News 2011

10/28/2011
Henkel solutions address miniaturization, sustainability and cost-efficiency in modern electronics 

As the functionality of modern electronics products has increased exponentially in tandem with decreasing dimensions, the demands on performance and reliability of electronic materials have reached an unprecedented level. Today’s electronic materials – spanning nearly all market sectors – must deliver on consumer performance expectations while also ensuring environmental responsibility and lower costs.

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10/01/2011
Reliability that Sticks: Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format 
When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well-known?  more...
08/22/2011
Henkel Enables Educational Opportunities for Underprivileged Children in China 

As part of Henkel’s Make an Impact on Tomorrow (MIT) program, the company has recently donated funds to support students from the Xinchao Charity in Jiangyin, Jiangsu Province, China. Henkel provided total 2011 tuition worth 36,000 Yuan and additional funds of 4,000 Yuan for supplies to help support the educational needs of underprivileged children being cared for in the Xinchao orphanage.

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07/12/2011
Henkel’s Conductive Die-Attach Films Enable Leadframe Package Scalability at STMicroelectronics 

Henkel today announced that it has worked with STMicroelectronics, one of the world’s largest semiconductor companies and advanced chip packaging technology developers, to validate the performance of Henkel’s Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die with extremely small dimensions.

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05/20/2011
Wave Soldering Adapts with new Flux Technology 

Over the last few decades, the electronics assembly process has seen many changes. We’ve witnessed the transition from through hole to SMT, the elimination of CFCs, the move to leadfree and the continued trend toward ever more miniaturized devices and finer pitches. All of these have challenged the industry to find new, better and more environmentally acceptable manufacturing methodologies.

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05/20/2011
Silver Price Control: New Materials Technology Helps Mitigate Silver’s Rising Cost 

With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: how to manage the faster, better, cheaper demands of consumers alongside such a challenging market factor.

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04/12/2011
Henkel Introduces Next-Generation VOC-Free Conformal Coating 

Addressing the demanding environmental and reliability requirements of modern printed circuit board (PCB) products, Henkel has formulated Hysol PC40-UMF, a
solvent-free conformal coating material that offers outstanding performance while delivering a sustainable alternative to solvent-based coatings.

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04/12/2011
New No-Clean Flux from Henkel Delivers Wide Process Window and Exceptional Manufacturing Latitude 

Designed with modern manufacturing requirements in mind, Henkel Electronic Materials has formulated Multicore MF210, a no-clean sustained activity flux that is compatible with both lead-free and tin-lead processes.

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03/25/2011
Henkel Launches Conductive Die Attach Film 

The latest in a series of recent materials innovation successes, Henkel Electronics today announced the development and commercial availability of its Ablestik C100 series conductive die attach films.

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03/08/2011
Macromelt Chosen for Next‐Gen Hybrid Vehicle 

Already well‐known as a viable alternative to traditional potting materials and processes, the robust Macromelt low pressure molding solution from Henkel is now making huge inroads with applications for the green and portable energy and medical electronics sectors. The streamlined processing is certainly a factor for Macromelt’s widespread adoption, but its exceptional performance and ability to meet some strict requirements has accelerated its acceptance, particularly in the hybrid automotive market.

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02/28/2011
Automotive Materials Solutions: From Engines to Entertainment Systems 

With the electronics content of modern automobiles increasing substantially over the last decade, the materials used to facilitate device interconnection, protection and thermal control have also transformed to address next‐generation requirements. Obviously, the location of the electronic device within the vehicle drives the materials requirements.

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01/21/2011
Thermal Solutions for Any Application 

When it comes to addressing the thermal management demands of today’s advanced electronics devices, there is no “one size fits all” solution. Different applications and user preferences dictate the material type and performance to be selected. One thing is universal, however: effective thermal management – especially at the TIM2 level – is more critical than ever, as devices continue to shrink in footprint and increase in functionality and, therefore, keep getting hotter.

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