices from use-related and environmental stresses is the subject of the “Ruggedized Electronics” paper series, which takes place on October 16 from 2:00 p.m. to 3:30 p.m.  Here, Henkel’s Dr. Brian Toleno, Director of Global Product Management for   Underfills and Encapsulants, will present the combined work of several Henkel chemists as it relates to increasing reliability of fine-pitch wafer level devices through advanced underfill materials.    Balancing cost challenges with in-field performance, some of these new underfill systems provide extremely high reliability while also allowing for easy reworkability – a key combination for today’s high value devices.
 
Rounding out the trio of Henkel presentations is a paper that discusses the intriguing findings from the evaluation of phase changes thermal interface materials (TIM) and the products’ application-dependent performance parameters.  This work, presented by Henkel Development Scientist Scott Allen, addresses not only the requirement for improved thermal performance of function-rich devices, but the need to evaluate and then select the proper phase change TIM for each application.   Each case is unique and phase change TIMs perform differently under different conditions.  Allen’s paper will provide insight into testing and evaluation for determining the best application-specific phase change TIM solution and will be presented on October 17 at 4:00 p.m.
 
Henkel invites SMTA International visitors to attend these informative sessions, as well as visit the company at booth #220 on the show floor for more details on its electronic materials innovations.
 
 
 
About Henkel
Henkel operates worldwide with leading brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 47,000 people and reported sales of $21.7 billion and adjusted operating profit of $2.8 billion in fiscal 2011. Henkel’s preferred shares are listed in the German stock index DAX.
 
Contact
Henkel Electronic Materials LLC
Doug Dixon
www.henkel.com/electronics
Phone:  714-368-8000
Fax:      714-368-2265
doug.dixon@us.henkel.com