News 2010

Henkel’s Dr. Brian Toleno Elected to SMTA Board of Directors 

Recognizing his technical expertise and dedication to the surface-mount and microelectronics packaging sectors, electronics industry colleagues have nominated and elected Henkel’s Brian Toleno, Ph.D. to the Surface Mount Technology Association’s (SMTA) Board of Directors. Toleno’s term will span three years, during which time he will serve on the association’s planning and globalization committee.

Printed Electronics: Traditional Technology Addresses Today’s Smaller, Faster, Lower Cost Requirements 

The field of printed electronics is certainly not new. In fact, companies have been using various printing techniques to make products such as membrane switches and keypads for well over 20 years.

RoHS Means Big Changes for Power Devices. Are you Ready? 

While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of modern power packages from a materials point of view is arguably one of the most pressing issues facing this market sector.

Sustainability Commitment A Key Driver for Product Development 

There’s a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and operations, many still haven’t adopted sustainability objectives as part of their corporate culture. For Henkel, the former is most assuredly the case. In fact, Henkel’s sustainability strategy encompasses the whole of Henkel Corporation and its entire value chain.

Considering a Halogen‐Free Future? Know the Facts. 

Though there is no official, government‐mandated requirement forcing the production of halogen‐free products and, therefore, the use of halogen‐free materials, the electronics industry is arguably moving in that direction. This industry‐sponsored effort is being driven primarily by increasingly environmentally‐conscious customers, pressure from non‐governmental environmental organizations and the desire by suppliers to be proactive.

New Die Attach Film Raises the Bar on Wetting and Molding Performance 

Complexity, functionality, miniaturization and cost-efficiency have been and continue to be the mantra of the electronics industry. Arguably, no segment is more keenly aware of this fact than the semiconductor packaging sector.

Thermal Management Materials Get a Grip 

While greases and phase change thermal interface materials (TIMs) have been established as the dominant products for thermal management of electronic devices, new demands for certain applications have given manufacturers cause to seek alternatives.

Leading Position Confirmed in Sustainability Ranking 

For the fourth time in a row, Henkel has been recognized as sector leader in the Dow Jones Sustainability World Index (DJSI World) and the Dow Jones Sustainability Europe Index (DJSI Europe). Henkel took again first place in the Non-durable Household Products category and is the sole company of its sector in the DJSI World and DJSI Europe. The indices list corporations that follow the principles of sustainable development in their business operations.

Henkel Electronics Moves to New State-of-the-Art Headquarters in Irvine, California 

Henkel’s Adhesive Electronics business has relocated its headquarters to a new facility in Irvine, California which the company fully expects will help further its innovation initiatives.

Henkel Reports Substantial Increase in Sales and Earnings in the Second Quarter 

From a sales increase of 11.6 percent to 3,890 million euros, to an organic sales growth of 6.8 percent, share of sales of growth regions: plus 3 percentage points to 41 percent, adjusted operating profit: plus 54.5 percent to 476 million euros, adjusted EBIT margin: plus 3.5 percentage points to 12.2 percent, and an adjusted earnings per preferred share (EPS): plus 97.1 percent to 0.73 euros.

Henkel Develops Disruptive Die Attach Technology; New WBC for Stacked Die Packages Challenges Die Attach Film Stronghold 

Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards).

New Wafer Backside Coating Innovation Stacks Up Against Film 

Consumers continue to drive demand for smaller, thinner and more capable electronic devices which, then, require integrated packages that can cope with today’s new product footprints. For packaging specialists, that means the processing of thinner wafers and stacking of much thinner die. The catch? All of this has to be achieved at an end unit cost that is palatable and marketable to tech‐savvy consumers.

Henkel’s Multicore LF620 Lead-Free Solder Paste Sets the New Benchmark for the Lead-Free Era 

Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.

No Need for Sour Grapes 

The electronics industry's never-ending miniaturization quest has constantly challenged conventional processes, forcing solutions to problems that are a direct result of the move to such tight geometries. At board level, it's safe to say that a large majority of these issues have to do with the deposit volumes required to achieve high-integrity solder joints for such small components. So, the soldering process - from print through reflow - is front and center.

Henkel makes a good start to the year 

“Henkel has made a good start to the fiscal year, with all our business sectors contributing. Despite the persistently challenging environment, Laundry & Home Care and Cosmetics/Toiletries continued their successful development of recent quarters, while Adhesive Technologies also returned to robust rates of sales growth,” said Kasper Rorsted, Chairman of the Henkel Management Board.

Henkel Product Development Expertise Rewarded at APEX 

Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.

Loctite PowerstrateXtreme Printable from Henkel Raises the Bar on Thermal Management Flexibility 

Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.

New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photvoltaic, Automotive and Membrane Switch Applications 

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

Circuit Board Protection Without Compromise: Why Proper Materials Selection and Compatibility are Essential for Conformal Coating Success 

With numerous potential applications and a plethora of formulations from which to choose, it is often difficult to know how to select the best conformal coating for the job. Understanding the application and end use are critical in the decision but even that isn’t all you need to know. You may select a silicone-based conformal coating because you have very high and very low temperature performance requirements.

Pushing Beyond the Status Quo 

Though much of the chatter about the lead-free transition has quieted as the electronics industry seems to have settled into the new manufacturing requirements, that's doesn't mean lead-free innovation has followed suit. In fact, nothing could be further from the truth - at least as far as some materials suppliers are concerned. There are still countless applications where traditional SAC formulations simply don't deliver.

International recognition for Henkel 

Henkel has been included in the list of the “World’s Most Ethical Companies” for the third year in a row. The ranking prepared by the US Ethisphere Institute recognizes companies from around the globe for their exemplary ethical approach to corporate governance and their commitment to sustainable development.

Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements 

Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints and higher I/O counts, but they must also ensure that proper thermal control is built into advanced electronics packages. In fact, heat management for modern power semiconductor devices such as rectifiers, power transistors, amplifiers and countless other consumer and automotive applications is one of the most pressing issues facing the packaging industry.

Henkel reports better-than-expected 2009 results 

Henkel anticipates the current financial year will bring a noticeable improvement to its results. While regarding the recovery of the real economy and the financial markets as still fragile, the company expects that its organic sales growth, i.e. growth adjusted for foreign exchange and acquisitions/ divestments, will outperform that of its relevant markets.

Photovoltaic Modules get a Charge from New Electrically Conductive Adhesives 

For high reliability applications such as satellite, automotive, medical and telecom products, electrically conductive adhesives are often used as an alternative to traditional solders. Their benefits are many but, for these applications, conductive adhesives deliver low temperature processing, fine-pitch capability and improved thermal cycling resistance.